CN100563931C - 起伏的垫修整器及其使用方法 - Google Patents

起伏的垫修整器及其使用方法 Download PDF

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Publication number
CN100563931C
CN100563931C CNB2005800077197A CN200580007719A CN100563931C CN 100563931 C CN100563931 C CN 100563931C CN B2005800077197 A CNB2005800077197 A CN B2005800077197A CN 200580007719 A CN200580007719 A CN 200580007719A CN 100563931 C CN100563931 C CN 100563931C
Authority
CN
China
Prior art keywords
disk
undulating
dresser
abrasive
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005800077197A
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English (en)
Chinese (zh)
Other versions
CN1929956A (zh
Inventor
加里·M·帕尔姆格伦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN1929956A publication Critical patent/CN1929956A/zh
Application granted granted Critical
Publication of CN100563931C publication Critical patent/CN100563931C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/07—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08—Circular back-plates for carrying flexible material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Secondary Cells (AREA)
  • Branch Pipes, Bends, And The Like (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
CNB2005800077197A 2004-03-09 2005-01-25 起伏的垫修整器及其使用方法 Expired - Fee Related CN100563931C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/797,892 2004-03-09
US10/797,892 US6951509B1 (en) 2004-03-09 2004-03-09 Undulated pad conditioner and method of using same

Publications (2)

Publication Number Publication Date
CN1929956A CN1929956A (zh) 2007-03-14
CN100563931C true CN100563931C (zh) 2009-12-02

Family

ID=34920155

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800077197A Expired - Fee Related CN100563931C (zh) 2004-03-09 2005-01-25 起伏的垫修整器及其使用方法

Country Status (10)

Country Link
US (1) US6951509B1 (https=)
EP (1) EP1722926B1 (https=)
JP (1) JP4885838B2 (https=)
KR (1) KR101127256B1 (https=)
CN (1) CN100563931C (https=)
AT (1) ATE439944T1 (https=)
DE (1) DE602005016086D1 (https=)
MY (1) MY135136A (https=)
TW (1) TWI358743B (https=)
WO (1) WO2005095059A1 (https=)

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US7744447B2 (en) * 2005-03-16 2010-06-29 Goei, Co., Ltd. Abrasive disc
TWI290337B (en) * 2005-08-09 2007-11-21 Princo Corp Pad conditioner for conditioning a CMP pad and method of making the same
JP4791121B2 (ja) * 2005-09-22 2011-10-12 新日鉄マテリアルズ株式会社 研磨布用ドレッサー
WO2007043263A1 (ja) * 2005-10-14 2007-04-19 Asahi Glass Company, Limited 研磨パッド用ツルーイング部材及び研磨パッドのツルーイング方法
WO2009158507A2 (en) * 2008-06-26 2009-12-30 Saint-Gobain Abrasives, Inc. Chemical mechanical planarization pad conditioner and method of forming
TW201016387A (en) * 2008-10-22 2010-05-01 jian-min Song CMP Pad Dressers with Hybridized abrasive surface and related methods
US8628597B2 (en) 2009-06-25 2014-01-14 3M Innovative Properties Company Method of sorting abrasive particles, abrasive particle distributions, and abrasive articles including the same
WO2017110156A1 (ja) * 2015-12-25 2017-06-29 ニューレジストン株式会社 研削装置および当該研削装置用の研削具
CN106078517A (zh) * 2016-08-03 2016-11-09 咏巨科技有限公司 一种抛光垫修整装置
US10471567B2 (en) * 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
CN106733792A (zh) * 2016-12-12 2017-05-31 北京中电科电子装备有限公司 一种用于半导体磨削台的清洁装置
JP7232763B2 (ja) * 2016-12-21 2023-03-03 スリーエム イノベイティブ プロパティズ カンパニー スペーサ及びウェハ平坦化システムを有するパッドコンディショナ
WO2019102331A1 (en) * 2017-11-21 2019-05-31 3M Innovative Properties Company Coated abrasive disc and methods of making and using the same
US20200094375A1 (en) * 2018-09-26 2020-03-26 Cana Diamond Technology, LLC Multiple zone pad conditioning disk
US12325106B2 (en) * 2018-10-31 2025-06-10 Taiwan Semiconductor Manufacturing Company, Ltd. Device for conditioning chemical mechanical polishing
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
GB2590511B (en) * 2019-11-20 2023-10-25 Best Engineered Surface Tech Llc Hybrid CMP conditioning head
CN116749080B (zh) * 2023-08-18 2023-11-14 浙江求是半导体设备有限公司 修整方法
CN117863092A (zh) * 2024-02-01 2024-04-12 杭州萧山昌宇五金机械有限公司 一种合金齿磨轮及其制造工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2990661A (en) * 1958-07-10 1961-07-04 Donald P Hackett Backing disk for abrasive sheet
FR1596322A (https=) * 1968-01-05 1970-06-15
US6093280A (en) * 1997-08-18 2000-07-25 Lsi Logic Corporation Chemical-mechanical polishing pad conditioning systems
CN1351922A (zh) * 2000-11-07 2002-06-05 中国砂轮企业股份有限公司 化学－机械抛光软垫的修磨器及其制造方法
CN1447735A (zh) * 2000-08-14 2003-10-08 3M创新有限公司 用于化学机械抛光的研磨垫

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US3110140A (en) 1961-01-03 1963-11-12 Helen M Jacox Backing plate for abrasive disks
US4652275A (en) 1985-08-07 1987-03-24 Minnesota Mining And Manufacturing Company Erodable agglomerates and abrasive products containing the same
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US5014468A (en) 1989-05-05 1991-05-14 Norton Company Patterned coated abrasive for fine surface finishing
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US5549962A (en) 1993-06-30 1996-08-27 Minnesota Mining And Manufacturing Company Precisely shaped particles and method of making the same
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JP3036348B2 (ja) 1994-03-23 2000-04-24 三菱マテリアル株式会社 ウェーハ研磨パッドのツルーイング装置
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US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
KR20010005993A (ko) 1997-04-04 2001-01-15 오브시디안 인코포레이티드 향상된 폴리싱을 위한 폴리싱 미디어 매거진
US6194317B1 (en) 1998-04-30 2001-02-27 3M Innovative Properties Company Method of planarizing the upper surface of a semiconductor wafer
US6200199B1 (en) * 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
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US6263605B1 (en) 1998-12-21 2001-07-24 Motorola, Inc. Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
US20040072518A1 (en) 1999-04-02 2004-04-15 Applied Materials, Inc. Platen with patterned surface for chemical mechanical polishing
US20040053566A1 (en) 2001-01-12 2004-03-18 Applied Materials, Inc. CMP platen with patterned surface
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US20020127957A1 (en) * 2000-12-20 2002-09-12 Shipley Kevin D. Chemical mechanical polish pad conditioning device
US6612917B2 (en) 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2990661A (en) * 1958-07-10 1961-07-04 Donald P Hackett Backing disk for abrasive sheet
FR1596322A (https=) * 1968-01-05 1970-06-15
US6093280A (en) * 1997-08-18 2000-07-25 Lsi Logic Corporation Chemical-mechanical polishing pad conditioning systems
CN1447735A (zh) * 2000-08-14 2003-10-08 3M创新有限公司 用于化学机械抛光的研磨垫
CN1351922A (zh) * 2000-11-07 2002-06-05 中国砂轮企业股份有限公司 化学－机械抛光软垫的修磨器及其制造方法

Also Published As

Publication number Publication date
EP1722926A1 (en) 2006-11-22
WO2005095059A1 (en) 2005-10-13
EP1722926B1 (en) 2009-08-19
US6951509B1 (en) 2005-10-04
JP4885838B2 (ja) 2012-02-29
TWI358743B (en) 2012-02-21
JP2007528300A (ja) 2007-10-11
CN1929956A (zh) 2007-03-14
DE602005016086D1 (de) 2009-10-01
ATE439944T1 (de) 2009-09-15
US20050202760A1 (en) 2005-09-15
TW200539256A (en) 2005-12-01
MY135136A (en) 2008-02-29
KR101127256B1 (ko) 2012-03-29
KR20060132717A (ko) 2006-12-21

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091202

Termination date: 20200125