JP4791083B2 - 光関連デバイス封止用樹脂組成物およびその硬化物 - Google Patents

光関連デバイス封止用樹脂組成物およびその硬化物 Download PDF

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Publication number
JP4791083B2
JP4791083B2 JP2005157742A JP2005157742A JP4791083B2 JP 4791083 B2 JP4791083 B2 JP 4791083B2 JP 2005157742 A JP2005157742 A JP 2005157742A JP 2005157742 A JP2005157742 A JP 2005157742A JP 4791083 B2 JP4791083 B2 JP 4791083B2
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composition
group
molecular weight
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low molecular
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Japanese (ja)
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JP2006328315A5 (enExample
JP2006328315A (ja
Inventor
久司 清水
努 柏木
利夫 塩原
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2005157742A priority Critical patent/JP4791083B2/ja
Priority to US11/441,099 priority patent/US20060270786A1/en
Publication of JP2006328315A publication Critical patent/JP2006328315A/ja
Publication of JP2006328315A5 publication Critical patent/JP2006328315A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Silicon Polymers (AREA)
JP2005157742A 2005-05-30 2005-05-30 光関連デバイス封止用樹脂組成物およびその硬化物 Expired - Fee Related JP4791083B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005157742A JP4791083B2 (ja) 2005-05-30 2005-05-30 光関連デバイス封止用樹脂組成物およびその硬化物
US11/441,099 US20060270786A1 (en) 2005-05-30 2006-05-26 Resin composition for sealing optical device and cured product thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005157742A JP4791083B2 (ja) 2005-05-30 2005-05-30 光関連デバイス封止用樹脂組成物およびその硬化物

Publications (3)

Publication Number Publication Date
JP2006328315A JP2006328315A (ja) 2006-12-07
JP2006328315A5 JP2006328315A5 (enExample) 2010-10-14
JP4791083B2 true JP4791083B2 (ja) 2011-10-12

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JP2005157742A Expired - Fee Related JP4791083B2 (ja) 2005-05-30 2005-05-30 光関連デバイス封止用樹脂組成物およびその硬化物

Country Status (2)

Country Link
US (1) US20060270786A1 (enExample)
JP (1) JP4791083B2 (enExample)

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TWI400817B (zh) * 2005-04-08 2013-07-01 日亞化學工業股份有限公司 具有藉由網版印刷形成之矽酮樹脂層的發光裝置
JP4961829B2 (ja) * 2005-08-09 2012-06-27 ソニー株式会社 ナノ粒子−樹脂複合材料の製造方法
JP4781779B2 (ja) * 2005-10-27 2011-09-28 信越化学工業株式会社 高分子量オルガノポリシロキサンの製造方法、該高分子量オルガノポリシロキサンを含む組成物およびその硬化物で封止された光半導体装置
JP4781780B2 (ja) * 2005-10-27 2011-09-28 信越化学工業株式会社 光関連デバイス封止用樹脂組成物およびその硬化物ならびに半導体素子の封止方法
JP4961828B2 (ja) * 2006-05-12 2012-06-27 ソニー株式会社 ナノ粒子−樹脂複合材料の製造方法
JP2008013623A (ja) * 2006-07-04 2008-01-24 Shin Etsu Chem Co Ltd 光関連デバイス封止用樹脂組成物およびその硬化物
JP2008019403A (ja) * 2006-07-14 2008-01-31 Jsr Corp 酸化物微粒子含有樹脂組成物およびその製造方法
JP4520437B2 (ja) * 2006-07-26 2010-08-04 信越化学工業株式会社 Ｌｅｄ用蛍光物質入り硬化性シリコーン組成物およびその組成物を使用するｌｅｄ発光装置。
CN100459199C (zh) * 2007-01-25 2009-02-04 宁波安迪光电科技有限公司 发光二极管的封装方法
JP5109387B2 (ja) * 2007-02-02 2012-12-26 セントラル硝子株式会社 有機無機ハイブリッド透明封止材とその製造方法
JP5114971B2 (ja) * 2007-02-23 2013-01-09 横浜ゴム株式会社 発光素子用封止材組成物、その硬化物および発光素子封止体
JP5444631B2 (ja) * 2007-04-06 2014-03-19 横浜ゴム株式会社 光半導体素子封止用組成物、その硬化物および光半導体素子封止体
JP4721364B2 (ja) * 2007-11-28 2011-07-13 日東電工株式会社 光半導体素子封止用樹脂およびそれを用いて得られる光半導体装置
JP5393107B2 (ja) * 2007-12-25 2014-01-22 日東電工株式会社 シリコーン樹脂組成物
EP2075277A3 (en) * 2007-12-25 2012-11-07 Nitto Denko Corporation Silicone resin composition
JP2009215345A (ja) * 2008-03-07 2009-09-24 Central Glass Co Ltd 熱硬化性有機無機ハイブリッド透明封止材
JP5424381B2 (ja) * 2008-12-24 2014-02-26 日東電工株式会社 光半導体封止用樹脂組成物
TWI487747B (zh) * 2009-02-09 2015-06-11 荒川化學工業股份有限公司 透明密封材組合物及光半導體元件
JP5108825B2 (ja) * 2009-04-24 2012-12-26 信越化学工業株式会社 光半導体装置用シリコーン樹脂組成物及び光半導体装置
WO2011125646A1 (ja) * 2010-03-31 2011-10-13 Jsr株式会社 硬化性樹脂組成物および発光装置
JP2012126756A (ja) * 2010-12-10 2012-07-05 Jsr Corp 硬化性樹脂組成物、及びそれを用いた発光装置
JP6347597B2 (ja) * 2013-12-05 2018-06-27 東京応化工業株式会社 シリカ系被膜形成用組成物及びこれを用いたシリカ系被膜の製造方法
JP6343947B2 (ja) * 2014-01-31 2018-06-20 住友化学株式会社 Ｕｖ−ｌｅｄ用ポリシルセスキオキサン系封止材組成物及びそのための金属アルコキシドの使用
US9954045B2 (en) * 2014-05-07 2018-04-24 Sharp Kabushiki Kaisha Electroluminescence device and method for producing same
CN105778505B (zh) * 2014-12-25 2019-04-30 广东生益科技股份有限公司 一种有机硅树脂组合物以及使用它的白色预浸料和白色层压板
JP2019077743A (ja) * 2017-10-20 2019-05-23 信越化学工業株式会社 レンズ用縮合硬化型シリコーン樹脂組成物
CN116606562B (zh) * 2023-04-27 2024-03-12 英德市城泰化工有限公司 一种钣金灰用高分散性膏体状过氧化苯甲酰的制备方法

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JP2858924B2 (ja) * 1990-10-22 1999-02-17 日本電信電話株式会社 プラスチック光導波路
US5561203A (en) * 1994-06-20 1996-10-01 Dow Corning Corporation Silicone pressure sensitive adhesive composition
JP3277749B2 (ja) * 1995-04-03 2002-04-22 信越化学工業株式会社 シリコーンゲル組成物及びポッティング材
JP3703116B2 (ja) * 1995-07-05 2005-10-05 信越化学工業株式会社 オルガノポリシロキサン樹脂の製造方法
US6191247B1 (en) * 1996-04-10 2001-02-20 The Yokohama Rubber Co., Ltd. Polysiloxane composition having superior storage stability and rubber composition containing same
IL126993A (en) * 1996-07-10 2002-12-01 Ibm Siloxane and siloxane derivatives as encapsulants for organic light emitting devices
US6905772B2 (en) * 2000-05-23 2005-06-14 Triton Systems, Inc. Abrasion and impact resistant coating compositions, and articles coated therewith
JP2004359756A (ja) * 2003-06-03 2004-12-24 Wacker Asahikasei Silicone Co Ltd Ｌｅｄ用封止剤組成物
US20060035092A1 (en) * 2004-08-10 2006-02-16 Shin-Etsu Chemical Co., Ltd. Resin composition for sealing LED elements and cured product generated by curing the composition
JP5034283B2 (ja) * 2005-03-22 2012-09-26 Ｊｓｒ株式会社 高屈折材料形成用組成物およびその硬化体、ならびに高屈折材料形成用組成物の製造方法

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US20060270786A1 (en) 2006-11-30
JP2006328315A (ja) 2006-12-07

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