DE602005016086D1 - Gewellte kissenaufbereitungsvorrichtung und verwendungsverfahren dafür - Google Patents
Gewellte kissenaufbereitungsvorrichtung und verwendungsverfahren dafürInfo
- Publication number
- DE602005016086D1 DE602005016086D1 DE602005016086T DE602005016086T DE602005016086D1 DE 602005016086 D1 DE602005016086 D1 DE 602005016086D1 DE 602005016086 T DE602005016086 T DE 602005016086T DE 602005016086 T DE602005016086 T DE 602005016086T DE 602005016086 D1 DE602005016086 D1 DE 602005016086D1
- Authority
- DE
- Germany
- Prior art keywords
- pincushion
- corrugated
- processing device
- disk
- use therefor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
- B24B53/07—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
- B24D9/08—Circular back-plates for carrying flexible material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Secondary Cells (AREA)
- Branch Pipes, Bends, And The Like (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/797,892 US6951509B1 (en) | 2004-03-09 | 2004-03-09 | Undulated pad conditioner and method of using same |
PCT/US2005/002310 WO2005095059A1 (en) | 2004-03-09 | 2005-01-25 | Undulated pad conditioner and method of using same |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005016086D1 true DE602005016086D1 (de) | 2009-10-01 |
Family
ID=34920155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005016086T Active DE602005016086D1 (de) | 2004-03-09 | 2005-01-25 | Gewellte kissenaufbereitungsvorrichtung und verwendungsverfahren dafür |
Country Status (10)
Country | Link |
---|---|
US (1) | US6951509B1 (de) |
EP (1) | EP1722926B1 (de) |
JP (1) | JP4885838B2 (de) |
KR (1) | KR101127256B1 (de) |
CN (1) | CN100563931C (de) |
AT (1) | ATE439944T1 (de) |
DE (1) | DE602005016086D1 (de) |
MY (1) | MY135136A (de) |
TW (1) | TWI358743B (de) |
WO (1) | WO2005095059A1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7744447B2 (en) * | 2005-03-16 | 2010-06-29 | Goei, Co., Ltd. | Abrasive disc |
TWI290337B (en) * | 2005-08-09 | 2007-11-21 | Princo Corp | Pad conditioner for conditioning a CMP pad and method of making the same |
JP4791121B2 (ja) * | 2005-09-22 | 2011-10-12 | 新日鉄マテリアルズ株式会社 | 研磨布用ドレッサー |
WO2007043263A1 (ja) * | 2005-10-14 | 2007-04-19 | Asahi Glass Company, Limited | 研磨パッド用ツルーイング部材及び研磨パッドのツルーイング方法 |
US8795035B2 (en) | 2008-06-26 | 2014-08-05 | Saint-Gobain Abrasives, Inc. | Chemical mechanical planarization pad conditioner and method of forming |
TW201016387A (en) * | 2008-10-22 | 2010-05-01 | jian-min Song | CMP Pad Dressers with Hybridized abrasive surface and related methods |
US8628597B2 (en) * | 2009-06-25 | 2014-01-14 | 3M Innovative Properties Company | Method of sorting abrasive particles, abrasive particle distributions, and abrasive articles including the same |
KR20180098559A (ko) * | 2015-12-25 | 2018-09-04 | 뉴 레지스톤 가부시키가이샤 | 연삭 장치 및 연삭 장치용 연삭구 |
CN106078517A (zh) * | 2016-08-03 | 2016-11-09 | 咏巨科技有限公司 | 一种抛光垫修整装置 |
US10471567B2 (en) * | 2016-09-15 | 2019-11-12 | Entegris, Inc. | CMP pad conditioning assembly |
CN106733792A (zh) * | 2016-12-12 | 2017-05-31 | 北京中电科电子装备有限公司 | 一种用于半导体磨削台的清洁装置 |
JP7232763B2 (ja) * | 2016-12-21 | 2023-03-03 | スリーエム イノベイティブ プロパティズ カンパニー | スペーサ及びウェハ平坦化システムを有するパッドコンディショナ |
EP3713712B1 (de) * | 2017-11-21 | 2023-05-31 | 3M Innovative Properties Company | Beschichtete schleifscheibe und verfahren zur herstellung und verwendung davon |
US20200094375A1 (en) * | 2018-09-26 | 2020-03-26 | Cana Diamond Technology, LLC | Multiple zone pad conditioning disk |
US11331767B2 (en) | 2019-02-01 | 2022-05-17 | Micron Technology, Inc. | Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods |
CN116749080B (zh) * | 2023-08-18 | 2023-11-14 | 浙江求是半导体设备有限公司 | 修整方法 |
Family Cites Families (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US907862A (en) | 1905-02-18 | 1908-12-29 | Henry D Nicholls | Grinding and sharpening machine. |
US2990661A (en) | 1958-07-10 | 1961-07-04 | Donald P Hackett | Backing disk for abrasive sheet |
US3110140A (en) | 1961-01-03 | 1963-11-12 | Helen M Jacox | Backing plate for abrasive disks |
FR1596322A (de) * | 1968-01-05 | 1970-06-15 | ||
US4652275A (en) | 1985-08-07 | 1987-03-24 | Minnesota Mining And Manufacturing Company | Erodable agglomerates and abrasive products containing the same |
US4799939A (en) | 1987-02-26 | 1989-01-24 | Minnesota Mining And Manufacturing Company | Erodable agglomerates and abrasive products containing the same |
US5014468A (en) | 1989-05-05 | 1991-05-14 | Norton Company | Patterned coated abrasive for fine surface finishing |
US5152917B1 (en) | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
US5437754A (en) | 1992-01-13 | 1995-08-01 | Minnesota Mining And Manufacturing Company | Abrasive article having precise lateral spacing between abrasive composite members |
MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US5549962A (en) | 1993-06-30 | 1996-08-27 | Minnesota Mining And Manufacturing Company | Precisely shaped particles and method of making the same |
US5454844A (en) | 1993-10-29 | 1995-10-03 | Minnesota Mining And Manufacturing Company | Abrasive article, a process of making same, and a method of using same to finish a workpiece surface |
US5453312A (en) | 1993-10-29 | 1995-09-26 | Minnesota Mining And Manufacturing Company | Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface |
JP3036348B2 (ja) | 1994-03-23 | 2000-04-24 | 三菱マテリアル株式会社 | ウェーハ研磨パッドのツルーイング装置 |
US5458532A (en) | 1994-01-12 | 1995-10-17 | Cannone; Salvatore L. | Undulating edged pad holder for rotary floor polishers |
US5897424A (en) | 1995-07-10 | 1999-04-27 | The United States Of America As Represented By The Secretary Of Commerce | Renewable polishing lap |
US5958794A (en) | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
US5692950A (en) | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
US6312319B1 (en) | 1997-04-04 | 2001-11-06 | Timothy J. Donohue | Polishing media magazine for improved polishing |
US6194317B1 (en) | 1998-04-30 | 2001-02-27 | 3M Innovative Properties Company | Method of planarizing the upper surface of a semiconductor wafer |
US6093280A (en) * | 1997-08-18 | 2000-07-25 | Lsi Logic Corporation | Chemical-mechanical polishing pad conditioning systems |
US6200199B1 (en) * | 1998-03-31 | 2001-03-13 | Applied Materials, Inc. | Chemical mechanical polishing conditioner |
US6123612A (en) | 1998-04-15 | 2000-09-26 | 3M Innovative Properties Company | Corrosion resistant abrasive article and method of making |
US6190243B1 (en) | 1998-05-07 | 2001-02-20 | Ebara Corporation | Polishing apparatus |
US6203407B1 (en) | 1998-09-03 | 2001-03-20 | Micron Technology, Inc. | Method and apparatus for increasing-chemical-polishing selectivity |
US6093085A (en) | 1998-09-08 | 2000-07-25 | Advanced Micro Devices, Inc. | Apparatuses and methods for polishing semiconductor wafers |
US6263605B1 (en) | 1998-12-21 | 2001-07-24 | Motorola, Inc. | Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor |
US6220942B1 (en) | 1999-04-02 | 2001-04-24 | Applied Materials, Inc. | CMP platen with patterned surface |
US6217426B1 (en) | 1999-04-06 | 2001-04-17 | Applied Materials, Inc. | CMP polishing pad |
US20040053566A1 (en) | 2001-01-12 | 2004-03-18 | Applied Materials, Inc. | CMP platen with patterned surface |
US20040072518A1 (en) | 1999-04-02 | 2004-04-15 | Applied Materials, Inc. | Platen with patterned surface for chemical mechanical polishing |
US20020077037A1 (en) | 1999-05-03 | 2002-06-20 | Tietz James V. | Fixed abrasive articles |
EP1052059A3 (de) | 1999-05-03 | 2001-01-24 | Applied Materials, Inc. | Verfahren zum chemisch-mechanisch Planarisieren |
US6491843B1 (en) | 1999-12-08 | 2002-12-10 | Eastman Kodak Company | Slurry for chemical mechanical polishing silicon dioxide |
US6498101B1 (en) | 2000-02-28 | 2002-12-24 | Micron Technology, Inc. | Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies |
KR100360469B1 (ko) | 2000-05-09 | 2002-11-08 | 삼성전자 주식회사 | 화학기계적 연마장치의 연마패드 컨디셔닝 장치 |
US6520834B1 (en) | 2000-08-09 | 2003-02-18 | Micron Technology, Inc. | Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates |
US6800020B1 (en) | 2000-10-02 | 2004-10-05 | Lam Research Corporation | Web-style pad conditioning system and methods for implementing the same |
US20020072296A1 (en) | 2000-11-29 | 2002-06-13 | Muilenburg Michael J. | Abrasive article having a window system for polishing wafers, and methods |
US20020127957A1 (en) * | 2000-12-20 | 2002-09-12 | Shipley Kevin D. | Chemical mechanical polish pad conditioning device |
US6612917B2 (en) | 2001-02-07 | 2003-09-02 | 3M Innovative Properties Company | Abrasive article suitable for modifying a semiconductor wafer |
US6632129B2 (en) | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
US20020142601A1 (en) | 2001-03-30 | 2002-10-03 | Boyd John M. | Method for planarizing a surface of a semiconductor wafer with a fixed abrasive material |
US6508697B1 (en) * | 2001-07-16 | 2003-01-21 | Robert Lyle Benner | Polishing pad conditioning system |
US6712679B2 (en) | 2001-08-08 | 2004-03-30 | Lam Research Corporation | Platen assembly having a topographically altered platen surface |
US6652708B2 (en) | 2001-12-28 | 2003-11-25 | Lam Research Corporation | Methods and apparatus for conditioning and temperature control of a processing surface |
US7160178B2 (en) | 2003-08-07 | 2007-01-09 | 3M Innovative Properties Company | In situ activation of a three-dimensional fixed abrasive article |
-
2004
- 2004-03-09 US US10/797,892 patent/US6951509B1/en not_active Expired - Lifetime
-
2005
- 2005-01-25 CN CNB2005800077197A patent/CN100563931C/zh not_active Expired - Fee Related
- 2005-01-25 WO PCT/US2005/002310 patent/WO2005095059A1/en active Application Filing
- 2005-01-25 DE DE602005016086T patent/DE602005016086D1/de active Active
- 2005-01-25 AT AT05711980T patent/ATE439944T1/de not_active IP Right Cessation
- 2005-01-25 JP JP2007502804A patent/JP4885838B2/ja not_active Expired - Fee Related
- 2005-01-25 KR KR1020067018362A patent/KR101127256B1/ko active IP Right Grant
- 2005-01-25 EP EP05711980A patent/EP1722926B1/de not_active Not-in-force
- 2005-02-16 TW TW094104503A patent/TWI358743B/zh not_active IP Right Cessation
- 2005-02-21 MY MYPI20050650A patent/MY135136A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP4885838B2 (ja) | 2012-02-29 |
TW200539256A (en) | 2005-12-01 |
JP2007528300A (ja) | 2007-10-11 |
KR20060132717A (ko) | 2006-12-21 |
EP1722926A1 (de) | 2006-11-22 |
CN1929956A (zh) | 2007-03-14 |
WO2005095059A1 (en) | 2005-10-13 |
EP1722926B1 (de) | 2009-08-19 |
CN100563931C (zh) | 2009-12-02 |
KR101127256B1 (ko) | 2012-03-29 |
US6951509B1 (en) | 2005-10-04 |
MY135136A (en) | 2008-02-29 |
TWI358743B (en) | 2012-02-21 |
ATE439944T1 (de) | 2009-09-15 |
US20050202760A1 (en) | 2005-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |