JP4814731B2 - 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置 - Google Patents

基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置 Download PDF

Info

Publication number
JP4814731B2
JP4814731B2 JP2006234631A JP2006234631A JP4814731B2 JP 4814731 B2 JP4814731 B2 JP 4814731B2 JP 2006234631 A JP2006234631 A JP 2006234631A JP 2006234631 A JP2006234631 A JP 2006234631A JP 4814731 B2 JP4814731 B2 JP 4814731B2
Authority
JP
Japan
Prior art keywords
substrate
pressing
rotation
substrate holding
movable piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006234631A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008060277A (ja
JP2008060277A5 (enExample
Inventor
一浩 座間
浩一 浅見
祐輔 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to JP2006234631A priority Critical patent/JP4814731B2/ja
Priority to US11/896,291 priority patent/US7723709B2/en
Publication of JP2008060277A publication Critical patent/JP2008060277A/ja
Publication of JP2008060277A5 publication Critical patent/JP2008060277A5/ja
Priority to US12/754,927 priority patent/US7999242B2/en
Priority to US13/175,429 priority patent/US8183549B2/en
Application granted granted Critical
Publication of JP4814731B2 publication Critical patent/JP4814731B2/ja
Priority to US13/454,897 priority patent/US8686383B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9506—Optical discs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2006234631A 2006-08-30 2006-08-30 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置 Expired - Fee Related JP4814731B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006234631A JP4814731B2 (ja) 2006-08-30 2006-08-30 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置
US11/896,291 US7723709B2 (en) 2006-08-30 2007-08-30 Substrate holding apparatus, and inspection or processing apparatus
US12/754,927 US7999242B2 (en) 2006-08-30 2010-04-06 Substrate holding apparatus, and inspection or processing apparatus
US13/175,429 US8183549B2 (en) 2006-08-30 2011-07-01 Substrate holding apparatus, and inspection or processing apparatus
US13/454,897 US8686383B2 (en) 2006-08-30 2012-04-24 Object holding apparatus, and inspection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006234631A JP4814731B2 (ja) 2006-08-30 2006-08-30 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置

Publications (3)

Publication Number Publication Date
JP2008060277A JP2008060277A (ja) 2008-03-13
JP2008060277A5 JP2008060277A5 (enExample) 2008-12-11
JP4814731B2 true JP4814731B2 (ja) 2011-11-16

Family

ID=39150203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006234631A Expired - Fee Related JP4814731B2 (ja) 2006-08-30 2006-08-30 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置

Country Status (2)

Country Link
US (4) US7723709B2 (enExample)
JP (1) JP4814731B2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6158190B2 (ja) 2011-09-30 2017-07-05 サン‐ゴバン、クリストー、エ、デテクトゥールＳａｉｎｔ−Ｇｏｂａｉｎ Ｃｒｉｓｔａｕｘ ＆ Ｄｅｔｅｃｔｅｕｒｓ 基板の形成方法
US9057790B2 (en) 2011-09-30 2015-06-16 Saint-Gobain Ceramics & Plastics, Inc. Scintillation detection device with pressure sensitive adhesive interfaces
JP6018404B2 (ja) * 2012-04-25 2016-11-02 株式会社荏原製作所 基板処理装置
WO2014054034A2 (en) * 2012-10-05 2014-04-10 Koninklijke Philips N.V. Rotary positioning device
TWI529964B (zh) 2012-12-31 2016-04-11 聖戈班晶體探測器公司 具有薄緩衝層的iii-v族基材及其製備方法
JP6456712B2 (ja) * 2015-02-16 2019-01-23 東京エレクトロン株式会社 基板保持機構及びこれを用いた基板処理装置
CN107534000B (zh) 2015-04-20 2021-12-17 应用材料公司 缓冲腔室晶片加热机构和支撑机械臂
JP6248977B2 (ja) * 2015-05-08 2017-12-20 日新イオン機器株式会社 基板保持装置
US10083852B1 (en) * 2017-05-12 2018-09-25 Kla-Tencor Corporation Floating wafer chuck
JP6948860B2 (ja) * 2017-07-14 2021-10-13 株式会社荏原製作所 基板保持装置
JP6946151B2 (ja) * 2017-11-13 2021-10-06 株式会社荏原製作所 基板保持装置および基板保持装置を備える基板処理装置
JP7076828B2 (ja) * 2020-02-27 2022-05-30 三星ダイヤモンド工業株式会社 位置決め装置および位置決め搬送システム
JP7471170B2 (ja) * 2020-08-03 2024-04-19 東京エレクトロン株式会社 基板処理方法、及び基板処理装置
CN112736014B (zh) * 2020-12-30 2024-01-16 中科晶源微电子技术（北京）有限公司 用于锁定晶片的晶片锁定机构、晶片定位装置和晶片输送设备
JP7619897B2 (ja) * 2021-06-16 2025-01-22 株式会社荏原製作所 基板支持機構、基板洗浄装置及び基板処理方法
CN117855110B (zh) * 2024-03-08 2024-05-24 苏州智程半导体科技股份有限公司 一种半导体处理设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3420058A1 (de) * 1984-05-29 1985-12-05 Edelhoff Polytechnik GmbH & Co, 5860 Iserlohn Motorgetriebenes muellsammelfahrzeug mit als wechselbehaelter ausgebildeten containern
JPS62166517A (ja) * 1986-01-20 1987-07-23 Hitachi Electronics Eng Co Ltd 半導体製造装置のスピンヘツド
DE3639861A1 (de) * 1986-11-21 1988-06-01 Zoeller Kipper Hubkipp- oder kippvorrichtung zum entleeren von behaeltern, insbesondere muellbehaeltern, in einen sammelbehaelter
US5121853A (en) * 1991-07-30 1992-06-16 Waste Management Of North America Garbage container
US5951770A (en) * 1997-06-04 1999-09-14 Applied Materials, Inc. Carousel wafer transfer system
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
JP4488646B2 (ja) 2001-04-23 2010-06-23 株式会社トプコン ウェーハ保持装置
JP2004253756A (ja) * 2002-12-24 2004-09-09 Hitachi High-Tech Electronics Engineering Co Ltd 基板搭載装置、搬送アーム、半導体ウェーハの位置決め方法、基板の検査装置、及び基板の検査方法
US7226055B1 (en) * 2003-05-30 2007-06-05 Lam Research Corporation Substrate holding and spinning assembly and methods for making the same
DE102004036435B4 (de) * 2003-08-07 2007-08-30 Nanophotonics Ag Haltevorrichtung für scheibenförmige Objekte
JP4362414B2 (ja) * 2003-12-18 2009-11-11 株式会社リコー ワークセンタリング・クランプ装置、回転駆動装置及び電子ビーム露光装置
US7703823B2 (en) * 2004-07-12 2010-04-27 Rudolph Technologies, Inc. Wafer holding mechanism
JP4485374B2 (ja) * 2005-01-25 2010-06-23 東京エレクトロン株式会社 冷却処理装置

Also Published As

Publication number Publication date
US7999242B2 (en) 2011-08-16
US20100196127A1 (en) 2010-08-05
US8686383B2 (en) 2014-04-01
JP2008060277A (ja) 2008-03-13
US20120205850A1 (en) 2012-08-16
US7723709B2 (en) 2010-05-25
US20080054197A1 (en) 2008-03-06
US8183549B2 (en) 2012-05-22
US20110260080A1 (en) 2011-10-27

Similar Documents

Publication Publication Date Title
US7723709B2 (en) Substrate holding apparatus, and inspection or processing apparatus
KR102628875B1 (ko) 기판 처리 장치, 기판 처리 방법 및 기억 매체
JPH0610775B2 (ja) 円形基板の位置決め装置
KR20150042708A (ko) 기판 처리 장치 및 기판 처리 방법
WO2017056643A1 (ja) ウエハ検査方法及びウエハ検査装置
JP2004253756A (ja) 基板搭載装置、搬送アーム、半導体ウェーハの位置決め方法、基板の検査装置、及び基板の検査方法
KR20150125576A (ko) 기판 처리 장치, 기판 처리 장치의 기판 검출 방법 및 기억 매체
US12444629B2 (en) Substrate inspection device
JP7121572B2 (ja) 研磨装置および研磨方法
US8706289B2 (en) Pre-aligner search
JP6150392B2 (ja) ウエハ側面検査装置
KR20230080216A (ko) 웨이퍼 연마 장치 및 상기 웨이퍼 연마 장치가 포함하는 리테이너 링의 결함 검출 방법
JP7203575B2 (ja) ウエハアライメント装置
KR20040073087A (ko) 웨이퍼 홀더
KR20250011125A (ko) 기판 연마 방법, 프로그램, 및 기판 연마 장치
TW201433786A (zh) 晶圓檢測設備
JP2657466B2 (ja) 円盤状物体の取り扱い装置
JP2021118301A (ja) 基板処理装置、及び基板処理方法
JP2009516376A (ja) 円板状の工作物のための搬送装置
KR100831270B1 (ko) 웨이퍼 홀더
TWI878599B (zh) 檢查用基板以及檢查方法
TWI890142B (zh) 基板處理裝置
KR102894260B1 (ko) 웨이퍼 정렬 모듈 및 이를 포함하는 웨이퍼 검사 장치
JP7473748B2 (ja) ウェーハ回転装置、ウェーハ検査装置及びウェーハの検査方法
JP2012154740A (ja) 中心ずれ測定装置及びその方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081023

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081023

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100709

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100713

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100908

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110111

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110308

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110823

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110826

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140902

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees