CA2551836A1 - Surface acoustic wave sensor assemblies - Google Patents

Surface acoustic wave sensor assemblies Download PDF

Info

Publication number
CA2551836A1
CA2551836A1 CA002551836A CA2551836A CA2551836A1 CA 2551836 A1 CA2551836 A1 CA 2551836A1 CA 002551836 A CA002551836 A CA 002551836A CA 2551836 A CA2551836 A CA 2551836A CA 2551836 A1 CA2551836 A1 CA 2551836A1
Authority
CA
Canada
Prior art keywords
acoustic wave
surface acoustic
sensor
circuit layer
axis conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002551836A
Other languages
English (en)
French (fr)
Inventor
Chad J. Carter
M. Benton Free
John S. Huizinga
Raymond P. Johnston
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2551836A1 publication Critical patent/CA2551836A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02Analysing fluids
    • G01N29/022Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/222Constructional or flow details for analysing fluids
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • G01N29/2462Probes with waveguides, e.g. SAW devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00Subject matter not provided for in other groups of this subclass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/02Indexing codes associated with the analysed material
    • G01N2291/021Gases
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/02Indexing codes associated with the analysed material
    • G01N2291/022Liquids
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/02Indexing codes associated with the analysed material
    • G01N2291/025Change of phase or condition
    • G01N2291/0255(Bio)chemical reactions, e.g. on biosensors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/02Indexing codes associated with the analysed material
    • G01N2291/025Change of phase or condition
    • G01N2291/0256Adsorption, desorption, surface mass change, e.g. on biosensors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/04Wave modes and trajectories
    • G01N2291/042Wave modes
    • G01N2291/0423Surface waves, e.g. Rayleigh waves, Love waves
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0302Properties and characteristics in general
    • H05K2201/0314Elastomeric connector or conductor, e.g. rubber with metallic filler
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09072Hole or recess under component or special relationship between hole and component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10083Electromechanical or electro-acoustic component, e.g. microphone
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147Sealing or impregnating, e.g. of pores

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
CA002551836A 2003-12-30 2004-12-17 Surface acoustic wave sensor assemblies Abandoned CA2551836A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US53317603P 2003-12-30 2003-12-30
US60/533,176 2003-12-30
PCT/US2004/042663 WO2005066621A1 (en) 2003-12-30 2004-12-17 Surface acoustic wave sensor assemblies

Publications (1)

Publication Number Publication Date
CA2551836A1 true CA2551836A1 (en) 2005-07-21

Family

ID=34748865

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002551836A Abandoned CA2551836A1 (en) 2003-12-30 2004-12-17 Surface acoustic wave sensor assemblies

Country Status (7)

Country Link
US (1) US20090115004A1 (https=)
EP (1) EP1700108A1 (https=)
JP (1) JP4880478B2 (https=)
CN (1) CN100567976C (https=)
AU (1) AU2004312835A1 (https=)
CA (1) CA2551836A1 (https=)
WO (1) WO2005066621A1 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060127936A (ko) 2003-12-30 2006-12-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 표면 탄성파 센서를 통한 전파 속도 추정
CA2551957A1 (en) * 2003-12-30 2005-08-18 3M Innovative Properties Company Acousto-mechanical detection systems and methods of use
DE102006015512B4 (de) * 2006-03-31 2010-01-21 Andreas Hettich Gmbh & Co. Kg Vorrichtung aus einer Messkammer und einem über einen Schnellverschluss in die Messkammer integrierbaren Resonator für die Flüssigkeitssensorik
EP2100130A1 (en) * 2006-12-29 2009-09-16 3M Innovative Properties Company Method of detection of bioanalytes by acousto-mechanical detection systems comprising the addition of liposomes
WO2008120511A1 (ja) 2007-03-29 2008-10-09 Murata Manufacturing Co., Ltd. 液中物質検出センサー
JP4524700B2 (ja) * 2007-11-26 2010-08-18 ソニー株式会社 スピーカ装置およびスピーカ駆動方法
DE102008028404B4 (de) * 2008-06-17 2013-07-18 Saw Instruments Gmbh Kartusche mit integriertem SAW Sensor
CN101634643B (zh) * 2008-07-24 2011-11-09 鸿富锦精密工业(深圳)有限公司 表面声波感测器
JP5730396B2 (ja) * 2011-07-28 2015-06-10 京セラ株式会社 バイオセンサ
US10037382B2 (en) * 2012-10-29 2018-07-31 Kyocera Corporation Surface acoustic wave sensor
JP5973595B2 (ja) * 2013-01-30 2016-08-23 京セラ株式会社 センサ装置
FR3002638A1 (fr) * 2013-02-25 2014-08-29 Bigot Jerome Le Detecteur de gaz et procede de fabrication associe
FR3002637A1 (fr) * 2013-02-25 2014-08-29 Bigot Jerome Le Detecteur de gaz et procede de fabrication associe
EP3203225B1 (en) * 2014-09-30 2020-11-25 Kyocera Corporation Sensor device
US11207683B2 (en) * 2016-08-02 2021-12-28 Imec Vzw Method and arrangement for focusing objects in a flow
MX2020000094A (es) * 2017-07-07 2020-08-06 Aviana Molecular Tech Llc Sensores de ondas acústicas superficiales multiplexantes con codificación de línea de retardo.
RU188186U1 (ru) * 2018-12-07 2019-04-02 федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский ядерный университет МИФИ" (НИЯУ МИФИ) Пьезорезонансный сорбционный сенсор концентрации веществ
TWI754247B (zh) * 2020-03-20 2022-02-01 義守大學 氣體感應器的製造方法
CN112054270B (zh) * 2020-07-27 2022-06-10 中国电子科技集团公司第十三研究所 波导接口组件互联结构
AU2024250144A1 (en) * 2023-04-05 2025-11-20 Aviana Molecular Technologies, Llc Systems integration of a surface acoustic wave biosensor for point-of-care-diagnostic use

Family Cites Families (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2539291C2 (de) * 1975-09-04 1983-07-28 Henkel KGaA, 4000 Düsseldorf Zweikomponentenverpackung
US4001197A (en) * 1975-06-12 1977-01-04 Sala Magnetics, Inc. Magnetic separation method
US3970518A (en) * 1975-07-01 1976-07-20 General Electric Company Magnetic separation of biological particles
US4204041A (en) * 1977-10-03 1980-05-20 Illinois Water Treatment Company High loading of immobilized enzymes on activated carbon supports
US4229537A (en) * 1978-02-09 1980-10-21 New York University Preparation of trichloro-s-triazine activated supports for coupling ligands
US4233029A (en) * 1978-10-25 1980-11-11 Eastman Kodak Company Liquid transport device and method
US5866195A (en) * 1988-03-31 1999-02-02 Lemelson; Jerome H. Methods for forming diamond-coated superconductor wire
US5117146A (en) * 1988-04-29 1992-05-26 The United States Of America As Represented By The United States Department Of Energy Acoustic wave device using plate modes with surface-parallel displacement
DE3925896A1 (de) * 1988-08-04 1990-04-12 Ion Tech Ltd Filter fuer proteinartige bzw. proteinhaltige materialien
JPH02227661A (ja) * 1989-02-28 1990-09-10 Sony Corp 化学物質検出装置
US5246846A (en) * 1989-04-04 1993-09-21 Fritz Pittner Process for immobilizing proteins on a support containing amino, mercapto or hydroxy groups
US5012668A (en) * 1989-08-22 1991-05-07 The Boeing Company Inclined electrode surface acoustic wave substance sensor
US5639671A (en) * 1989-09-18 1997-06-17 Biostar, Inc. Methods for optimizing of an optical assay device
US5238623A (en) * 1989-11-20 1993-08-24 Minnesota Mining And Manufacturing Company Method for preparing microporous polyolefin shaped articles
US5120594A (en) * 1989-11-20 1992-06-09 Minnesota Mining And Manufacturing Company Microporous polyolefin shaped articles with patterned surface areas of different porosity
JPH03209157A (ja) * 1990-01-10 1991-09-12 Sachiko Shiokawa 弾性表面波利用溶液測定装置及び溶液中特定物質の測定法
US5151110A (en) * 1990-09-11 1992-09-29 University Of New Mexico Molecular sieve sensors for selective detection at the nanogram level
US5076094A (en) * 1990-10-03 1991-12-31 The United States Of America As Represented By The United States Department Of Energy Dual output acoustic wave sensor for molecular identification
US5235235A (en) * 1991-05-24 1993-08-10 The United States Of America As Represented By The United States Department Of Energy Multiple-frequency acoustic wave devices for chemical sensing and materials characterization in both gas and liquid phase
US5514120A (en) * 1991-12-18 1996-05-07 Minnesota Mining And Manufacturing Company Liquid management member for absorbent articles
US6156270A (en) * 1992-05-21 2000-12-05 Biosite Diagnostics, Inc. Diagnostic devices and apparatus for the controlled movement of reagents without membranes
GB9211402D0 (en) * 1992-05-29 1992-07-15 Univ Manchester Sensor devices
US5639423A (en) * 1992-08-31 1997-06-17 The Regents Of The University Of Calfornia Microfabricated reactor
US5363074A (en) * 1992-10-19 1994-11-08 Motorola, Inc. Saw structure having serially coupled transducers with overlapping fingers
US5552272A (en) * 1993-06-10 1996-09-03 Biostar, Inc. Detection of an analyte by fluorescence using a thin film optical device
US5362421A (en) * 1993-06-16 1994-11-08 Minnesota Mining And Manufacturing Company Electrically conductive adhesive compositions
US5759625A (en) * 1994-06-03 1998-06-02 E. I. Du Pont De Nemours And Company Fluoropolymer protectant layer for high temperature superconductor film and photo-definition thereof
US5763283A (en) * 1994-10-12 1998-06-09 Sandia Corporation Method and apparatus for phase for and amplitude detection
US5685939A (en) * 1995-03-10 1997-11-11 Minnesota Mining And Manufacturing Company Process for making a Z-axis adhesive and establishing electrical interconnection therewith
EP0840369A4 (en) * 1995-06-30 2001-12-19 Toshiba Kk ELECTRONIC COMPONENT AND PRODUCTION METHOD THEREFOR
US20010028953A1 (en) * 1998-11-16 2001-10-11 3M Innovative Properties Company Adhesive compositions and methods of use
US5849208A (en) * 1995-09-07 1998-12-15 Microfab Technoologies, Inc. Making apparatus for conducting biochemical analyses
JPH09162693A (ja) * 1995-12-14 1997-06-20 Kokusai Electric Co Ltd 弾性表面波素子
US5814525A (en) * 1996-01-25 1998-09-29 Sandia Corporation Piezoelectric biosensor with a ladder polymer substrate coating
US6146510A (en) * 1996-05-16 2000-11-14 Sendx Medical, Inc. Sensor cartridge for a fluid analyte analyzer
US5916524A (en) * 1997-07-23 1999-06-29 Bio-Dot, Inc. Dispensing apparatus having improved dynamic range
US5836203A (en) * 1996-10-21 1998-11-17 Sandia Corporation Magnetically excited flexural plate wave apparatus
US5948166A (en) * 1996-11-05 1999-09-07 3M Innovative Properties Company Process and apparatus for depositing a carbon-rich coating on a moving substrate
US5888594A (en) * 1996-11-05 1999-03-30 Minnesota Mining And Manufacturing Company Process for depositing a carbon-rich coating on a moving substrate
US6062091A (en) * 1997-04-22 2000-05-16 Baumoel; Joseph Method and apparatus for determining ultrasonic pulse arrival in fluid using phase correlation
US5880552A (en) * 1997-05-27 1999-03-09 The United States Of America As Represented By The Secretary Of The Navy Diamond or diamond like carbon coated chemical sensors and a method of making same
JP3196693B2 (ja) * 1997-08-05 2001-08-06 日本電気株式会社 表面弾性波装置およびその製造方法
JPH11234074A (ja) * 1998-02-09 1999-08-27 Japan Radio Co Ltd Sawデバイス及びその製造方法
US6369893B1 (en) * 1998-05-19 2002-04-09 Cepheid Multi-channel optical detection system
US6376619B1 (en) * 1998-04-13 2002-04-23 3M Innovative Properties Company High density, miniaturized arrays and methods of manufacturing same
US6352758B1 (en) * 1998-05-04 2002-03-05 3M Innovative Properties Company Patterned article having alternating hydrophilic and hydrophobic surface regions
DE19850803A1 (de) * 1998-11-04 2000-05-11 Bosch Gmbh Robert Sensoranordnung und ein Verfahren zur Ermittlung der Dichte und der Viskosität einer Flüssigkeit
US6232139B1 (en) * 1999-01-29 2001-05-15 Sandia Corporation Method of making suspended thin-film semiconductor piezoelectric devices
FR2789822B1 (fr) * 1999-02-12 2001-06-08 Thomson Csf Dispositif a ondes de surface connecte a une embase avec un adhesif conducteur
US6696304B1 (en) * 1999-02-24 2004-02-24 Luminex Corporation Particulate solid phase immobilized protein quantitation
JP2000353934A (ja) * 1999-06-10 2000-12-19 Murata Mfg Co Ltd 弾性表面波装置
JP2001043772A (ja) * 1999-07-30 2001-02-16 Shin Etsu Polymer Co Ltd 押釦スイッチ装置
JP3823053B2 (ja) * 1999-08-06 2006-09-20 サーモ エレクトロン コーポレイション−ポイント オブ ケア エンド ラピッド ダイアグノスティックス 完全サンプル処理能力を備える、医療現場用検出自動化装置
US6287894B1 (en) * 1999-10-04 2001-09-11 Andersen Laboratories, Inc. Acoustic device packaged at wafer level
JP2002009581A (ja) * 2000-06-26 2002-01-11 Toshiba Corp 弾性表面波装置
US20040005582A1 (en) * 2000-08-10 2004-01-08 Nanobiodynamics, Incorporated Biospecific desorption microflow systems and methods for studying biospecific interactions and their modulators
JP2002075063A (ja) * 2000-08-23 2002-03-15 Jsr Corp 異方導電性シート
US7998746B2 (en) * 2000-08-24 2011-08-16 Robert Otillar Systems and methods for localizing and analyzing samples on a bio-sensor chip
US6559474B1 (en) * 2000-09-18 2003-05-06 Cornell Research Foundation, Inc, Method for topographical patterning of materials
US20020192841A1 (en) * 2001-04-27 2002-12-19 Masayoshi Kojima Measurement chip for biosensor
US7253003B2 (en) * 2001-10-19 2007-08-07 Wisconsin Alumni Research Foundation Method for monitoring the environment within a microfluidic device
US7419821B2 (en) * 2002-03-05 2008-09-02 I-Stat Corporation Apparatus and methods for analyte measurement and immunoassay
JPWO2003079496A1 (ja) * 2002-03-20 2005-07-21 日本圧着端子製造株式会社 異方導電シートおよびその製造方法
US20030180814A1 (en) * 2002-03-21 2003-09-25 Alastair Hodges Direct immunosensor assay
TWI268813B (en) * 2002-04-24 2006-12-21 Sipix Imaging Inc Process for forming a patterned thin film conductive structure on a substrate
JP2005526972A (ja) * 2002-05-02 2005-09-08 シファーゲン バイオシステムズ, インコーポレイテッド 多糖系ヒドロゲルをコーティングした表面を有するバイオチップ
DE10222068B4 (de) * 2002-05-15 2006-01-05 Forschungszentrum Karlsruhe Gmbh Sensor auf der Basis von Oberflächenwellen-Bauelementen
US20040072208A1 (en) * 2002-05-23 2004-04-15 Peter Warthoe Surface acoustic wave sensors and method for detecting target analytes
SE0201738D0 (sv) * 2002-06-07 2002-06-07 Aamic Ab Micro-fluid structures
US7175876B2 (en) * 2003-06-27 2007-02-13 3M Innovative Properties Company Patterned coating method employing polymeric coatings
ATE432554T1 (de) * 2003-09-25 2009-06-15 Murata Manufacturing Co Akustischer wellenfilter und kommunikationseinheit
WO2005050164A2 (en) * 2003-11-13 2005-06-02 Georgia Tech Research Corporation Detection systems and methods
US7361767B2 (en) * 2003-11-14 2008-04-22 3M Innovative Properties Company N-sulfonyldicarboximide containing tethering compounds
US7179923B2 (en) 2003-11-14 2007-02-20 3M Innovative Properties Company N-sulfonylaminocarbonyl containing compounds
US7423155B2 (en) 2003-11-14 2008-09-09 3M Innovative Properties Company N-sulfonyldicarboximide containing tethering compounds
US7169933B2 (en) 2003-11-14 2007-01-30 3M Innovative Properties Company N-sulfonylaminocarbonyl containing compounds
US7943388B2 (en) 2003-11-14 2011-05-17 3M Innovative Properties Company Acoustic sensors and methods
CA2551957A1 (en) 2003-12-30 2005-08-18 3M Innovative Properties Company Acousto-mechanical detection systems and methods of use
KR20060127936A (ko) 2003-12-30 2006-12-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 표면 탄성파 센서를 통한 전파 속도 추정
US7658994B2 (en) 2003-12-30 2010-02-09 3M Innovative Properties Company Substrates and compounds bonded thereto
US7342082B2 (en) * 2004-12-17 2008-03-11 3M Innovative Properties Company Soluble polymers as amine capture agents and methods
EP1700107B1 (en) 2003-12-30 2011-09-14 3M Innovative Properties Company Acoustic sensors and methods
JP5175052B2 (ja) 2003-12-30 2013-04-03 スリーエム イノベイティブ プロパティズ カンパニー アミン捕捉剤としての可溶性ポリマーおよび方法
CN1902492A (zh) 2003-12-30 2007-01-24 3M创新有限公司 基底及结合到该基底上的化合物
US7399609B2 (en) 2003-12-30 2008-07-15 3M Innovative Properties Company Staphylococcus detection
WO2005066121A2 (en) 2003-12-30 2005-07-21 3M Innovative Properties Company Multifunctional amine capture agents
JP2007518074A (ja) 2003-12-30 2007-07-05 スリーエム イノベイティブ プロパティズ カンパニー 細胞の細胞壁構成成分のシグナル検出を増強する方法
US7402678B2 (en) 2004-12-17 2008-07-22 3M Innovative Properties Company Multifunctional amine capture agents

Also Published As

Publication number Publication date
AU2004312835A1 (en) 2005-07-21
CN1902482A (zh) 2007-01-24
JP4880478B2 (ja) 2012-02-22
EP1700108A1 (en) 2006-09-13
WO2005066621A1 (en) 2005-07-21
CN100567976C (zh) 2009-12-09
US20090115004A1 (en) 2009-05-07
JP2007520698A (ja) 2007-07-26

Similar Documents

Publication Publication Date Title
JP4880478B2 (ja) 弾性表面波センサアセンブリ
Länge et al. Integration of a surface acoustic wave biosensor in a microfluidic polymer chip
US7500379B2 (en) Acoustic wave array chemical and biological sensor
US8742645B2 (en) Surface acoustic wave sensor system
CN114867558B (zh) 分析物感测系统及其卡匣
EP1312424A2 (en) Piezoelectric transducer, manufacturing method of piezoelectric transducer and pulse wave detector
CN101133321B (zh) 表面波传感器器件
JP2004523150A (ja) チップ状水晶振動子及び液相センサ
JP4228993B2 (ja) フローセル型qcmセンサ
EP3649734B1 (en) Methods and apparatus for interfacing sensors with fluid materials
CN101228620A (zh) 带有电子和流体功能的生物医学设备的互连和封装方法
JP5964960B2 (ja) センサ、検出方法、及び検出システム
JP2007093239A (ja) Qcm分析装置
US20230121995A1 (en) Integrated surface acoustic wave biosensor system for point-of-care-diagnostic use
Lange et al. Packaging of surface acoustic wave (SAW) based biosensors: An important issue for future biomedical applications
WO2023064285A1 (en) Integrated surface acoustic wave biosensor system for point-of-care-diagnostic use
KR20260002836A (ko) 현장 진단용 표면 음향파 바이오센서의 시스템 통합
TW202509471A (zh) 分析物感測系統及其卡匣
JP2024043386A (ja) 圧力センサ

Legal Events

Date Code Title Description
EEER Examination request
FZDE Discontinued

Effective date: 20130710