MY137307A - Vacuum module (variants thereof) and system of modules for applying coatings to a substrate - Google Patents

Vacuum module (variants thereof) and system of modules for applying coatings to a substrate

Info

Publication number
MY137307A
MY137307A MYPI20013177A MYPI20013177A MY137307A MY 137307 A MY137307 A MY 137307A MY PI20013177 A MYPI20013177 A MY PI20013177A MY PI20013177 A MYPI20013177 A MY PI20013177A MY 137307 A MY137307 A MY 137307A
Authority
MY
Malaysia
Prior art keywords
substrate
applying coatings
modules
module
common
Prior art date
Application number
MYPI20013177A
Inventor
Shyrypau Uladzirnir
Leuchuk Mikalai
Khakhlou Aliaksandr
Maryshev Sergei
Original Assignee
Shyrypau Uladzirnir
Leuchuk Mikalai
Khakhlou Aliaksandr
Maryshev Sergei
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shyrypau Uladzirnir, Leuchuk Mikalai, Khakhlou Aliaksandr, Maryshev Sergei filed Critical Shyrypau Uladzirnir
Publication of MY137307A publication Critical patent/MY137307A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/46—Machines having sequentially arranged operating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2209/00—Apparatus and processes for manufacture of discharge tubes
    • H01J2209/01—Generalised techniques
    • H01J2209/012—Coating
    • H01J2209/015—Machines therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A MODULE AND VARIANTS THEREOF FOR VACUUM DEPOSITION OF THIN-FILM MULTI-LAYER COATINGS ON SUBSTRATES ARE DESCRIBED. A MODULE SYSTEM FOR APPLYING COATINGS TO THE SUBSTRATES (3) E.G., CRT AND FLAT DISPLAYS, IS USED FOR DEPOSITION OF DIFFERENT THIN-FILMS TO SUBSTRATE (3) DIFFERENT SIZES. A VACUUM MODULE FOR APPLYING COATINGS TO A SUBSTRATE COMPRISES A VACUUM CHAMBER (1) WITH AN OPENING (2) FOR POSITIONING A SUBSTRATE (3) A SEALING MEMBER (4) AND A PROCESSING DEVICE (5) FOR APPLYING COATINGS; A VALVE GATE (6) MOUNTED IN THE PLANE PARALLEL TO THE SAID OPENING (2) TO SEPARATE THE PROCESSING DEVICE (5) FROM THE OPENING (2) A PROCESSING DEVICE-TRANSPORTING MECHANISM (7) MOVES RECIPROCALLY PARALLEL TO THE SUBSTRATE SURFACE. A SYSTEM OF MODULES COMPRISES SEVERAL MODULES HAVING A COMMON EVACUATION SYSTEM (32) AND A COMMON EVACUATION CONTROL SYSTEM (34) A COMMON HANDLING DEVICE CONTROL SYSTEM (5) FOR AUTOMATICALLY POSITIONING AND REMOVING THE SUBSTRATES (3) SEVERAL MODULES ARE DISPOSED WITHIN THE OPERATION ZONE OF ONE COMMON MANIPULATOR. (FIGURE 1)
MYPI20013177A 2000-07-05 2001-07-03 Vacuum module (variants thereof) and system of modules for applying coatings to a substrate MY137307A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EA200000807A EA003148B1 (en) 2000-07-05 2000-07-05 Vacuum module (variants thereof) and a system of modules for applying coatings to a substrate

Publications (1)

Publication Number Publication Date
MY137307A true MY137307A (en) 2009-01-30

Family

ID=8161557

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20013177A MY137307A (en) 2000-07-05 2001-07-03 Vacuum module (variants thereof) and system of modules for applying coatings to a substrate

Country Status (7)

Country Link
JP (1) JP4766821B2 (en)
KR (1) KR100737035B1 (en)
CN (1) CN100348773C (en)
AU (1) AU6896001A (en)
EA (1) EA003148B1 (en)
MY (1) MY137307A (en)
WO (1) WO2002008484A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7086638B2 (en) 2003-05-13 2006-08-08 Applied Materials, Inc. Methods and apparatus for sealing an opening of a processing chamber
EA200501183A1 (en) * 2005-07-18 2006-12-29 Владимир Яковлевич ШИРИПОВ VACUUM CLUSTER FOR APPLYING COATINGS ON A SUBSTRATE (OPTIONS)
EA009303B1 (en) * 2006-05-15 2007-12-28 Владимир Яковлевич ШИРИПОВ Method of application of silicon nitride films under vacuum (embodiments)
EA034967B1 (en) 2018-05-04 2020-04-13 Общество С Ограниченной Ответственностью "Изовак Технологии" Process line for vacuum formation of thin-film coatings (embodiments)
CN110592550A (en) * 2019-10-28 2019-12-20 上海映晓电子科技有限公司 Magnetron sputtering and electron beam evaporation double-cavity coating device and using method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2008156B (en) * 1977-11-19 1982-06-23 Hunt C J L Vacuum metallising of hollow articles
US5489369A (en) * 1993-10-25 1996-02-06 Viratec Thin Films, Inc. Method and apparatus for thin film coating an article
US6325901B1 (en) * 1996-04-18 2001-12-04 Kabushiki Kaisha Toshiba Method of producing a cathode-ray tube and apparatus therefor

Also Published As

Publication number Publication date
WO2002008484A3 (en) 2002-07-04
CN100348773C (en) 2007-11-14
KR20030024771A (en) 2003-03-26
AU6896001A (en) 2002-02-05
EA003148B1 (en) 2003-02-27
JP4766821B2 (en) 2011-09-07
WO2002008484A2 (en) 2002-01-31
EA200000807A1 (en) 2002-02-28
CN1617947A (en) 2005-05-18
JP2004504495A (en) 2004-02-12
KR100737035B1 (en) 2007-07-09

Similar Documents

Publication Publication Date Title
EP0565001B1 (en) Closed container to be used in a clean room
TW502284B (en) Multichamber system of etching facility for manufacturing semiconductor device
TW358221B (en) Etching apparatus for manufacturing semiconductor devices
TW202209533A (en) Load port operation in electronic device manufacturing apparatus, systems, and methods
KR20160111962A (en) Atomic layer deposition processing chamber permitting low-pressure tool replacement
WO2002067298A3 (en) Consecutive deposition system
KR20100065127A (en) Vacuum processing system and substrate transfer method
US20070137793A1 (en) Processing apparatus
EP1804274A3 (en) Plasma processing apparatus
JP2021101472A (en) Load port device, system, and method for manufacturing electronic device
EP1182695A3 (en) Semiconductor processing module and apparatus
KR100372500B1 (en) Sputtering apparatus having an on board service module
WO1996017971B1 (en) Sputtering apparatus having an on board service module
KR950035536A (en) Vacuum processing system, substrate transfer fixing device and vacuum gate valve used in vacuum processing system, and operation method of substrate used in vacuum processing system
US20200395232A1 (en) Substrate process apparatus
US20100086392A1 (en) Semiconductor container opening/closing apparatus and semiconductor device manufacturing method
MY137307A (en) Vacuum module (variants thereof) and system of modules for applying coatings to a substrate
US20070138009A1 (en) Sputtering apparatus
US6136167A (en) Portable apparatus for thin deposition
KR101931180B1 (en) Substrate treating apparatus and method for carrying in substrate
JPH03155619A (en) Vacuum processor
JPH0542507B2 (en)
US20070017802A1 (en) Automatic in-line sputtering system with an integrated surface corona pretreatment
JP2002128269A (en) Finger for conveying semiconductor substrate
KR200300370Y1 (en) Tweezer for transferring semiconductor wafer