JP4799740B2 - 配線回路基板用樹脂組成物、配線回路基板用基材および配線回路基板 - Google Patents

配線回路基板用樹脂組成物、配線回路基板用基材および配線回路基板 Download PDF

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Publication number
JP4799740B2
JP4799740B2 JP2001008935A JP2001008935A JP4799740B2 JP 4799740 B2 JP4799740 B2 JP 4799740B2 JP 2001008935 A JP2001008935 A JP 2001008935A JP 2001008935 A JP2001008935 A JP 2001008935A JP 4799740 B2 JP4799740 B2 JP 4799740B2
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JP
Japan
Prior art keywords
circuit board
printed circuit
resin composition
insulating layer
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001008935A
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English (en)
Japanese (ja)
Other versions
JP2002212419A (ja
Inventor
弘文 藤井
林　　俊一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2001008935A priority Critical patent/JP4799740B2/ja
Priority to US10/041,451 priority patent/US6623843B2/en
Publication of JP2002212419A publication Critical patent/JP2002212419A/ja
Application granted granted Critical
Publication of JP4799740B2 publication Critical patent/JP4799740B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
JP2001008935A 2001-01-17 2001-01-17 配線回路基板用樹脂組成物、配線回路基板用基材および配線回路基板 Expired - Fee Related JP4799740B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2001008935A JP4799740B2 (ja) 2001-01-17 2001-01-17 配線回路基板用樹脂組成物、配線回路基板用基材および配線回路基板
US10/041,451 US6623843B2 (en) 2001-01-17 2002-01-10 Resin composition for wiring circuit board, substrate for wiring circuit board, and wiring circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001008935A JP4799740B2 (ja) 2001-01-17 2001-01-17 配線回路基板用樹脂組成物、配線回路基板用基材および配線回路基板

Publications (2)

Publication Number Publication Date
JP2002212419A JP2002212419A (ja) 2002-07-31
JP4799740B2 true JP4799740B2 (ja) 2011-10-26

Family

ID=18876489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001008935A Expired - Fee Related JP4799740B2 (ja) 2001-01-17 2001-01-17 配線回路基板用樹脂組成物、配線回路基板用基材および配線回路基板

Country Status (2)

Country Link
US (1) US6623843B2 (US20020132095A1-20020919-C00002.png)
JP (1) JP4799740B2 (US20020132095A1-20020919-C00002.png)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI300744B (US20020132095A1-20020919-C00002.png) * 2001-04-19 2008-09-11 Nippon Steel Chemical Co
JP4031756B2 (ja) * 2003-12-22 2008-01-09 日東電工株式会社 配線回路基板
KR100662542B1 (ko) * 2005-06-17 2006-12-28 제일모직주식회사 반사방지 하드마스크 조성물 및 이를 이용하여 기판 상에패턴화된 재료 형상을 형성시키는 방법
CN101743283B (zh) * 2007-07-18 2013-08-21 昭和电工株式会社 树脂组合物及其用途
US20090093608A1 (en) * 2007-10-04 2009-04-09 Saint-Gobain Performance Plastics Corporation Polyimide material with improved thermal and mechanical properties
KR101684195B1 (ko) * 2012-08-08 2016-12-07 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 필름 적층체, 플렉시블 프린트 배선판 및 그 제조 방법
US20150309600A1 (en) * 2014-04-23 2015-10-29 Uni-Pixel Displays, Inc. Method of fabricating a conductive pattern with high optical transmission, low reflectance, and low visibility
US10179828B2 (en) * 2015-01-16 2019-01-15 Dic Corporation Curable composition for permanent resist films, and permanent resist film

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3221756B2 (ja) * 1992-12-28 2001-10-22 新日鐵化学株式会社 プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
JP3369344B2 (ja) * 1994-01-21 2003-01-20 信越化学工業株式会社 感光性樹脂組成物
US5914385A (en) * 1996-10-03 1999-06-22 Mitsubishi Jukogyo Kabushiki Kaisha Polyimide resin composition and method for producing prepreg and paint and method for curing resin using the same
JPH10186658A (ja) * 1996-12-24 1998-07-14 Hitachi Ltd ポジ型感光性樹脂組成物とそれを用いた大規模集積回路の製法
JP3346265B2 (ja) * 1998-02-27 2002-11-18 宇部興産株式会社 芳香族ポリイミドフィルムおよびその積層体
JPH11338143A (ja) * 1998-05-21 1999-12-10 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性ポリイミド前駆体樹脂組成物及びこれを用いたレリーフパターンの製造法
KR100572646B1 (ko) * 1998-07-17 2006-04-24 제이에스알 가부시끼가이샤 폴리이미드계 복합체 및 이 복합체를 사용한 전자 부품, 및 폴리이미드계 수성 분산액
JP3426531B2 (ja) * 1998-10-30 2003-07-14 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、レリーフパターンの製造法及び電子部品
JP2002148804A (ja) * 2000-11-08 2002-05-22 Nitto Denko Corp 感光性樹脂組成物および回路基板
JP4665333B2 (ja) * 2000-11-27 2011-04-06 東レ株式会社 ポジ型感光性樹脂前駆体組成物

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Publication number Publication date
US20020132095A1 (en) 2002-09-19
JP2002212419A (ja) 2002-07-31
US6623843B2 (en) 2003-09-23

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