JP4869317B2 - 赤色蛍光体およびそれを用いた発光装置 - Google Patents

赤色蛍光体およびそれを用いた発光装置 Download PDF

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Publication number
JP4869317B2
JP4869317B2 JP2008278642A JP2008278642A JP4869317B2 JP 4869317 B2 JP4869317 B2 JP 4869317B2 JP 2008278642 A JP2008278642 A JP 2008278642A JP 2008278642 A JP2008278642 A JP 2008278642A JP 4869317 B2 JP4869317 B2 JP 4869317B2
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phosphor
light emitting
light
emitting device
red
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Japanese (ja)
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JP2010106127A (ja
JP2010106127A5 (enExample
Inventor
田 由 美 福
田 直 寿 松
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Toshiba Corp
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Toshiba Corp
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Priority to JP2008278642A priority Critical patent/JP4869317B2/ja
Priority to US12/606,279 priority patent/US20100102707A1/en
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Publication of JP2010106127A5 publication Critical patent/JP2010106127A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2008278642A 2008-10-29 2008-10-29 赤色蛍光体およびそれを用いた発光装置 Active JP4869317B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008278642A JP4869317B2 (ja) 2008-10-29 2008-10-29 赤色蛍光体およびそれを用いた発光装置
US12/606,279 US20100102707A1 (en) 2008-10-29 2009-10-27 Red fluorescent substance and light-emitting device employing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008278642A JP4869317B2 (ja) 2008-10-29 2008-10-29 赤色蛍光体およびそれを用いた発光装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2010183178A Division JP4825923B2 (ja) 2010-08-18 2010-08-18 赤色蛍光体およびそれを用いた発光装置
JP2011103153A Division JP5259770B2 (ja) 2011-05-02 2011-05-02 赤色蛍光体の製造方法

Publications (3)

Publication Number Publication Date
JP2010106127A JP2010106127A (ja) 2010-05-13
JP2010106127A5 JP2010106127A5 (enExample) 2010-09-30
JP4869317B2 true JP4869317B2 (ja) 2012-02-08

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US (1) US20100102707A1 (enExample)
JP (1) JP4869317B2 (enExample)

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JP2013119592A (ja) * 2011-12-07 2013-06-17 Toshiba Corp 蛍光体およびそれを用いた発光装置

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JP5190475B2 (ja) * 2010-02-19 2013-04-24 株式会社東芝 蛍光体およびそれを用いた発光装置
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EP2428543B1 (en) 2010-09-08 2013-05-08 Kabushiki Kaisha Toshiba Light emitting device
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JP5185421B2 (ja) 2010-09-09 2013-04-17 株式会社東芝 赤色発光蛍光体およびそれを用いた発光装置
JPWO2012036016A1 (ja) * 2010-09-17 2014-02-03 株式会社東芝 蛍光体および発光装置
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