JP2008060277A - 基板保持装置および検査または処理の装置 - Google Patents
基板保持装置および検査または処理の装置 Download PDFInfo
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- JP2008060277A JP2008060277A JP2006234631A JP2006234631A JP2008060277A JP 2008060277 A JP2008060277 A JP 2008060277A JP 2006234631 A JP2006234631 A JP 2006234631A JP 2006234631 A JP2006234631 A JP 2006234631A JP 2008060277 A JP2008060277 A JP 2008060277A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9506—Optical discs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
【解決手段】基板5の外周側面51の下側52を支える傾斜面9を有し、基板5の法線を回転軸29として基板5と一体になって回転する回転台4と、回転台4と一体になって回転し、回転に先立って外周側面51の上側53の周上の複数の場所を押して、基板5を回転台4上の所定の位置に拘束する位置拘束手段11と、回転台4と一体になって回転し、回転中に上側53の周上の複数の場所を押して、基板5を傾斜面9に押し付ける押付手段12とを有する。
【選択図】図2
Description
3 基板保持装置
4 回転台
5 基板
9 傾斜面
10 傾斜台
11 位置拘束手段
12 押付手段
13 押付可動片
14 押付弾性体(バネ)
15 拘束可動片
16 拘束弾性体(バネ)
17 変位手段
20 昇降板
20a テーパ面
27 ダイヤフラム
29 回転軸
32 シャフト
39 爪
42 シャフト
49 爪
51 外周側面
52 外周側面下側
53 外周側面上側
Claims (7)
- 基板の外周側面の下側を支える傾斜面を有し、前記基板の法線を回転軸として前記基板と一体になって回転する回転台と、
前記回転台と一体になって回転し、回転に先立って前記外周側面の上側の周上の複数の場所を押して、前記基板を前記回転台上の所定の位置に拘束する位置拘束手段と、
前記回転台と一体になって回転し、回転中に前記上側の周上の複数の場所を押して、前記基板を前記傾斜面に押し付ける押付手段とを有することを特徴とする基板保持装置。 - 前記位置拘束手段が押す前記上側の位置は、前記押付手段が押す前記上側の位置より下であることを特徴とする請求項1に記載の基板保持装置。
- 前記位置拘束手段の前記上側を押す接触面が前記回転軸と成す90度以下の角度は、前記押付手段の前記上側を押す接触面が前記回転軸と成す90度以下の角度より小さいことを特徴とする請求項1または請求項2に記載の基板保持装置。
- 前記位置拘束手段の前記上側を押す複数の場所が前記周上で等間隔に設けられ、
前記押付手段の前記上側を押す複数の場所が前記周上で等間隔に設けられていることを特徴とする請求項1に記載の基板保持装置。 - 前記押付手段は、回転に伴って生じる遠心力で動く押付可動片を有し、前記押付可動片が動くことにより、前記基板を前記傾斜面に押し付けることを特徴とする請求項1乃至請求項4のいずれか1項に記載の基板保持装置。
- 前記押付手段は、押付弾性体を有し、
前記回転の開始により、前記押付弾性体に抗して前記押付可動片を前記遠心力で前進させ前記基板を前記傾斜面に押し付け、
前記回転の停止により、前記押付弾性体は前記押付可動片を後退させ前記基板の押し付けを解除することを特徴とする請求項5に記載の基板保持装置。 - 請求項1乃至請求項6のいずれか1項に記載の基板保持装置を用いて前記基板を回転させながら、前記基板の検査または処理を行うことを特徴とする検査または処理の装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006234631A JP4814731B2 (ja) | 2006-08-30 | 2006-08-30 | 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置 |
US11/896,291 US7723709B2 (en) | 2006-08-30 | 2007-08-30 | Substrate holding apparatus, and inspection or processing apparatus |
US12/754,927 US7999242B2 (en) | 2006-08-30 | 2010-04-06 | Substrate holding apparatus, and inspection or processing apparatus |
US13/175,429 US8183549B2 (en) | 2006-08-30 | 2011-07-01 | Substrate holding apparatus, and inspection or processing apparatus |
US13/454,897 US8686383B2 (en) | 2006-08-30 | 2012-04-24 | Object holding apparatus, and inspection apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006234631A JP4814731B2 (ja) | 2006-08-30 | 2006-08-30 | 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008060277A true JP2008060277A (ja) | 2008-03-13 |
JP2008060277A5 JP2008060277A5 (ja) | 2008-12-11 |
JP4814731B2 JP4814731B2 (ja) | 2011-11-16 |
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JP2006234631A Expired - Fee Related JP4814731B2 (ja) | 2006-08-30 | 2006-08-30 | 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置 |
Country Status (2)
Country | Link |
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US (4) | US7723709B2 (ja) |
JP (1) | JP4814731B2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104603924A (zh) * | 2012-10-05 | 2015-05-06 | 皇家飞利浦有限公司 | 旋转定位设备 |
JP2016213331A (ja) * | 2015-05-08 | 2016-12-15 | 日新イオン機器株式会社 | 基板保持装置 |
WO2019012967A1 (ja) * | 2017-07-14 | 2019-01-17 | 株式会社荏原製作所 | 基板保持装置 |
JP2021136354A (ja) * | 2020-02-27 | 2021-09-13 | 三星ダイヤモンド工業株式会社 | 位置決め装置および位置決め搬送システム |
JP7471170B2 (ja) | 2020-08-03 | 2024-04-19 | 東京エレクトロン株式会社 | 基板処理方法、及び基板処理装置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2013049775A2 (en) | 2011-09-30 | 2013-04-04 | Saint-Gobain Ceramics & Plastics, Inc. | Scintillation detection device with pressure sensitive adhesive |
WO2013049578A2 (en) | 2011-09-30 | 2013-04-04 | Saint-Gobain Ceramics & Plastics, Inc. | Group iii-v substrate material with particular crystallographic features and methods of making |
JP6018404B2 (ja) * | 2012-04-25 | 2016-11-02 | 株式会社荏原製作所 | 基板処理装置 |
TWI529964B (zh) | 2012-12-31 | 2016-04-11 | 聖戈班晶體探測器公司 | 具有薄緩衝層的iii-v族基材及其製備方法 |
JP6456712B2 (ja) * | 2015-02-16 | 2019-01-23 | 東京エレクトロン株式会社 | 基板保持機構及びこれを用いた基板処理装置 |
WO2016172003A1 (en) | 2015-04-20 | 2016-10-27 | Applied Materials, Inc. | Buffer chamber wafer heating mechanism and supporting robot |
US10083852B1 (en) * | 2017-05-12 | 2018-09-25 | Kla-Tencor Corporation | Floating wafer chuck |
JP6946151B2 (ja) * | 2017-11-13 | 2021-10-06 | 株式会社荏原製作所 | 基板保持装置および基板保持装置を備える基板処理装置 |
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JPS62166517A (ja) * | 1986-01-20 | 1987-07-23 | Hitachi Electronics Eng Co Ltd | 半導体製造装置のスピンヘツド |
JP2002319613A (ja) * | 2001-04-23 | 2002-10-31 | Topcon Corp | ウェーハ保持装置 |
JP2004253756A (ja) * | 2002-12-24 | 2004-09-09 | Hitachi High-Tech Electronics Engineering Co Ltd | 基板搭載装置、搬送アーム、半導体ウェーハの位置決め方法、基板の検査装置、及び基板の検査方法 |
JP2005203726A (ja) * | 2003-12-18 | 2005-07-28 | Ricoh Co Ltd | ワークセンタリング・クランプ装置、回転駆動装置、電子ビーム露光装置及び光ディスク用スタンパ |
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2006
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-
2007
- 2007-08-30 US US11/896,291 patent/US7723709B2/en not_active Expired - Fee Related
-
2010
- 2010-04-06 US US12/754,927 patent/US7999242B2/en not_active Expired - Fee Related
-
2011
- 2011-07-01 US US13/175,429 patent/US8183549B2/en active Active
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2012
- 2012-04-24 US US13/454,897 patent/US8686383B2/en active Active
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JPS62166517A (ja) * | 1986-01-20 | 1987-07-23 | Hitachi Electronics Eng Co Ltd | 半導体製造装置のスピンヘツド |
JP2002319613A (ja) * | 2001-04-23 | 2002-10-31 | Topcon Corp | ウェーハ保持装置 |
JP2004253756A (ja) * | 2002-12-24 | 2004-09-09 | Hitachi High-Tech Electronics Engineering Co Ltd | 基板搭載装置、搬送アーム、半導体ウェーハの位置決め方法、基板の検査装置、及び基板の検査方法 |
JP2005203726A (ja) * | 2003-12-18 | 2005-07-28 | Ricoh Co Ltd | ワークセンタリング・クランプ装置、回転駆動装置、電子ビーム露光装置及び光ディスク用スタンパ |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104603924A (zh) * | 2012-10-05 | 2015-05-06 | 皇家飞利浦有限公司 | 旋转定位设备 |
CN104603924B (zh) * | 2012-10-05 | 2017-06-20 | 皇家飞利浦有限公司 | 旋转定位设备 |
JP2016213331A (ja) * | 2015-05-08 | 2016-12-15 | 日新イオン機器株式会社 | 基板保持装置 |
WO2019012967A1 (ja) * | 2017-07-14 | 2019-01-17 | 株式会社荏原製作所 | 基板保持装置 |
JP2019021725A (ja) * | 2017-07-14 | 2019-02-07 | 株式会社荏原製作所 | 基板保持装置 |
CN110870057A (zh) * | 2017-07-14 | 2020-03-06 | 株式会社荏原制作所 | 基板保持装置 |
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CN110870057B (zh) * | 2017-07-14 | 2023-09-01 | 株式会社荏原制作所 | 基板保持装置 |
JP2021136354A (ja) * | 2020-02-27 | 2021-09-13 | 三星ダイヤモンド工業株式会社 | 位置決め装置および位置決め搬送システム |
JP7076828B2 (ja) | 2020-02-27 | 2022-05-30 | 三星ダイヤモンド工業株式会社 | 位置決め装置および位置決め搬送システム |
JP7471170B2 (ja) | 2020-08-03 | 2024-04-19 | 東京エレクトロン株式会社 | 基板処理方法、及び基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
US7999242B2 (en) | 2011-08-16 |
US20110260080A1 (en) | 2011-10-27 |
JP4814731B2 (ja) | 2011-11-16 |
US20100196127A1 (en) | 2010-08-05 |
US20080054197A1 (en) | 2008-03-06 |
US7723709B2 (en) | 2010-05-25 |
US8686383B2 (en) | 2014-04-01 |
US8183549B2 (en) | 2012-05-22 |
US20120205850A1 (en) | 2012-08-16 |
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