JP4814731B2 - 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置 - Google Patents

基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置 Download PDF

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Publication number
JP4814731B2
JP4814731B2 JP2006234631A JP2006234631A JP4814731B2 JP 4814731 B2 JP4814731 B2 JP 4814731B2 JP 2006234631 A JP2006234631 A JP 2006234631A JP 2006234631 A JP2006234631 A JP 2006234631A JP 4814731 B2 JP4814731 B2 JP 4814731B2
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Japan
Prior art keywords
substrate
pressing
rotation
substrate holding
movable piece
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Expired - Fee Related
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JP2006234631A
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English (en)
Japanese (ja)
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JP2008060277A5 (https=
JP2008060277A (ja
Inventor
一浩 座間
浩一 浅見
祐輔 宮崎
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Priority to JP2006234631A priority Critical patent/JP4814731B2/ja
Priority to US11/896,291 priority patent/US7723709B2/en
Publication of JP2008060277A publication Critical patent/JP2008060277A/ja
Publication of JP2008060277A5 publication Critical patent/JP2008060277A5/ja
Priority to US12/754,927 priority patent/US7999242B2/en
Priority to US13/175,429 priority patent/US8183549B2/en
Application granted granted Critical
Publication of JP4814731B2 publication Critical patent/JP4814731B2/ja
Priority to US13/454,897 priority patent/US8686383B2/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9506—Optical discs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2006234631A 2006-08-30 2006-08-30 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置 Expired - Fee Related JP4814731B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006234631A JP4814731B2 (ja) 2006-08-30 2006-08-30 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置
US11/896,291 US7723709B2 (en) 2006-08-30 2007-08-30 Substrate holding apparatus, and inspection or processing apparatus
US12/754,927 US7999242B2 (en) 2006-08-30 2010-04-06 Substrate holding apparatus, and inspection or processing apparatus
US13/175,429 US8183549B2 (en) 2006-08-30 2011-07-01 Substrate holding apparatus, and inspection or processing apparatus
US13/454,897 US8686383B2 (en) 2006-08-30 2012-04-24 Object holding apparatus, and inspection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006234631A JP4814731B2 (ja) 2006-08-30 2006-08-30 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置

Publications (3)

Publication Number Publication Date
JP2008060277A JP2008060277A (ja) 2008-03-13
JP2008060277A5 JP2008060277A5 (https=) 2008-12-11
JP4814731B2 true JP4814731B2 (ja) 2011-11-16

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JP2006234631A Expired - Fee Related JP4814731B2 (ja) 2006-08-30 2006-08-30 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置

Country Status (2)

Country Link
US (4) US7723709B2 (https=)
JP (1) JP4814731B2 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013049775A2 (en) 2011-09-30 2013-04-04 Saint-Gobain Ceramics & Plastics, Inc. Scintillation detection device with pressure sensitive adhesive
CN103959437B (zh) 2011-09-30 2017-08-01 圣戈班晶体及检测公司 具有特定结晶特征的iii‑v族衬底材料及其制备方法
JP6018404B2 (ja) * 2012-04-25 2016-11-02 株式会社荏原製作所 基板処理装置
WO2014054034A2 (en) * 2012-10-05 2014-04-10 Koninklijke Philips N.V. Rotary positioning device
TWI529964B (zh) 2012-12-31 2016-04-11 聖戈班晶體探測器公司 具有薄緩衝層的iii-v族基材及其製備方法
JP6456712B2 (ja) * 2015-02-16 2019-01-23 東京エレクトロン株式会社 基板保持機構及びこれを用いた基板処理装置
WO2016172003A1 (en) 2015-04-20 2016-10-27 Applied Materials, Inc. Buffer chamber wafer heating mechanism and supporting robot
JP6248977B2 (ja) * 2015-05-08 2017-12-20 日新イオン機器株式会社 基板保持装置
US10083852B1 (en) * 2017-05-12 2018-09-25 Kla-Tencor Corporation Floating wafer chuck
JP6948860B2 (ja) * 2017-07-14 2021-10-13 株式会社荏原製作所 基板保持装置
JP6946151B2 (ja) * 2017-11-13 2021-10-06 株式会社荏原製作所 基板保持装置および基板保持装置を備える基板処理装置
JP7076828B2 (ja) * 2020-02-27 2022-05-30 三星ダイヤモンド工業株式会社 位置決め装置および位置決め搬送システム
JP7471170B2 (ja) * 2020-08-03 2024-04-19 東京エレクトロン株式会社 基板処理方法、及び基板処理装置
CN112736014B (zh) * 2020-12-30 2024-01-16 中科晶源微电子技术（北京）有限公司 用于锁定晶片的晶片锁定机构、晶片定位装置和晶片输送设备
JP7619897B2 (ja) * 2021-06-16 2025-01-22 株式会社荏原製作所 基板支持機構、基板洗浄装置及び基板処理方法
US20250079227A1 (en) * 2023-09-05 2025-03-06 Taiwan Semiconductor Manufacturing Company Limited Wafer retaining device
CN117855110B (zh) * 2024-03-08 2024-05-24 苏州智程半导体科技股份有限公司 一种半导体处理设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3420058A1 (de) * 1984-05-29 1985-12-05 Edelhoff Polytechnik GmbH & Co, 5860 Iserlohn Motorgetriebenes muellsammelfahrzeug mit als wechselbehaelter ausgebildeten containern
JPS62166517A (ja) * 1986-01-20 1987-07-23 Hitachi Electronics Eng Co Ltd 半導体製造装置のスピンヘツド
DE3639861A1 (de) * 1986-11-21 1988-06-01 Zoeller Kipper Hubkipp- oder kippvorrichtung zum entleeren von behaeltern, insbesondere muellbehaeltern, in einen sammelbehaelter
US5121853A (en) * 1991-07-30 1992-06-16 Waste Management Of North America Garbage container
US5951770A (en) * 1997-06-04 1999-09-14 Applied Materials, Inc. Carousel wafer transfer system
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
JP4488646B2 (ja) * 2001-04-23 2010-06-23 株式会社トプコン ウェーハ保持装置
JP2004253756A (ja) * 2002-12-24 2004-09-09 Hitachi High-Tech Electronics Engineering Co Ltd 基板搭載装置、搬送アーム、半導体ウェーハの位置決め方法、基板の検査装置、及び基板の検査方法
US7226055B1 (en) * 2003-05-30 2007-06-05 Lam Research Corporation Substrate holding and spinning assembly and methods for making the same
DE102004036435B4 (de) * 2003-08-07 2007-08-30 Nanophotonics Ag Haltevorrichtung für scheibenförmige Objekte
JP4362414B2 (ja) * 2003-12-18 2009-11-11 株式会社リコー ワークセンタリング・クランプ装置、回転駆動装置及び電子ビーム露光装置
US7703823B2 (en) * 2004-07-12 2010-04-27 Rudolph Technologies, Inc. Wafer holding mechanism
JP4485374B2 (ja) * 2005-01-25 2010-06-23 東京エレクトロン株式会社 冷却処理装置

Also Published As

Publication number Publication date
US8686383B2 (en) 2014-04-01
US20100196127A1 (en) 2010-08-05
US20110260080A1 (en) 2011-10-27
US7723709B2 (en) 2010-05-25
US20120205850A1 (en) 2012-08-16
US20080054197A1 (en) 2008-03-06
US7999242B2 (en) 2011-08-16
US8183549B2 (en) 2012-05-22
JP2008060277A (ja) 2008-03-13

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