MY137307A - Vacuum module (variants thereof) and system of modules for applying coatings to a substrate - Google Patents
Vacuum module (variants thereof) and system of modules for applying coatings to a substrateInfo
- Publication number
- MY137307A MY137307A MYPI20013177A MYPI20013177A MY137307A MY 137307 A MY137307 A MY 137307A MY PI20013177 A MYPI20013177 A MY PI20013177A MY PI20013177 A MYPI20013177 A MY PI20013177A MY 137307 A MY137307 A MY 137307A
- Authority
- MY
- Malaysia
- Prior art keywords
- substrate
- applying coatings
- modules
- module
- common
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 8
- 238000000576 coating method Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 238000001771 vacuum deposition Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/46—Machines having sequentially arranged operating stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2209/00—Apparatus and processes for manufacture of discharge tubes
- H01J2209/01—Generalised techniques
- H01J2209/012—Coating
- H01J2209/015—Machines therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EA200000807A EA003148B1 (ru) | 2000-07-05 | 2000-07-05 | Вакуумный модуль (его варианты) и система модулей для нанесения покрытий на подложку |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY137307A true MY137307A (en) | 2009-01-30 |
Family
ID=8161557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20013177A MY137307A (en) | 2000-07-05 | 2001-07-03 | Vacuum module (variants thereof) and system of modules for applying coatings to a substrate |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP4766821B2 (enExample) |
| KR (1) | KR100737035B1 (enExample) |
| CN (1) | CN100348773C (enExample) |
| AU (1) | AU6896001A (enExample) |
| EA (1) | EA003148B1 (enExample) |
| MY (1) | MY137307A (enExample) |
| WO (1) | WO2002008484A2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100914087B1 (ko) | 2003-05-13 | 2009-08-27 | 어플라이드 머티어리얼스, 인코포레이티드 | 처리 챔버의 개구를 밀봉하기 위한 방법 및 장치 |
| EA200501183A1 (ru) * | 2005-07-18 | 2006-12-29 | Владимир Яковлевич ШИРИПОВ | Вакуумный кластер для нанесения покрытий на подложку (варианты) |
| EA009303B1 (ru) * | 2006-05-15 | 2007-12-28 | Владимир Яковлевич ШИРИПОВ | Способ нанесения пленок нитрида кремния в вакууме (варианты) |
| EA034967B1 (ru) | 2018-05-04 | 2020-04-13 | Общество С Ограниченной Ответственностью "Изовак Технологии" | Технологическая линия для формирования тонкопленочных покрытий в вакууме (варианты) |
| CN110592550A (zh) * | 2019-10-28 | 2019-12-20 | 上海映晓电子科技有限公司 | 一种磁控溅射和电子束蒸镀双腔镀膜装置及其使用方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2008156B (en) * | 1977-11-19 | 1982-06-23 | Hunt C J L | Vacuum metallising of hollow articles |
| US5489369A (en) * | 1993-10-25 | 1996-02-06 | Viratec Thin Films, Inc. | Method and apparatus for thin film coating an article |
| KR100318724B1 (ko) * | 1996-04-18 | 2002-04-22 | 니시무로 타이죠 | 음극선관의제조방법및그장치 |
-
2000
- 2000-07-05 EA EA200000807A patent/EA003148B1/ru not_active IP Right Cessation
-
2001
- 2001-05-22 KR KR1020037000087A patent/KR100737035B1/ko not_active Expired - Fee Related
- 2001-05-22 AU AU6896001A patent/AU6896001A/xx active Pending
- 2001-05-22 CN CNB018121780A patent/CN100348773C/zh not_active Expired - Fee Related
- 2001-05-22 JP JP2002513962A patent/JP4766821B2/ja not_active Expired - Fee Related
- 2001-05-22 WO PCT/EA2001/000002 patent/WO2002008484A2/en not_active Ceased
- 2001-07-03 MY MYPI20013177A patent/MY137307A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EA003148B1 (ru) | 2003-02-27 |
| JP2004504495A (ja) | 2004-02-12 |
| WO2002008484A3 (en) | 2002-07-04 |
| KR20030024771A (ko) | 2003-03-26 |
| CN100348773C (zh) | 2007-11-14 |
| WO2002008484A2 (en) | 2002-01-31 |
| KR100737035B1 (ko) | 2007-07-09 |
| AU6896001A (en) | 2002-02-05 |
| JP4766821B2 (ja) | 2011-09-07 |
| EA200000807A1 (ru) | 2002-02-28 |
| CN1617947A (zh) | 2005-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0565001B1 (en) | Closed container to be used in a clean room | |
| CN105934837B (zh) | 允许低压工具替换的原子层沉积处理腔室 | |
| JP7084385B2 (ja) | 薄板状基板保持フィンガ、及びこのフィンガを備える搬送ロボット | |
| WO2002067298A3 (en) | Consecutive deposition system | |
| JP2021101472A (ja) | 電子デバイス製造用のロードポートの機器、システム、及び方法 | |
| WO2002089185A3 (en) | Triple chamber load lock | |
| EP1804274A3 (en) | Plasma processing apparatus | |
| JP2000195925A (ja) | 基板処理装置 | |
| EP1182695A3 (en) | Semiconductor processing module and apparatus | |
| US20200395232A1 (en) | Substrate process apparatus | |
| WO2000018980A8 (en) | An in-line sputter deposition system | |
| JPH04206547A (ja) | 装置間搬送方法 | |
| KR950035536A (ko) | 진공처리시시스템과 이에 사용되는 기판이송용 고정장치 및 진공게이트 밸브, 그리고 진공처리시스템에 사용되는 기판의 조작방법 | |
| WO2004009862A3 (en) | Substrate loading and unloading station with buffer | |
| TW359849B (en) | Sputtering apparatus having an on board service module | |
| WO2005022602A3 (en) | A method and apparatus for semiconductor processing | |
| MY137307A (en) | Vacuum module (variants thereof) and system of modules for applying coatings to a substrate | |
| US20100086392A1 (en) | Semiconductor container opening/closing apparatus and semiconductor device manufacturing method | |
| US8758513B2 (en) | Processing apparatus | |
| US6136167A (en) | Portable apparatus for thin deposition | |
| JPH03155619A (ja) | 真空処理装置 | |
| JPWO2020252476A5 (enExample) | ||
| JP2002128269A (ja) | 半導体基板搬送用フィンガ | |
| KR100898019B1 (ko) | 기판처리장치 | |
| JP3071517B2 (ja) | ゲートバルブ |