JP4768606B2 - 配線基板用積層体 - Google Patents

配線基板用積層体 Download PDF

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Publication number
JP4768606B2
JP4768606B2 JP2006510413A JP2006510413A JP4768606B2 JP 4768606 B2 JP4768606 B2 JP 4768606B2 JP 2006510413 A JP2006510413 A JP 2006510413A JP 2006510413 A JP2006510413 A JP 2006510413A JP 4768606 B2 JP4768606 B2 JP 4768606B2
Authority
JP
Japan
Prior art keywords
polyimide resin
laminate
resin layer
wiring board
dianhydride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006510413A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2005084088A1 (ja
Inventor
宏遠 王
典子 力石
直子 大澤
浩信 川里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel and Sumikin Chemical Co Ltd
Original Assignee
Nippon Steel and Sumikin Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel and Sumikin Chemical Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Priority to JP2006510413A priority Critical patent/JP4768606B2/ja
Publication of JPWO2005084088A1 publication Critical patent/JPWO2005084088A1/ja
Application granted granted Critical
Publication of JP4768606B2 publication Critical patent/JP4768606B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
JP2006510413A 2004-02-26 2005-02-21 配線基板用積層体 Expired - Fee Related JP4768606B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006510413A JP4768606B2 (ja) 2004-02-26 2005-02-21 配線基板用積層体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004051167 2004-02-26
JP2004051167 2004-02-26
JP2006510413A JP4768606B2 (ja) 2004-02-26 2005-02-21 配線基板用積層体
PCT/JP2005/002729 WO2005084088A1 (ja) 2004-02-26 2005-02-21 配線基板用積層体

Publications (2)

Publication Number Publication Date
JPWO2005084088A1 JPWO2005084088A1 (ja) 2008-01-17
JP4768606B2 true JP4768606B2 (ja) 2011-09-07

Family

ID=34908624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006510413A Expired - Fee Related JP4768606B2 (ja) 2004-02-26 2005-02-21 配線基板用積層体

Country Status (5)

Country Link
JP (1) JP4768606B2 (ko)
KR (1) KR101077405B1 (ko)
CN (1) CN100566503C (ko)
TW (1) TW200528490A (ko)
WO (1) WO2005084088A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4907142B2 (ja) * 2005-10-13 2012-03-28 新日鐵化学株式会社 芳香族ポリアミド酸、ポリイミド及び配線基板用積層体
JP4962056B2 (ja) * 2007-03-09 2012-06-27 東洋紡績株式会社 銅張り積層フィルム及びその製造方法
WO2008126559A1 (ja) * 2007-03-30 2008-10-23 Nippon Steel Chemical Co., Ltd. ポリイミドフィルム
JP6839594B2 (ja) * 2016-04-27 2021-03-10 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム及び銅張積層板
JP7248394B2 (ja) * 2017-09-29 2023-03-29 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム及び金属張積層体
CN110241389A (zh) * 2018-03-08 2019-09-17 日铁化学材料株式会社 蒸镀掩模、蒸镀掩模形成用聚酰胺酸、蒸镀掩模形成用层叠体及蒸镀掩模的制造方法
CN109575831A (zh) * 2018-11-20 2019-04-05 深圳市弘海电子材料技术有限公司 低反弹力覆盖膜及其制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60250031A (ja) * 1984-05-28 1985-12-10 Hitachi Ltd 低熱膨張性樹脂材料
JPH06234916A (ja) * 1993-02-09 1994-08-23 Central Glass Co Ltd 低応力ポリイミド組成物および前駆体組成物溶液
WO1998008216A1 (fr) * 1996-08-19 1998-02-26 Nippon Steel Chemical Co., Ltd. Stratifie pour suspension d'entrainement de disques durs et sa fabrication
JPH1154862A (ja) * 1997-08-05 1999-02-26 Kanegafuchi Chem Ind Co Ltd ハードディスクサスペンション配線基材用ポリイミドフィルム
JPH11154314A (ja) * 1997-11-21 1999-06-08 Ube Ind Ltd 磁気ヘッドサスペンション及びその製造方法
JP2000198842A (ja) * 1998-12-28 2000-07-18 Nippon Telegr & Teleph Corp <Ntt> 光学基板用ポリイミド及び光学用ポリイミド基板
JP2002338710A (ja) * 2001-03-16 2002-11-27 Sumitomo Bakelite Co Ltd 表示素子用プラスチック基板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60250031A (ja) * 1984-05-28 1985-12-10 Hitachi Ltd 低熱膨張性樹脂材料
JPH06234916A (ja) * 1993-02-09 1994-08-23 Central Glass Co Ltd 低応力ポリイミド組成物および前駆体組成物溶液
WO1998008216A1 (fr) * 1996-08-19 1998-02-26 Nippon Steel Chemical Co., Ltd. Stratifie pour suspension d'entrainement de disques durs et sa fabrication
JPH1154862A (ja) * 1997-08-05 1999-02-26 Kanegafuchi Chem Ind Co Ltd ハードディスクサスペンション配線基材用ポリイミドフィルム
JPH11154314A (ja) * 1997-11-21 1999-06-08 Ube Ind Ltd 磁気ヘッドサスペンション及びその製造方法
JP2000198842A (ja) * 1998-12-28 2000-07-18 Nippon Telegr & Teleph Corp <Ntt> 光学基板用ポリイミド及び光学用ポリイミド基板
JP2002338710A (ja) * 2001-03-16 2002-11-27 Sumitomo Bakelite Co Ltd 表示素子用プラスチック基板

Also Published As

Publication number Publication date
CN100566503C (zh) 2009-12-02
KR101077405B1 (ko) 2011-10-26
CN1943285A (zh) 2007-04-04
KR20070007296A (ko) 2007-01-15
TWI372156B (ko) 2012-09-11
TW200528490A (en) 2005-09-01
WO2005084088A1 (ja) 2005-09-09
JPWO2005084088A1 (ja) 2008-01-17

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