JP4845232B1 - 薄板ガラス基板貼合体およびその製造方法 - Google Patents
薄板ガラス基板貼合体およびその製造方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
- B32B2309/105—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/208—Touch screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/06—Substrate layer characterised by chemical composition
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
Abstract
【解決手段】ガラス基板1の一の面にパターンP形成後、この一の面に支持体3を仮着し、ガラス基板1の他の面をエッチング処理してガラス基板1を薄肉化し、このエッチング処理後の他の面にフィルム基材5を仮着し、ガラス基板1の一の面に仮着された支持体3を剥離し、支持体3が剥離された後の一の面と、カバーガラス6の一の面と、を貼合し、仮着されたフィルム基材5を他の面から剥離する。
【選択図】図2
Description
まず、上述のようにして製造されたフィルム基材仮着基板10を図2(a)に示すように製品サイズにカットする。なお、本実施形態においては、大板を製品サイズにカットしてからカバーガラスにガラス基板を転写しているが、大板サイズのままカバーガラスあるいは製品カット前の表示体セルに転写しその後製品サイズにカットしてもよい。
2 接着剤
3 支持体
4、4A、4B 微粘着テープ
5、5A、5B フィルム基材
6 カバーガラス
7 接着剤
8 FPC(フレキシブルプリント基板)
9 IC
10 フィルム基材仮着基板
P パターン
Claims (4)
- ガラス基板の一の面にパターン形成後、この一の面に支持体を耐酸性の接着剤により仮着し、
該ガラス基板の他の面をエッチング処理して該ガラス基板を薄肉化し、
このエッチング処理後の他の面に自己吸着性微粘着フィルム基材を仮着し、
ガラス基板の一の面に仮着された支持体を剥離し、
支持体が剥離された後の一の面と、カバーガラス,カバーフィルムあるいは表示パネルの一の面と、を貼合し、
仮着されたフィルム基材を他の面から剥離してなること
を特徴とする薄板ガラス基板貼合体の製造方法。 - ガラス基板の一の面にパターン形成後、この一の面に支持体を耐酸性の接着剤により仮着し、
該ガラス基板の他の面をエッチング処理して該ガラス基板を薄肉化し、
このエッチング処理後の他の面に自己吸着性微粘着フィルム基材を仮着し、
ガラス基板の一の面に仮着された支持体を剥離し、
この一の面に第2のフィルム基材を仮着し、
他の面に仮着されたフィルム基材を剥離し、
フィルム基材が剥離されて表出した面と、力バーガラス,カバーフィルムあるいは表示パネルの一の面と、を貼合し、
仮着された第2のフィルム基材を一の面から剥離してなること
を特徴とする薄板ガラス基板貼合体の製造方法。 - 前記ガラス基板の一の面にはFPCまたはICがボンディングされたCOG基板が取り付けてなることを特徴とする請求項1あるいは2に記載の薄板ガラス基板貼合体の製造方法。
- 前記ガラス基板は大板ガラス基板であり、前記フィルム基材及び前記第2のフィルム基材は大板ガラスに対応するサイズであり、支持体が剥離された後あるいは前記第2のフィルムが仮着された後に、製品サイズにカットされることを特徴とする請求項1〜3いずれか1項に記載の薄板ガラス基板貼合体の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2011/052006 WO2012104989A1 (ja) | 2011-02-01 | 2011-02-01 | 薄板ガラス基板貼合体およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4845232B1 true JP4845232B1 (ja) | 2011-12-28 |
JPWO2012104989A1 JPWO2012104989A1 (ja) | 2014-07-03 |
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JP2011523637A Active JP4845232B1 (ja) | 2011-02-01 | 2011-02-01 | 薄板ガラス基板貼合体およびその製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8398873B2 (ja) |
EP (1) | EP2641883A4 (ja) |
JP (1) | JP4845232B1 (ja) |
KR (1) | KR101211961B1 (ja) |
CN (1) | CN102548758B (ja) |
CA (1) | CA2772110C (ja) |
WO (1) | WO2012104989A1 (ja) |
Cited By (3)
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JP2012051777A (ja) * | 2010-09-03 | 2012-03-15 | Micro Gijutsu Kenkyusho:Kk | フレキシブルガラス基板の製造方法及びフレキシブルガラス基板 |
JP2014063484A (ja) * | 2012-09-03 | 2014-04-10 | Semiconductor Energy Lab Co Ltd | 表示装置、及びその作製方法 |
JP2015044942A (ja) * | 2013-08-28 | 2015-03-12 | 藤森工業株式会社 | 粘着フィルム及び表面保護フィルム |
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US20140248817A1 (en) * | 2011-10-12 | 2014-09-04 | Sharp Kabushiki Kaisha | Manufacturing method for display device provided with thin film electronic circuit |
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2011
- 2011-02-01 CN CN201180003861XA patent/CN102548758B/zh active Active
- 2011-02-01 WO PCT/JP2011/052006 patent/WO2012104989A1/ja active Application Filing
- 2011-02-01 EP EP11824254.4A patent/EP2641883A4/en not_active Withdrawn
- 2011-02-01 JP JP2011523637A patent/JP4845232B1/ja active Active
- 2011-02-01 US US13/496,609 patent/US8398873B2/en active Active
- 2011-02-01 KR KR1020127006956A patent/KR101211961B1/ko active IP Right Grant
- 2011-02-01 CA CA2772110A patent/CA2772110C/en active Active
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JP4565670B1 (ja) * | 2009-10-09 | 2010-10-20 | 株式会社ミクロ技術研究所 | フレキシブルガラス基板の製造方法及びフレキシブルガラス基板 |
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JP2012051777A (ja) * | 2010-09-03 | 2012-03-15 | Micro Gijutsu Kenkyusho:Kk | フレキシブルガラス基板の製造方法及びフレキシブルガラス基板 |
JP2014063484A (ja) * | 2012-09-03 | 2014-04-10 | Semiconductor Energy Lab Co Ltd | 表示装置、及びその作製方法 |
JP2017199002A (ja) * | 2012-09-03 | 2017-11-02 | 株式会社半導体エネルギー研究所 | 表示装置 |
US11074025B2 (en) | 2012-09-03 | 2021-07-27 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
JP2015044942A (ja) * | 2013-08-28 | 2015-03-12 | 藤森工業株式会社 | 粘着フィルム及び表面保護フィルム |
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CN102548758A (zh) | 2012-07-04 |
EP2641883A4 (en) | 2014-10-01 |
US8398873B2 (en) | 2013-03-19 |
US20120223049A1 (en) | 2012-09-06 |
CA2772110C (en) | 2013-07-23 |
JPWO2012104989A1 (ja) | 2014-07-03 |
WO2012104989A1 (ja) | 2012-08-09 |
CN102548758B (zh) | 2013-11-20 |
CA2772110A1 (en) | 2012-06-06 |
KR101211961B1 (ko) | 2012-12-18 |
KR20120099210A (ko) | 2012-09-07 |
EP2641883A1 (en) | 2013-09-25 |
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