JP2009502532A5 - - Google Patents

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Publication number
JP2009502532A5
JP2009502532A5 JP2008523964A JP2008523964A JP2009502532A5 JP 2009502532 A5 JP2009502532 A5 JP 2009502532A5 JP 2008523964 A JP2008523964 A JP 2008523964A JP 2008523964 A JP2008523964 A JP 2008523964A JP 2009502532 A5 JP2009502532 A5 JP 2009502532A5
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JP
Japan
Prior art keywords
hardness
workpiece
abrasive
composite
providing
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JP2008523964A
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English (en)
Japanese (ja)
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JP5620639B2 (ja
JP2009502532A (ja
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Priority claimed from US11/191,711 external-priority patent/US7494519B2/en
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Publication of JP2009502532A publication Critical patent/JP2009502532A/ja
Publication of JP2009502532A5 publication Critical patent/JP2009502532A5/ja
Application granted granted Critical
Publication of JP5620639B2 publication Critical patent/JP5620639B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008523964A 2005-07-28 2006-07-19 研磨材粒塊で研磨する方法 Expired - Fee Related JP5620639B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/191,711 US7494519B2 (en) 2005-07-28 2005-07-28 Abrasive agglomerate polishing method
US11/191,711 2005-07-28
PCT/US2006/028061 WO2007015909A1 (en) 2005-07-28 2006-07-19 Abrasive agglomerate polishing method

Publications (3)

Publication Number Publication Date
JP2009502532A JP2009502532A (ja) 2009-01-29
JP2009502532A5 true JP2009502532A5 (https=) 2009-09-03
JP5620639B2 JP5620639B2 (ja) 2014-11-05

Family

ID=37401245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008523964A Expired - Fee Related JP5620639B2 (ja) 2005-07-28 2006-07-19 研磨材粒塊で研磨する方法

Country Status (9)

Country Link
US (1) US7494519B2 (https=)
EP (1) EP1910025B1 (https=)
JP (1) JP5620639B2 (https=)
KR (1) KR101299272B1 (https=)
CN (1) CN101232969B (https=)
AT (1) ATE496729T1 (https=)
DE (1) DE602006019876D1 (https=)
TW (1) TWI402136B (https=)
WO (1) WO2007015909A1 (https=)

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EP3049215B1 (en) 2013-09-25 2021-04-14 3M Innovative Properties Company Composite ceramic abrasive polishing solution
BR112016010724B1 (pt) 2013-11-12 2021-11-16 3M Innovative Properties Company Artigo abrasivo estruturado
JP6561058B2 (ja) 2013-12-09 2019-08-14 スリーエム イノベイティブ プロパティズ カンパニー 集塊性研磨粒子、その粒子を含む研磨物品、及びその製造方法
CN106376234B (zh) 2014-05-02 2019-11-05 3M创新有限公司 间断的结构化磨料制品以及抛光工件的方法
US9149904B1 (en) 2014-06-13 2015-10-06 Seagate Technology Llc Platen for wafer polishing having diamond-ceramic composites
RU2017103686A (ru) * 2014-08-01 2018-09-04 3М Инновейтив Пропертиз Компани Растворы для полировки и способы их применения
US10086500B2 (en) * 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
CN105140155B (zh) * 2015-07-15 2018-06-05 桂林电子科技大学 一种用于GaAs MMIC减薄工艺的粘片方法
EP3192844B1 (en) * 2016-01-12 2021-02-24 Eoswiss Engineering Sarl Method and device for chemical mechanical polishing
EP3408342B1 (en) 2016-01-25 2024-03-06 CMC Materials LLC Polishing composition comprising cationic polymer additive
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
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WO2020075005A1 (en) * 2018-10-11 2020-04-16 3M Innovative Properties Company Supported abrasive particles, abrasive articles, and methods of making the same
JP7435436B2 (ja) * 2020-12-24 2024-02-21 株式会社Sumco キャリアプレートの研磨方法
CN113549424B (zh) * 2021-08-04 2022-05-13 白鸽磨料磨具有限公司 一种抛光用氧化铈团簇粉及其制备方法
US20250282021A1 (en) * 2024-03-07 2025-09-11 Wolfspeed, Inc. Disc Grinding for Semiconductor Wafers on Polishing System

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