JP2007528300A5 - - Google Patents

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Publication number
JP2007528300A5
JP2007528300A5 JP2007502804A JP2007502804A JP2007528300A5 JP 2007528300 A5 JP2007528300 A5 JP 2007528300A5 JP 2007502804 A JP2007502804 A JP 2007502804A JP 2007502804 A JP2007502804 A JP 2007502804A JP 2007528300 A5 JP2007528300 A5 JP 2007528300A5
Authority
JP
Japan
Prior art keywords
corrugated
pad
abrasive
disk
patterned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007502804A
Other languages
English (en)
Japanese (ja)
Other versions
JP4885838B2 (ja
JP2007528300A (ja
Filing date
Publication date
Priority claimed from US10/797,892 external-priority patent/US6951509B1/en
Application filed filed Critical
Publication of JP2007528300A publication Critical patent/JP2007528300A/ja
Publication of JP2007528300A5 publication Critical patent/JP2007528300A5/ja
Application granted granted Critical
Publication of JP4885838B2 publication Critical patent/JP4885838B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2007502804A 2004-03-09 2005-01-25 波形パッドコンディショナーおよびその使用方法 Expired - Fee Related JP4885838B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/797,892 2004-03-09
US10/797,892 US6951509B1 (en) 2004-03-09 2004-03-09 Undulated pad conditioner and method of using same
PCT/US2005/002310 WO2005095059A1 (en) 2004-03-09 2005-01-25 Undulated pad conditioner and method of using same

Publications (3)

Publication Number Publication Date
JP2007528300A JP2007528300A (ja) 2007-10-11
JP2007528300A5 true JP2007528300A5 (https=) 2008-03-13
JP4885838B2 JP4885838B2 (ja) 2012-02-29

Family

ID=34920155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007502804A Expired - Fee Related JP4885838B2 (ja) 2004-03-09 2005-01-25 波形パッドコンディショナーおよびその使用方法

Country Status (10)

Country Link
US (1) US6951509B1 (https=)
EP (1) EP1722926B1 (https=)
JP (1) JP4885838B2 (https=)
KR (1) KR101127256B1 (https=)
CN (1) CN100563931C (https=)
AT (1) ATE439944T1 (https=)
DE (1) DE602005016086D1 (https=)
MY (1) MY135136A (https=)
TW (1) TWI358743B (https=)
WO (1) WO2005095059A1 (https=)

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US7744447B2 (en) * 2005-03-16 2010-06-29 Goei, Co., Ltd. Abrasive disc
TWI290337B (en) * 2005-08-09 2007-11-21 Princo Corp Pad conditioner for conditioning a CMP pad and method of making the same
JP4791121B2 (ja) * 2005-09-22 2011-10-12 新日鉄マテリアルズ株式会社 研磨布用ドレッサー
WO2007043263A1 (ja) * 2005-10-14 2007-04-19 Asahi Glass Company, Limited 研磨パッド用ツルーイング部材及び研磨パッドのツルーイング方法
WO2009158507A2 (en) * 2008-06-26 2009-12-30 Saint-Gobain Abrasives, Inc. Chemical mechanical planarization pad conditioner and method of forming
TW201016387A (en) * 2008-10-22 2010-05-01 jian-min Song CMP Pad Dressers with Hybridized abrasive surface and related methods
US8628597B2 (en) 2009-06-25 2014-01-14 3M Innovative Properties Company Method of sorting abrasive particles, abrasive particle distributions, and abrasive articles including the same
WO2017110156A1 (ja) * 2015-12-25 2017-06-29 ニューレジストン株式会社 研削装置および当該研削装置用の研削具
CN106078517A (zh) * 2016-08-03 2016-11-09 咏巨科技有限公司 一种抛光垫修整装置
US10471567B2 (en) * 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
CN106733792A (zh) * 2016-12-12 2017-05-31 北京中电科电子装备有限公司 一种用于半导体磨削台的清洁装置
JP7232763B2 (ja) * 2016-12-21 2023-03-03 スリーエム イノベイティブ プロパティズ カンパニー スペーサ及びウェハ平坦化システムを有するパッドコンディショナ
WO2019102331A1 (en) * 2017-11-21 2019-05-31 3M Innovative Properties Company Coated abrasive disc and methods of making and using the same
US20200094375A1 (en) * 2018-09-26 2020-03-26 Cana Diamond Technology, LLC Multiple zone pad conditioning disk
US12325106B2 (en) * 2018-10-31 2025-06-10 Taiwan Semiconductor Manufacturing Company, Ltd. Device for conditioning chemical mechanical polishing
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
GB2590511B (en) * 2019-11-20 2023-10-25 Best Engineered Surface Tech Llc Hybrid CMP conditioning head
CN116749080B (zh) * 2023-08-18 2023-11-14 浙江求是半导体设备有限公司 修整方法
CN117863092A (zh) * 2024-02-01 2024-04-12 杭州萧山昌宇五金机械有限公司 一种合金齿磨轮及其制造工艺

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JP2002057130A (ja) * 2000-08-14 2002-02-22 Three M Innovative Properties Co Ｃｍｐ用研磨パッド
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CN100344410C (zh) * 2000-11-07 2007-10-24 中国砂轮企业股份有限公司 化学－机械抛光软垫的修磨器及其制造方法
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