JP4766821B2 - 基板にコーティングを施すための真空モジュール（及びその変形）とモジュールシステム - Google Patents

基板にコーティングを施すための真空モジュール（及びその変形）とモジュールシステム Download PDF

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Publication number
JP4766821B2
JP4766821B2 JP2002513962A JP2002513962A JP4766821B2 JP 4766821 B2 JP4766821 B2 JP 4766821B2 JP 2002513962 A JP2002513962 A JP 2002513962A JP 2002513962 A JP2002513962 A JP 2002513962A JP 4766821 B2 JP4766821 B2 JP 4766821B2
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JP
Japan
Prior art keywords
substrate
opening
vacuum
vacuum chamber
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2002513962A
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English (en)
Japanese (ja)
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JP2004504495A (ja
JP2004504495A5 (enExample
Inventor
ウラジーミル シリーパウ
ミカライ レウチュク
アリアクサンドル ハフロウ
セルゲイ マリシェフ
Original Assignee
イゾヴァク リミテッド
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Publication of JP2004504495A5 publication Critical patent/JP2004504495A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/46—Machines having sequentially arranged operating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2209/00—Apparatus and processes for manufacture of discharge tubes
    • H01J2209/01—Generalised techniques
    • H01J2209/012—Coating
    • H01J2209/015—Machines therefor

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
JP2002513962A 2000-07-05 2001-05-22 基板にコーティングを施すための真空モジュール（及びその変形）とモジュールシステム Expired - Fee Related JP4766821B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EA200000807 2000-07-05
EA200000807A EA003148B1 (ru) 2000-07-05 2000-07-05 Вакуумный модуль (его варианты) и система модулей для нанесения покрытий на подложку
PCT/EA2001/000002 WO2002008484A2 (en) 2000-07-05 2001-05-22 Vacuum module for applying coatings

Publications (3)

Publication Number Publication Date
JP2004504495A JP2004504495A (ja) 2004-02-12
JP2004504495A5 JP2004504495A5 (enExample) 2006-11-09
JP4766821B2 true JP4766821B2 (ja) 2011-09-07

Family

ID=8161557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002513962A Expired - Fee Related JP4766821B2 (ja) 2000-07-05 2001-05-22 基板にコーティングを施すための真空モジュール（及びその変形）とモジュールシステム

Country Status (7)

Country Link
JP (1) JP4766821B2 (enExample)
KR (1) KR100737035B1 (enExample)
CN (1) CN100348773C (enExample)
AU (1) AU6896001A (enExample)
EA (1) EA003148B1 (enExample)
MY (1) MY137307A (enExample)
WO (1) WO2002008484A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100914087B1 (ko) 2003-05-13 2009-08-27 어플라이드 머티어리얼스, 인코포레이티드 처리 챔버의 개구를 밀봉하기 위한 방법 및 장치
EA200501183A1 (ru) * 2005-07-18 2006-12-29 Владимир Яковлевич ШИРИПОВ Вакуумный кластер для нанесения покрытий на подложку (варианты)
EA009303B1 (ru) * 2006-05-15 2007-12-28 Владимир Яковлевич ШИРИПОВ Способ нанесения пленок нитрида кремния в вакууме (варианты)
EA034967B1 (ru) 2018-05-04 2020-04-13 Общество С Ограниченной Ответственностью "Изовак Технологии" Технологическая линия для формирования тонкопленочных покрытий в вакууме (варианты)
CN110592550A (zh) * 2019-10-28 2019-12-20 上海映晓电子科技有限公司 一种磁控溅射和电子束蒸镀双腔镀膜装置及其使用方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2008156A (en) * 1977-11-19 1979-05-31 Hunt C J L Vacuum Metallising Hollow Bodies
WO1997039160A1 (en) * 1996-04-18 1997-10-23 Kabushiki Kaisha Toshiba Method of producing a cathode-ray tube and apparatus therefor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5489369A (en) * 1993-10-25 1996-02-06 Viratec Thin Films, Inc. Method and apparatus for thin film coating an article

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2008156A (en) * 1977-11-19 1979-05-31 Hunt C J L Vacuum Metallising Hollow Bodies
WO1997039160A1 (en) * 1996-04-18 1997-10-23 Kabushiki Kaisha Toshiba Method of producing a cathode-ray tube and apparatus therefor

Also Published As

Publication number Publication date
EA003148B1 (ru) 2003-02-27
JP2004504495A (ja) 2004-02-12
WO2002008484A3 (en) 2002-07-04
KR20030024771A (ko) 2003-03-26
CN100348773C (zh) 2007-11-14
WO2002008484A2 (en) 2002-01-31
MY137307A (en) 2009-01-30
KR100737035B1 (ko) 2007-07-09
AU6896001A (en) 2002-02-05
EA200000807A1 (ru) 2002-02-28
CN1617947A (zh) 2005-05-18

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