JP4804760B2 - 積層型圧電構造体の製造方法 - Google Patents

積層型圧電構造体の製造方法 Download PDF

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Publication number
JP4804760B2
JP4804760B2 JP2005014730A JP2005014730A JP4804760B2 JP 4804760 B2 JP4804760 B2 JP 4804760B2 JP 2005014730 A JP2005014730 A JP 2005014730A JP 2005014730 A JP2005014730 A JP 2005014730A JP 4804760 B2 JP4804760 B2 JP 4804760B2
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electrode
layer
electrode layer
piezoelectric
workpiece
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JP2005014730A
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Japanese (ja)
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JP2006203077A (ja
JP2006203077A5 (enExample
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貢 和田
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Fujifilm Corp
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Fujifilm Corp
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JP2005014730A 2005-01-21 2005-01-21 積層型圧電構造体の製造方法 Expired - Fee Related JP4804760B2 (ja)

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JP2005014730A JP4804760B2 (ja) 2005-01-21 2005-01-21 積層型圧電構造体の製造方法

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JP2005014730A JP4804760B2 (ja) 2005-01-21 2005-01-21 積層型圧電構造体の製造方法

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JP2006203077A JP2006203077A (ja) 2006-08-03
JP2006203077A5 JP2006203077A5 (enExample) 2006-11-16
JP4804760B2 true JP4804760B2 (ja) 2011-11-02

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101562339B1 (ko) * 2008-09-25 2015-10-22 삼성전자 주식회사 압전형 마이크로 스피커 및 그 제조 방법
JP5911085B2 (ja) * 2010-07-23 2016-04-27 日本電気株式会社 振動部材の製造方法
US9412705B2 (en) 2011-06-27 2016-08-09 Thin Film Electronics Asa Short circuit reduction in a ferroelectric memory cell comprising a stack of layers arranged on a flexible substrate
US9934836B2 (en) * 2011-06-27 2018-04-03 Thin Film Electronics Asa Short circuit reduction in an electronic component comprising a stack of layers arranged on a flexible substrate
DE102012101351A1 (de) * 2012-02-20 2013-08-22 Epcos Ag Vielschichtbauelement und Verfahren zum Herstellen eines Vielschichtbauelements
JP2020030448A (ja) * 2018-08-20 2020-02-27 地方独立行政法人大阪産業技術研究所 静電容量式タッチセンサおよびその製造方法
KR102816203B1 (ko) * 2019-08-16 2025-06-04 삼성디스플레이 주식회사 음향 발생 장치를 갖는 회로 보드와 그를 포함하는 표시 장치
JP7733811B2 (ja) * 2022-03-30 2025-09-03 住友精密工業株式会社 強誘電体膜成膜基板の製造方法および強誘電体膜成膜基板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02164084A (ja) * 1988-12-19 1990-06-25 Nec Corp 積層圧電アクチュエータ素子の製造方法
JP2819471B2 (ja) * 1989-06-12 1998-10-30 株式会社トーキン 積層型圧電アクチュエータ
JPH07135347A (ja) * 1993-06-21 1995-05-23 Tokin Corp 積層型圧電アクチュエータ
JPH0923030A (ja) * 1995-07-05 1997-01-21 Oki Electric Ind Co Ltd 積層型圧電素子の製造方法
JP3147834B2 (ja) * 1997-10-03 2001-03-19 株式会社村田製作所 圧電共振子の製造方法
JPH11135850A (ja) * 1997-10-28 1999-05-21 Denso Corp 薄膜積層圧電素子およびその製造方法
JP3729103B2 (ja) * 2001-08-28 2005-12-21 株式会社村田製作所 圧電装置、ラダー型フィルタ及び圧電装置の製造方法
JP4294924B2 (ja) * 2001-09-12 2009-07-15 日本碍子株式会社 マトリクス型圧電／電歪デバイス及び製造方法
JP2003174209A (ja) * 2001-12-07 2003-06-20 Nec Tokin Ceramics Corp 積層型圧電アクチュエータ素子
JP2004072013A (ja) * 2002-08-09 2004-03-04 Nec Tokin Corp 積層型圧電アクチュエータ集合体及びその製造方法
JP2004119934A (ja) * 2002-09-30 2004-04-15 Fuji Photo Film Co Ltd 積層構造体の製造方法及び製造装置

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