AU2001247171A1 - Pad designs and structures with improved fluid distribution - Google Patents

Pad designs and structures with improved fluid distribution

Info

Publication number
AU2001247171A1
AU2001247171A1 AU2001247171A AU4717101A AU2001247171A1 AU 2001247171 A1 AU2001247171 A1 AU 2001247171A1 AU 2001247171 A AU2001247171 A AU 2001247171A AU 4717101 A AU4717101 A AU 4717101A AU 2001247171 A1 AU2001247171 A1 AU 2001247171A1
Authority
AU
Australia
Prior art keywords
structures
fluid distribution
improved fluid
pad designs
designs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001247171A
Inventor
Bulent Basol
Paul Lindquist
Homayoun Talieh
Cyprian Uzoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Nutool Inc
Original Assignee
ASM Nutool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/511,278 external-priority patent/US6413388B1/en
Application filed by ASM Nutool Inc filed Critical ASM Nutool Inc
Publication of AU2001247171A1 publication Critical patent/AU2001247171A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
AU2001247171A 2000-02-23 2000-12-13 Pad designs and structures with improved fluid distribution Abandoned AU2001247171A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/511,278 US6413388B1 (en) 2000-02-23 2000-02-23 Pad designs and structures for a versatile materials processing apparatus
US09511278 2000-02-23
US09621969 2000-07-21
US09/621,969 US6413403B1 (en) 2000-02-23 2000-07-21 Method and apparatus employing pad designs and structures with improved fluid distribution
PCT/US2000/042770 WO2001063019A1 (en) 2000-02-23 2000-12-13 Pad designs and structures with improved fluid distribution

Publications (1)

Publication Number Publication Date
AU2001247171A1 true AU2001247171A1 (en) 2001-09-03

Family

ID=27057174

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001247171A Abandoned AU2001247171A1 (en) 2000-02-23 2000-12-13 Pad designs and structures with improved fluid distribution

Country Status (3)

Country Link
AU (1) AU2001247171A1 (en)
TW (1) TW575691B (en)
WO (1) WO2001063019A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101334012B1 (en) * 2005-07-25 2013-12-02 호야 가부시키가이샤 Manufacturing method of substrate for mask blank, and manufacturing method of mask blank and mask
CN103692035B (en) * 2013-12-19 2016-01-20 华南理工大学 A kind of device thread metal material being carried out to electric discharge processing
CN105350040B (en) * 2015-10-19 2018-02-06 大连海事大学 A kind of high metallic surface finish preparation method based on brush nickel plating polishing combination process

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5486282A (en) * 1994-11-30 1996-01-23 Ibm Corporation Electroetching process for seed layer removal in electrochemical fabrication of wafers
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
US6066030A (en) * 1999-03-04 2000-05-23 International Business Machines Corporation Electroetch and chemical mechanical polishing equipment

Also Published As

Publication number Publication date
TW575691B (en) 2004-02-11
WO2001063019A1 (en) 2001-08-30

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