JP4880478B2 - 弾性表面波センサアセンブリ - Google Patents

弾性表面波センサアセンブリ Download PDF

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Publication number
JP4880478B2
JP4880478B2 JP2006547194A JP2006547194A JP4880478B2 JP 4880478 B2 JP4880478 B2 JP 4880478B2 JP 2006547194 A JP2006547194 A JP 2006547194A JP 2006547194 A JP2006547194 A JP 2006547194A JP 4880478 B2 JP4880478 B2 JP 4880478B2
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JP
Japan
Prior art keywords
saw sensor
sensor
circuit layer
saw
conductive elastomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006547194A
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English (en)
Japanese (ja)
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JP2007520698A5 (https=
JP2007520698A (ja
Inventor
ジェイ． カーター，チャド
フリー，エム．ベントン
エス． ホイジンガ，ジョン
ピー． ジョンストン，レイモンド
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
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Publication of JP2007520698A publication Critical patent/JP2007520698A/ja
Publication of JP2007520698A5 publication Critical patent/JP2007520698A5/ja
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Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02—Analysing fluids
    • G01N29/022—Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/222—Constructional or flow details for analysing fluids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2462—Probes with waveguides, e.g. SAW devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/021—Gases
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/022—Liquids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/025—Change of phase or condition
    • G01N2291/0255—(Bio)chemical reactions, e.g. on biosensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/025—Change of phase or condition
    • G01N2291/0256—Adsorption, desorption, surface mass change, e.g. on biosensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/042—Wave modes
    • G01N2291/0423—Surface waves, e.g. Rayleigh waves, Love waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
JP2006547194A 2003-12-30 2004-12-17 弾性表面波センサアセンブリ Expired - Fee Related JP4880478B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US53317603P 2003-12-30 2003-12-30
US60/533,176 2003-12-30
PCT/US2004/042663 WO2005066621A1 (en) 2003-12-30 2004-12-17 Surface acoustic wave sensor assemblies

Publications (3)

Publication Number Publication Date
JP2007520698A JP2007520698A (ja) 2007-07-26
JP2007520698A5 JP2007520698A5 (https=) 2008-01-24
JP4880478B2 true JP4880478B2 (ja) 2012-02-22

Family

ID=34748865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006547194A Expired - Fee Related JP4880478B2 (ja) 2003-12-30 2004-12-17 弾性表面波センサアセンブリ

Country Status (7)

Country Link
US (1) US20090115004A1 (https=)
EP (1) EP1700108A1 (https=)
JP (1) JP4880478B2 (https=)
CN (1) CN100567976C (https=)
AU (1) AU2004312835A1 (https=)
CA (1) CA2551836A1 (https=)
WO (1) WO2005066621A1 (https=)

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KR20060127936A (ko) 2003-12-30 2006-12-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 표면 탄성파 센서를 통한 전파 속도 추정
CA2551957A1 (en) * 2003-12-30 2005-08-18 3M Innovative Properties Company Acousto-mechanical detection systems and methods of use
DE102006015512B4 (de) * 2006-03-31 2010-01-21 Andreas Hettich Gmbh & Co. Kg Vorrichtung aus einer Messkammer und einem über einen Schnellverschluss in die Messkammer integrierbaren Resonator für die Flüssigkeitssensorik
EP2100130A1 (en) * 2006-12-29 2009-09-16 3M Innovative Properties Company Method of detection of bioanalytes by acousto-mechanical detection systems comprising the addition of liposomes
WO2008120511A1 (ja) 2007-03-29 2008-10-09 Murata Manufacturing Co., Ltd. 液中物質検出センサー
JP4524700B2 (ja) * 2007-11-26 2010-08-18 ソニー株式会社 スピーカ装置およびスピーカ駆動方法
DE102008028404B4 (de) * 2008-06-17 2013-07-18 Saw Instruments Gmbh Kartusche mit integriertem SAW Sensor
CN101634643B (zh) * 2008-07-24 2011-11-09 鸿富锦精密工业（深圳）有限公司 表面声波感测器
JP5730396B2 (ja) * 2011-07-28 2015-06-10 京セラ株式会社 バイオセンサ
US10037382B2 (en) * 2012-10-29 2018-07-31 Kyocera Corporation Surface acoustic wave sensor
JP5973595B2 (ja) * 2013-01-30 2016-08-23 京セラ株式会社 センサ装置
FR3002638A1 (fr) * 2013-02-25 2014-08-29 Bigot Jerome Le Detecteur de gaz et procede de fabrication associe
FR3002637A1 (fr) * 2013-02-25 2014-08-29 Bigot Jerome Le Detecteur de gaz et procede de fabrication associe
EP3203225B1 (en) * 2014-09-30 2020-11-25 Kyocera Corporation Sensor device
US11207683B2 (en) * 2016-08-02 2021-12-28 Imec Vzw Method and arrangement for focusing objects in a flow
MX2020000094A (es) * 2017-07-07 2020-08-06 Aviana Molecular Tech Llc Sensores de ondas acústicas superficiales multiplexantes con codificación de línea de retardo.
RU188186U1 (ru) * 2018-12-07 2019-04-02 федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский ядерный университет МИФИ" (НИЯУ МИФИ) Пьезорезонансный сорбционный сенсор концентрации веществ
TWI754247B (zh) * 2020-03-20 2022-02-01 義守大學 氣體感應器的製造方法
CN112054270B (zh) * 2020-07-27 2022-06-10 中国电子科技集团公司第十三研究所 波导接口组件互联结构
AU2024250144A1 (en) * 2023-04-05 2025-11-20 Aviana Molecular Technologies, Llc Systems integration of a surface acoustic wave biosensor for point-of-care-diagnostic use

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