CN1945434B - 光固化性·热固化性树脂组合物、其固化物及使用其制得的印刷电路板 - Google Patents

光固化性·热固化性树脂组合物、其固化物及使用其制得的印刷电路板 Download PDF

Info

Publication number
CN1945434B
CN1945434B CN2006101404506A CN200610140450A CN1945434B CN 1945434 B CN1945434 B CN 1945434B CN 2006101404506 A CN2006101404506 A CN 2006101404506A CN 200610140450 A CN200610140450 A CN 200610140450A CN 1945434 B CN1945434 B CN 1945434B
Authority
CN
China
Prior art keywords
resin
resin composition
solidifying
carboxylic acid
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2006101404506A
Other languages
English (en)
Chinese (zh)
Other versions
CN1945434A (zh
Inventor
伊藤信人
有马圣夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of CN1945434A publication Critical patent/CN1945434A/zh
Application granted granted Critical
Publication of CN1945434B publication Critical patent/CN1945434B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN2006101404506A 2005-10-04 2006-10-08 光固化性·热固化性树脂组合物、其固化物及使用其制得的印刷电路板 Active CN1945434B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005290765A JP4849860B2 (ja) 2005-10-04 2005-10-04 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
JP2005290765 2005-10-04
JP2005-290765 2005-10-04

Publications (2)

Publication Number Publication Date
CN1945434A CN1945434A (zh) 2007-04-11
CN1945434B true CN1945434B (zh) 2010-05-12

Family

ID=38028841

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006101404506A Active CN1945434B (zh) 2005-10-04 2006-10-08 光固化性·热固化性树脂组合物、其固化物及使用其制得的印刷电路板

Country Status (4)

Country Link
JP (1) JP4849860B2 (enrdf_load_stackoverflow)
KR (1) KR100787325B1 (enrdf_load_stackoverflow)
CN (1) CN1945434B (enrdf_load_stackoverflow)
TW (1) TW200727078A (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5513711B2 (ja) * 2007-10-01 2014-06-04 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物
JP4975579B2 (ja) * 2007-10-01 2012-07-11 太陽ホールディングス株式会社 組成物、ドライフィルム、硬化物及びプリント配線板
JP5376793B2 (ja) * 2007-11-07 2013-12-25 太陽ホールディングス株式会社 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板
JP5449688B2 (ja) * 2008-03-26 2014-03-19 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
KR101612569B1 (ko) * 2008-03-28 2016-04-14 다이요 홀딩스 가부시키가이샤 경화성 수지 조성물과 그의 경화물, 및 인쇄 배선판
JP2009239181A (ja) * 2008-03-28 2009-10-15 Taiyo Ink Mfg Ltd プリント配線板用樹脂組成物、ドライフィルムおよびプリント配線板
CN102199273B (zh) * 2010-03-25 2014-07-09 株式会社艾迪科 光固化树脂和使用该树脂的分散剂
JP6084353B2 (ja) * 2010-12-28 2017-02-22 太陽インキ製造株式会社 光硬化性樹脂組成物の製造方法、ドライフィルムの製造方法、硬化物の製造方法およびプリント配線板の製造方法
JP5660690B2 (ja) * 2013-08-02 2015-01-28 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物
WO2016117237A1 (ja) * 2015-01-21 2016-07-28 太陽インキ製造株式会社 熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6892668B2 (ja) * 2016-10-14 2021-06-23 互応化学工業株式会社 感光性樹脂組成物
JP7109186B2 (ja) * 2017-12-27 2022-07-29 株式会社Ｄｎｐファインケミカル ウレタン（メタ）アクリレート系組成物、活性エネルギー線重合性組成物、及び積層体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1155890A (zh) * 1995-06-06 1997-07-30 日本油脂株式会社 热固性组合物，涂覆方法和涂覆制品
US20020098440A1 (en) * 1999-01-27 2002-07-25 Kenichiro Sato Positive photoresist composition for far ultraviolet ray exposure
CN1364247A (zh) * 1999-05-06 2002-08-14 太阳油墨制造株式会社 焊锡抗蚀剂油墨组合物
CN1396937A (zh) * 2000-01-18 2003-02-12 太阳油墨制造株式会社 多核环氧化合物,由其所得的活性能线固化性树脂及使用其所得的光固化性·热固化性树脂组合物
CN1420998A (zh) * 2000-03-29 2003-05-28 学校法人神奈川大学 光固化性·热固化性树脂组合物、其感光性干薄膜及使用其的图型形成方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61272A (ja) * 1984-06-12 1986-01-06 Taiyo Ink Seizo Kk インキ組成物
JPH0717737B2 (ja) * 1987-11-30 1995-03-01 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
JP2684948B2 (ja) * 1993-02-03 1997-12-03 株式会社日本触媒 液状感光性樹脂組成物
JP2003076015A (ja) * 2001-09-07 2003-03-14 Nichigo Morton Co Ltd 感光性樹脂組成物及びそれを用いたドライフィルム
JP4328593B2 (ja) * 2003-09-18 2009-09-09 太陽インキ製造株式会社 カルボキシル基含有感光性樹脂を含有する組成物
JP4309225B2 (ja) * 2003-10-14 2009-08-05 太陽インキ製造株式会社 硬化性組成物、その硬化物及びそれを用いたプリント配線板
JP3912405B2 (ja) * 2003-11-11 2007-05-09 三菱化学株式会社 硬化性組成物、硬化物、カラーフィルタ及び液晶表示装置
TW200519535A (en) * 2003-11-27 2005-06-16 Taiyo Ink Mfg Co Ltd Hardenable resin composition, hardened body thereof, and printed circuit board
JP4489566B2 (ja) * 2003-11-27 2010-06-23 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物、およびプリント配線板
JP4815952B2 (ja) * 2005-08-26 2011-11-16 Ｊｓｒ株式会社 重合体、カラーフィルタ用感放射線性組成物、カラーフィルタおよびカラー液晶表示パネル

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1155890A (zh) * 1995-06-06 1997-07-30 日本油脂株式会社 热固性组合物，涂覆方法和涂覆制品
US20020098440A1 (en) * 1999-01-27 2002-07-25 Kenichiro Sato Positive photoresist composition for far ultraviolet ray exposure
CN1364247A (zh) * 1999-05-06 2002-08-14 太阳油墨制造株式会社 焊锡抗蚀剂油墨组合物
CN1396937A (zh) * 2000-01-18 2003-02-12 太阳油墨制造株式会社 多核环氧化合物,由其所得的活性能线固化性树脂及使用其所得的光固化性·热固化性树脂组合物
CN1420998A (zh) * 2000-03-29 2003-05-28 学校法人神奈川大学 光固化性·热固化性树脂组合物、其感光性干薄膜及使用其的图型形成方法

Also Published As

Publication number Publication date
TW200727078A (en) 2007-07-16
JP2007101830A (ja) 2007-04-19
CN1945434A (zh) 2007-04-11
KR100787325B1 (ko) 2007-12-21
KR20070037998A (ko) 2007-04-09
TWI336026B (enrdf_load_stackoverflow) 2011-01-11
JP4849860B2 (ja) 2012-01-11

Similar Documents

Publication Publication Date Title
CN1945434B (zh) 光固化性·热固化性树脂组合物、其固化物及使用其制得的印刷电路板
JP4999685B2 (ja) 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
US7585611B2 (en) Photocurable and thermosetting resin composition, dry film using the same, and cured product thereof
KR101395375B1 (ko) 광경화성ㆍ열경화성 수지 조성물 및 그의 경화물 및 그것을이용하여 얻어지는 인쇄 배선판
JP5449688B2 (ja) 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5567543B2 (ja) 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
JP4827088B2 (ja) アルカリ現像型ソルダーレジスト及びその硬化物並びにそれを用いて得られるプリント配線板
KR101063048B1 (ko) 알칼리 현상형 솔더 레지스트, 그의 경화물 및 그것을 이용하여 얻어지는 인쇄 배선판
JP5384785B2 (ja) 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
CN101403859A (zh) 感光性树脂组合物及其固化物
JP5355845B2 (ja) 光硬化性樹脂組成物、及びその硬化物。
JP5854600B2 (ja) 光硬化性樹脂組成物
JP5787516B2 (ja) 硬化性樹脂組成物とその硬化物、およびプリント配線板
JP5660690B2 (ja) 感光性樹脂組成物及びその硬化物
JP4827089B2 (ja) アルカリ現像型ソルダーレジスト及びその硬化物並びにそれを用いて得られるプリント配線板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: TAIYO HOLDINGS CO., LTD.

Free format text: FORMER NAME: TAIYO INK MANUFACTURING CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan

Patentee after: TAIYO HOLDINGS Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: TAIYO INK MFG. Co.,Ltd.

EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20070411

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO HOLDINGS Co.,Ltd.

Contract record no.: 2011990000116

Denomination of invention: Photohardenable and thermosetting resin compositions, their hardened product, and printing circuit boards using the same

Granted publication date: 20100512

License type: Common License

Record date: 20110302

LICC Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model
EC01 Cancellation of recordation of patent licensing contract

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO HOLDINGS Co.,Ltd.

Contract record no.: 2011990000116

Date of cancellation: 20250512

EC01 Cancellation of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20070411

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO HOLDINGS Co.,Ltd.

Contract record no.: X2025990000228

Denomination of invention: Photohardenable and thermosetting resin compositions, their hardened product, and printing circuit boards using the same

Granted publication date: 20100512

License type: Common License

Record date: 20250609

EE01 Entry into force of recordation of patent licensing contract