JP4781961B2 - 電子装置及び照明器具 - Google Patents
電子装置及び照明器具 Download PDFInfo
- Publication number
- JP4781961B2 JP4781961B2 JP2006273796A JP2006273796A JP4781961B2 JP 4781961 B2 JP4781961 B2 JP 4781961B2 JP 2006273796 A JP2006273796 A JP 2006273796A JP 2006273796 A JP2006273796 A JP 2006273796A JP 4781961 B2 JP4781961 B2 JP 4781961B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- solder
- case
- electronic
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006273796A JP4781961B2 (ja) | 2006-10-05 | 2006-10-05 | 電子装置及び照明器具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006273796A JP4781961B2 (ja) | 2006-10-05 | 2006-10-05 | 電子装置及び照明器具 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008091817A JP2008091817A (ja) | 2008-04-17 |
JP2008091817A5 JP2008091817A5 (fr) | 2009-11-12 |
JP4781961B2 true JP4781961B2 (ja) | 2011-09-28 |
Family
ID=39375627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006273796A Active JP4781961B2 (ja) | 2006-10-05 | 2006-10-05 | 電子装置及び照明器具 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4781961B2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130099313A (ko) * | 2012-02-29 | 2013-09-06 | 엘지이노텍 주식회사 | 조명 장치 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5343542B2 (ja) * | 2008-12-08 | 2013-11-13 | 三菱電機株式会社 | 点灯装置及びこの点灯装置を備える照明器具 |
KR101229656B1 (ko) * | 2011-08-24 | 2013-02-04 | 김근배 | 스위칭 모드 파워 서플라이의 방열구조 |
JP6200693B2 (ja) * | 2013-05-24 | 2017-09-20 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
JP2013254742A (ja) * | 2013-07-30 | 2013-12-19 | Mitsubishi Electric Corp | 点灯装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2567974B2 (ja) * | 1990-06-30 | 1996-12-25 | 株式会社テック | 放電灯点灯装置 |
JPH1065385A (ja) * | 1996-08-21 | 1998-03-06 | Mitsubishi Electric Corp | 基板ケース構造体 |
JPH10224065A (ja) * | 1997-02-05 | 1998-08-21 | Japan Servo Co Ltd | 電子回路の放熱構造 |
JPH10308484A (ja) * | 1997-05-08 | 1998-11-17 | Casio Comput Co Ltd | 電子機器の放熱構造 |
JPH11213737A (ja) * | 1998-01-22 | 1999-08-06 | Toshiba Tec Corp | 放電灯器具 |
JP4200876B2 (ja) * | 2003-10-28 | 2008-12-24 | 株式会社明電舎 | 電子機器の冷却構造 |
-
2006
- 2006-10-05 JP JP2006273796A patent/JP4781961B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130099313A (ko) * | 2012-02-29 | 2013-09-06 | 엘지이노텍 주식회사 | 조명 장치 |
Also Published As
Publication number | Publication date |
---|---|
JP2008091817A (ja) | 2008-04-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI413221B (zh) | 電子封裝結構 | |
JPWO2010067725A1 (ja) | 回路モジュール | |
JP2008072062A (ja) | 実装構造、およびこれを備えた電子機器 | |
KR20090028415A (ko) | 소켓 | |
JP4781961B2 (ja) | 電子装置及び照明器具 | |
US8344462B2 (en) | Mounting device for a semiconductor package | |
JP2009272487A (ja) | 電子部品 | |
TWI495423B (zh) | 散熱模組及採用該散熱模組之電子裝置 | |
JP5222838B2 (ja) | 制御装置 | |
JP2010186907A (ja) | 放熱板とモジュールとモジュールの製造方法 | |
CN107452688B (zh) | 半导体装置 | |
JP5068098B2 (ja) | 放熱装置 | |
JP2020047765A (ja) | 電気機器及び放熱器 | |
JP2006286757A (ja) | 電子機器の放熱構造 | |
JP2006120996A (ja) | 回路モジュール | |
JP2012253135A (ja) | 放熱構造 | |
JP4375299B2 (ja) | パワー半導体装置 | |
JP2008103577A (ja) | パワーモジュールの放熱構造およびそれを備えたモータ制御装置 | |
JPH077109A (ja) | パッケージの実装構造 | |
JP2006041199A (ja) | 電子装置 | |
JPH02278856A (ja) | 半導体集積回路装置 | |
JP2002290091A (ja) | 放熱構造を有する電子回路装置 | |
JP2011066281A (ja) | 発熱デバイス | |
WO2023276647A1 (fr) | Structure de circuit et boîte de jonction électrique | |
JP2008288379A (ja) | 半導体パッケージ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090925 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090925 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20101220 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110105 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110222 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110705 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110706 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140715 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4781961 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |