JP4877230B2 - 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法 - Google Patents

接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法 Download PDF

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JP4877230B2
JP4877230B2 JP2007545234A JP2007545234A JP4877230B2 JP 4877230 B2 JP4877230 B2 JP 4877230B2 JP 2007545234 A JP2007545234 A JP 2007545234A JP 2007545234 A JP2007545234 A JP 2007545234A JP 4877230 B2 JP4877230 B2 JP 4877230B2
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circuit
particles
connection
fine particles
metal
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JPWO2007058159A1 (ja
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友美 横住
正規 藤井
賢三 竹村
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
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KR20160102547A (ko) * 2014-01-14 2016-08-30 도요 알루미늄 가부시키가이샤 복합 도전성 입자, 그것을 함유하는 도전성 수지 조성물 및 도전성 도포물
US10227496B2 (en) 2014-01-14 2019-03-12 Toyo Aluminium Kabushiki Kaisha Composite conductive particle, conductive resin composition containing same and conductive coated article
KR101985581B1 (ko) * 2014-01-14 2019-06-03 도요 알루미늄 가부시키가이샤 복합 도전성 입자, 그것을 함유하는 도전성 수지 조성물 및 도전성 도포물

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KR20110048079A (ko) 2011-05-09
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WO2007058159A1 (ja) 2007-05-24
TW200730599A (en) 2007-08-16
TW201202375A (en) 2012-01-16
CN101309993A (zh) 2008-11-19
TWI367246B (ko) 2012-07-01
KR101049609B1 (ko) 2011-07-14
CN101309993B (zh) 2012-06-27
KR20080072658A (ko) 2008-08-06

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