MY146813A - Method of manufacturing a substrate for a mask blank, method of manufacturing a mask blank, and method of manufacturing a mask - Google Patents

Method of manufacturing a substrate for a mask blank, method of manufacturing a mask blank, and method of manufacturing a mask

Info

Publication number
MY146813A
MY146813A MYPI20063535A MYPI20063535A MY146813A MY 146813 A MY146813 A MY 146813A MY PI20063535 A MYPI20063535 A MY PI20063535A MY PI20063535 A MYPI20063535 A MY PI20063535A MY 146813 A MY146813 A MY 146813A
Authority
MY
Malaysia
Prior art keywords
substrate
mask blank
manufacturing
abrasive cloth
mask
Prior art date
Application number
MYPI20063535A
Inventor
Hiroyuki Akagawa
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of MY146813A publication Critical patent/MY146813A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Optical Filters (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

TO IMPROVE A POLISHING PROCESS SO AS TO DECREASE A HIGH POLISH RESISTANCE AT THE TIME OF POLISHING A LARGE-SIZED SUBSTRATE (4), ENABLING TO EFFICIENTLY POLISH THE SAME UNDER A HIGHER LOAD. A METHOD OF MANUFACTURING A SUBSTRATE (4) FOR A MASK BLANK INCLUDING A PROCESS OF MOVING A SURFACE PLATE (1) APPLIED WITH AN ABRASIVE CLOTH (2) AND THE SUBSTRATE (4) FOR A MASK BLANK, RELATIVELY EACH OTHER IN A CONDITION THAT A PREDETERMINED LOAD IS APPLIED THERETO WHILE PROVIDING POLISHING FLUID (11) BETWEEN CONTACT SURFACES OF THE ABRASIVE CLOTH (2) AND THE SUBSTRATE (4) FOR A MASK BLANK TO POLISH THE SUBSTRATE (4) FOR A MASK BLANK. IN THE SURFACE PLATE (1) APPLIED WITH THE ABRASIVE CLOTH (2), GROOVES (1A) ARE FORMED ON A SURFACE WHERE AN ABRASIVE CLOTH (2) IS TO BE APPLIED AND EACH OF THE GROOVES (1A) IS SHAPED IN A PREDETERMINED SHAPE AT LEAST AT A PERIPHERAL EDGE OF AN OPENING THEREOF IN A CROSS SECTION. THE ABRASIVE CLOTH (2) IS APPLIED ALONG A FLAT SURFACE (1B) TO BE APPLIED WITH THE ABRASIVE CLOTH, AND A CONFIGURATION OF THE GROOVES (1A). UNDER THE CIRCUMSTANCES, THE SUBSTRATE (4) IS POLISHED.
MYPI20063535A 2005-07-25 2006-07-25 Method of manufacturing a substrate for a mask blank, method of manufacturing a mask blank, and method of manufacturing a mask MY146813A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005214220 2005-07-25

Publications (1)

Publication Number Publication Date
MY146813A true MY146813A (en) 2012-09-28

Family

ID=38013044

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20063535A MY146813A (en) 2005-07-25 2006-07-25 Method of manufacturing a substrate for a mask blank, method of manufacturing a mask blank, and method of manufacturing a mask

Country Status (4)

Country Link
JP (1) JP5429824B2 (en)
KR (1) KR101334012B1 (en)
MY (1) MY146813A (en)
TW (1) TWI413573B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101681344B1 (en) * 2009-02-13 2016-11-30 호야 가부시키가이샤 Photomask blank and fabrication method therefor, and photomask and fabrication method therefor
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
CN113178386A (en) * 2021-04-22 2021-07-27 上海新昇半导体科技有限公司 Chemical mechanical polishing method
CN115805523A (en) * 2022-12-29 2023-03-17 西安奕斯伟材料科技有限公司 Fixed plate, polishing device and polishing method

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4178403A (en) * 1977-08-04 1979-12-11 Konishiroku Photo Industry Co., Ltd. Mask blank and mask
DE69511068T2 (en) 1994-02-22 2000-04-06 Minnesota Mining And Mfg. Co. ABRASIVE ARTICLE, METHOD FOR PRODUCING THE SAME, AND METHOD FOR APPLYING THE SAME IN FINISHING
US5942356A (en) * 1996-03-30 1999-08-24 Hoya Corporation Phase shift mask and phase shift mask blank
JPH09277163A (en) * 1996-04-16 1997-10-28 Sony Corp Polishing method and polishing device
US5876268A (en) * 1997-01-03 1999-03-02 Minnesota Mining And Manufacturing Company Method and article for the production of optical quality surfaces on glass
EP0964772A1 (en) * 1997-03-07 1999-12-22 Minnesota Mining And Manufacturing Company Abrasive article for providing a clear surface finish on glass
JPH11267961A (en) * 1998-03-23 1999-10-05 Sony Corp Abrasive pad, polishing device and polishing method
KR100322537B1 (en) * 1999-07-02 2002-03-25 윤종용 Blank mask and method for fabricating using the same
JP2001018163A (en) * 1999-07-06 2001-01-23 Speedfam Co Ltd Polishing pad
US6251549B1 (en) * 1999-07-19 2001-06-26 Marc David Levenson Generic phase shift mask
EP1077108B1 (en) * 1999-08-18 2006-12-20 Ebara Corporation Polishing method and polishing apparatus
AU2001247171A1 (en) * 2000-02-23 2001-09-03 Nutool, Inc. Pad designs and structures with improved fluid distribution
JP2002254297A (en) * 2001-02-28 2002-09-10 Toyoda Mach Works Ltd Lapping surface plate with spiral groove
DE10303407A1 (en) * 2003-01-27 2004-08-19 Friedrich-Schiller-Universität Jena Method and device for high-precision processing of the surface of an object, in particular for polishing and lapping semiconductor substrates
JP4219718B2 (en) * 2003-03-28 2009-02-04 Ｈｏｙａ株式会社 Manufacturing method of glass substrate for EUV mask blanks and manufacturing method of EUV mask blanks
JP4481688B2 (en) * 2003-04-10 2010-06-16 Ｈｏｙａ株式会社 Substrate processing apparatus, coating apparatus, coating method, and photomask manufacturing method
JP2005066781A (en) * 2003-08-26 2005-03-17 Hoya Corp Manufacturing method for glass substrate for electronic device, manufacturing method for mask blank, and manufacturing method for transfer mask
US7018274B2 (en) * 2003-11-13 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc Polishing pad having slurry utilization enhancing grooves

Also Published As

Publication number Publication date
KR20070013212A (en) 2007-01-30
TWI413573B (en) 2013-11-01
KR101334012B1 (en) 2013-12-02
JP2011240482A (en) 2011-12-01
JP5429824B2 (en) 2014-02-26
TW200714411A (en) 2007-04-16

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