JP4849860B2 - 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 - Google Patents

光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 Download PDF

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Publication number
JP4849860B2
JP4849860B2 JP2005290765A JP2005290765A JP4849860B2 JP 4849860 B2 JP4849860 B2 JP 4849860B2 JP 2005290765 A JP2005290765 A JP 2005290765A JP 2005290765 A JP2005290765 A JP 2005290765A JP 4849860 B2 JP4849860 B2 JP 4849860B2
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JP
Japan
Prior art keywords
photocurable
resin composition
thermosetting resin
compound
group
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JP2005290765A
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English (en)
Japanese (ja)
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JP2007101830A (ja
Inventor
信人 伊藤
聖夫 有馬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Priority to JP2005290765A priority Critical patent/JP4849860B2/ja
Priority to TW095135391A priority patent/TW200727078A/zh
Priority to KR1020060095264A priority patent/KR100787325B1/ko
Priority to CN2006101404506A priority patent/CN1945434B/zh
Publication of JP2007101830A publication Critical patent/JP2007101830A/ja
Application granted granted Critical
Publication of JP4849860B2 publication Critical patent/JP4849860B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2005290765A 2005-10-04 2005-10-04 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 Active JP4849860B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005290765A JP4849860B2 (ja) 2005-10-04 2005-10-04 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
TW095135391A TW200727078A (en) 2005-10-04 2006-09-25 Photosetting/Thermosetting resin composition, cured product of the same and printed wiring board obtained using the same
KR1020060095264A KR100787325B1 (ko) 2005-10-04 2006-09-29 광 경화성 및 열 경화성 수지 조성물 및 그의 경화물 및 이를 이용하여 얻어지는 프린트 배선판
CN2006101404506A CN1945434B (zh) 2005-10-04 2006-10-08 光固化性·热固化性树脂组合物、其固化物及使用其制得的印刷电路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005290765A JP4849860B2 (ja) 2005-10-04 2005-10-04 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板

Publications (2)

Publication Number Publication Date
JP2007101830A JP2007101830A (ja) 2007-04-19
JP4849860B2 true JP4849860B2 (ja) 2012-01-11

Family

ID=38028841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005290765A Active JP4849860B2 (ja) 2005-10-04 2005-10-04 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板

Country Status (4)

Country Link
JP (1) JP4849860B2 (enrdf_load_stackoverflow)
KR (1) KR100787325B1 (enrdf_load_stackoverflow)
CN (1) CN1945434B (enrdf_load_stackoverflow)
TW (1) TW200727078A (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5513711B2 (ja) * 2007-10-01 2014-06-04 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物
JP4975579B2 (ja) * 2007-10-01 2012-07-11 太陽ホールディングス株式会社 組成物、ドライフィルム、硬化物及びプリント配線板
JP5376793B2 (ja) * 2007-11-07 2013-12-25 太陽ホールディングス株式会社 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板
JP5449688B2 (ja) * 2008-03-26 2014-03-19 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP2009239181A (ja) * 2008-03-28 2009-10-15 Taiyo Ink Mfg Ltd プリント配線板用樹脂組成物、ドライフィルムおよびプリント配線板
WO2009119821A1 (ja) * 2008-03-28 2009-10-01 太陽インキ製造株式会社 硬化性樹脂組成物とその硬化物、およびプリント配線板
CN102199273B (zh) * 2010-03-25 2014-07-09 株式会社艾迪科 光固化树脂和使用该树脂的分散剂
JP6084353B2 (ja) * 2010-12-28 2017-02-22 太陽インキ製造株式会社 光硬化性樹脂組成物の製造方法、ドライフィルムの製造方法、硬化物の製造方法およびプリント配線板の製造方法
JP5660690B2 (ja) * 2013-08-02 2015-01-28 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物
KR102415755B1 (ko) * 2015-01-21 2022-07-04 다이요 잉키 세이조 가부시키가이샤 열경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
JP6892668B2 (ja) * 2016-10-14 2021-06-23 互応化学工業株式会社 感光性樹脂組成物
JP7109186B2 (ja) * 2017-12-27 2022-07-29 株式会社Ｄｎｐファインケミカル ウレタン（メタ）アクリレート系組成物、活性エネルギー線重合性組成物、及び積層体

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61272A (ja) * 1984-06-12 1986-01-06 Taiyo Ink Seizo Kk インキ組成物
JPH0717737B2 (ja) * 1987-11-30 1995-03-01 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
JP2684948B2 (ja) * 1993-02-03 1997-12-03 株式会社日本触媒 液状感光性樹脂組成物
WO1996039454A1 (fr) * 1995-06-06 1996-12-12 Nof Corporation Composition thermodurcissable, procede de finition d'un revetement et articles en etant revetus
JP3963602B2 (ja) * 1999-01-27 2007-08-22 富士フイルム株式会社 遠紫外線露光用ポジ型フォトレジスト組成物
TW494276B (en) * 1999-05-06 2002-07-11 Solar Blak Water Co Ltd Solder resist ink composition
WO2001053375A1 (fr) * 2000-01-18 2001-07-26 Taiyo Ink Manufacturing Co., Ltd. Compose epoxyde polynucleaire, resine durcissable par rayon energetique actinique obtenue a partir de ce compose, et composition de resine photodurcissable/thermodurcissable contenant ladite resine
WO2001073510A1 (fr) * 2000-03-29 2001-10-04 Kanagawa University Composition de resine photodurcissante/thermodurcissante, couche seche photosensible preparee au moyen de cette resine et procede de creation de configurations
JP2003076015A (ja) * 2001-09-07 2003-03-14 Nichigo Morton Co Ltd 感光性樹脂組成物及びそれを用いたドライフィルム
JP4328593B2 (ja) * 2003-09-18 2009-09-09 太陽インキ製造株式会社 カルボキシル基含有感光性樹脂を含有する組成物
JP4309225B2 (ja) * 2003-10-14 2009-08-05 太陽インキ製造株式会社 硬化性組成物、その硬化物及びそれを用いたプリント配線板
JP3912405B2 (ja) * 2003-11-11 2007-05-09 三菱化学株式会社 硬化性組成物、硬化物、カラーフィルタ及び液晶表示装置
TW200519535A (en) * 2003-11-27 2005-06-16 Taiyo Ink Mfg Co Ltd Hardenable resin composition, hardened body thereof, and printed circuit board
JP4489566B2 (ja) * 2003-11-27 2010-06-23 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物、およびプリント配線板
JP4815952B2 (ja) * 2005-08-26 2011-11-16 Ｊｓｒ株式会社 重合体、カラーフィルタ用感放射線性組成物、カラーフィルタおよびカラー液晶表示パネル

Also Published As

Publication number Publication date
KR100787325B1 (ko) 2007-12-21
CN1945434A (zh) 2007-04-11
JP2007101830A (ja) 2007-04-19
KR20070037998A (ko) 2007-04-09
TW200727078A (en) 2007-07-16
CN1945434B (zh) 2010-05-12
TWI336026B (enrdf_load_stackoverflow) 2011-01-11

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