CN100348773C

CN100348773C - Vacuum module (variants thereof) and system of modules for applying coatings to a substrate

Info

Publication number: CN100348773C
Application number: CNB018121780A
Authority: CN
Inventors: 乌拉迪齐默尔·夏伊里帕乌; 米卡拉伊·洛伊丘卡; 阿里克桑德尔·哈赫洛夫; 谢尔盖·马雷舍夫
Original assignee: YZOVAC CO Ltd
Current assignee: YZOVAC CO Ltd
Priority date: 2000-07-05
Filing date: 2001-05-22
Publication date: 2007-11-14
Anticipated expiration: 2021-05-22
Also published as: WO2002008484A3; KR20030024771A; AU6896001A; MY137307A; EA003148B1; JP4766821B2; WO2002008484A2; EA200000807A1; CN1617947A; JP2004504495A; KR100737035B1

Abstract

A vacuum module and variants thereof for vacuum deposition of thin-film multi-layer coatings on substrates are described.A module system for applying coatings to the substrates, e.g., CRT and flat displays, is used for deposition of different thin-films to substrates of different sizes.A vacuum module for applying coatings to a substrate comprises a vacuum chamber with an opening for positioning a substrate; a sealing member and a processing device for applying coatings; a valve gate mounted in the plane parallel to the said opening to separate the processing device from the opening. A processing device-transporting mechanism moves reciprocally parallel to the substrate surface. A system of modules comprises several modules having a common evacuation system and a common evacuation control system, a common handling device-control system for automatically positioning and removing the substrates. Several modules have one common manipulator.

Description

Be used for vacuum module and modular system to a kind of substrate applying coatings

Technical field

Described vacuum module and variant thereof are used for the field under some material vacuum moulding machines are on some substrates, this substrate comprises three-dimensional substrate, for example teletron, flat-panel screens etc., its objective is for formation multilayer film coating on its front surface, and this vacuum module can be used for vacuum deposition system.

Prior art

The modular system that is proposed is used for to the substrate applying coatings, this substrate for example is teletron, flat-panel screens etc., and this system can be used as a continuous operation system, be used on substrate the various film coatings of deposition, for example on the substrates such as the teletron of ", 21 " or flat-panel screens that are of a size of 14 ", 17 ", 18 with similar or different standards size.

The method and apparatus of the outside surface coating film coating of the teletron after a kind of assembling (cathode ray tube (CRT)) is well-known.

Sediment chamber in the existing existing apparatus that contains differential pumped vacuum systems comprises that a deposition region and one vacuumize the zone.

In the operation process of this device, the pressure in the deposition region is 1 * 10 ^-1-8 * 10 ^-1Within the Pa and vacuumize pressure in the zone 5 * 10 ^-3-7 * 10 ^-2Within the Pa.

The CRT that is installed on the substrate carrier carries along vacuum chamber.This substrate carrier is provided with barrier plate, and this barrier plate is divided into two zones with vacuum chamber, i.e. deposition region and vacuumize the zone.Electrically conducting coating in the existing apparatus for example is to adopt the magnetron sputtering system vacuum moulding machine in the band of a close CRT screen on this surface or the part of other grounded parts, so that eliminate the static charge on surface.〔1〕.

But, this existing apparatus has significant defective.

At first, owing to be a kind of subsequent treatment device, so the performance of this device is lower.

Secondly, in vacuum chamber, transmit the CRT that assembles and do not stop the various dirts on structural element surface and impurity to arrive on the surface to be applied, therefore can not guarantee desired coating quality.

Its three because in-line CRT applying step is arranged to a kind of mode continuously and in regular turn, so the fault of any single cell all can cause this system's dead halt in this system.This just means that the reliability of this device and wearing quality are lower, thereby reduces the performance of this device.

Its four, any preventative and operation modulability all can cause generative process out of service fully on the whole.

Its five, can not reduce the energy expenditure that each is coated with the CRT of deposition material pro rata with the performance of this system, because will make total system running just need all unit and subsystem all to turn round.

Also known a kind of vacuum deposition apparatus, this device comprises: vacuum chamber, this vacuum chamber has an opening, and this opening is used to lay a substrate; One sealing member and a coating executive device, this applying device is used for applying coatings.

This structure comprises a valve, and this valve is installed in and is parallel in the planar plane, vacuum chamber opening place and is used for the part that is furnished with deposition source of cavity space is separated with the part that this cavity space has this opening.

Therefore, deposition source-transporting mechanism transmits this deposition source in perpendicular to the planar plane of wherein laying substrate, that is, this transporting mechanism alternately takes this deposition source on the substrate so that this deposition source is placed this working position and it is recalled (2) from this working position.

But, this existing apparatus has some defective.

At first, transmit deposition source along direction and only can not to the substrate of the distance between the deposition source, provide homogeneity and uniform paint thickness greater than this substrate surface in its cross-sectional dimension perpendicular to substrate plane.

Secondly, described device can not carry out final ion cleaning to substrate surface.

Its three, this existing apparatus has certain degree of difficulty aspect the coating degree of depth, therefore, can not be reproduced in the step that applies multilayer film structure on CRT or the flat-panel screens adopting optics or quartzy mode to control.

Summary of the invention

Purpose of the present invention is exactly for the quality of improving the film coating on the substrate surface, homogeneity and homogeneity, to guarantee the purity of coating to be applied, expand the function and the working ability of this device, provide a kind of and on substrate, carry out the technology of continuously coating and adopt a untreated substrate to substitute a substrate of having handled apace.

In order to realize this purpose,,, include at a vacuum module that is used on substrate, applying according to the present invention (variant 1): a vacuum chamber, this vacuum chamber has an opening, and this opening is used to lay this substrate; One sealing member and one is used for the treatment unit of applying coatings; One valve, this valve are installed in and are parallel in the planar plane, vacuum chamber opening place, and this valve is used for the part with treatment unit and this opening of this cavity are separated; And a treatment unit transporting mechanism, this treatment unit transporting mechanism is mounted to and can be parallel to substrate surface and moves in a kind of reciprocating mode.

And according to the present invention (variant 2), this vacuum chamber has two openings that are used to lay substrate at least, and this treatment unit is mounted to and can be parallel to this substrate surface to-and-fro movement.

According to more than one variant of the present invention (variant 3), vacuum chamber also is equipped with a cover body, and this cover body is used to lay substrate, and treatment unit-transporting mechanism is mounted to a kind of like this form simultaneously, and promptly this mechanism can be parallel to this substrate surface to-and-fro movement.

Above-mentioned target can also realize by a kind of modular system of applying coatings that is used on substrate is provided, this system proposes as an invention, this system comprises that at least two vacuum module and these vacuum modules that constitute according to any aforementioned variant have the common vacuum pumping system, wherein, according to the present invention, these modules have a common pumping Controlling System, a common operating gear Controlling System, this operating gear Controlling System is used for the automatic loading and unloading substrate and has some processes sensor, wherein has two module arrangement at least in the operating area of this common Manipulators.

In these variants that propose as an invention, the periphery of vacuum chamber opening and the profile phase on surface to be applied coupling.

Also be provided with substrate carrier on this module, be used for fixing this substrate, this substrate carrier can not be provided with opening, an opening can be set or a plurality of openings are set simultaneously.

This substrate both can be placed in and also can be placed on the surface of substrate carrier on the opening that the substrate carrier surface forms, and in this case, reasonable is that this substrate carrier is made demountable form.

For fixed substrate, this substrate carrier can be arranged in the outside of this module, therefore substrate is sent to another position from a position safely, then it is placed on the module.

If substrate carrier is positioned at the open area of module vacuum chamber or is positioned at the zone of vacuum chamber cover body, the periphery of opening has the sealing member not only can fixed substrate and can seal substrate so.

In this case, substrate carrier is parallel to the plane of movement layout of treatment unit.Therefore, this substrate carrier open circumferential can not change with the profile phase coupling on surface to be applied, if substrate carrier is provided with at least one opening that is used to lay substrate, this substrate carrier opening parameter must change with the profile phase coupling on surface to be applied, at least one periphery sealing member that install and that be used for fixing this substrate along this opening must be set on this substrate carrier opening simultaneously.

When all being provided with two or more opening on vacuum chamber, substrate carrier and/or the cover body, they all are provided with one or several single additional valve and some sealing members for each opening, these valves are installed in and are parallel in the substrate rest planar plane, and the quantity of sealing member is determined by the quantity of vacuum chamber, substrate carrier or cover body split shed.

And, under a kind of particular case, can adopt a kind of cover body and/or substrate carrier that can be not used in the opening of laying substrate.In this case, undersized substrate is fixed on the inside of cover body and/or substrate carrier, towards the inside of vacuum chamber.If necessary, substrate and substrate carrier can be fixed on the vacuum chamber cover body together.Therefore, this cover body itself can play the effect of a substrate carrier.

In all module variants, this treatment unit transporting mechanism can constitute a kind of balladeur train form.

The formation that is arranged in the processing element on the balladeur train can be selected from a following set of pieces, this set of pieces comprises: vaporizer, magnetron cathode, cathodic deposition target compound, ion cleaning system and the ion sputtering system with rotary prism, this rotary prism can be parallel to vacuum chamber opening place Plane Installation, and at least one working-surface of this rotary prism is provided with the material for the treatment of sputter.

In this case, the structure of processing element is made the form of can replacing, and the cover processing element on treatment unit is by required treatment step and treat that the material of sputter limits.

In addition, the same with substrate carrier, the vacuum chamber cover body can have an opening or at least two openings, and the sealing member that is used for fixing this substrate is installed along its periphery.

According to the present invention, this cover body can be made detachable and/or replaceable form, and has different opening parameters and have various standard-sized substrates to be used for installing.The plane of movement that this cover body can act on substrate carrier and be parallel to treatment unit arranges, this treatment unit is mounted to that can be parallel to substrate surface reciprocating, in the opening of this substrate rest in the vacuum chamber cover body.

The structure of this vacuum module and embodiment variant is compared with the structure of the conventional apparatus that is used for similar purposes has some basic advantages.

Therefore, be mounted to and be parallel to the reciprocating treatment unit transporting mechanism of substrate surface and can on substrate, deposit the film coating that one deck has any physical size, it is adjusted that this size can also be passed through the size of a opening (variant 1) on vacuum chamber, substrate carrier and/or the cover body or a plurality of opening (variant 2), and can be by scanning gently and rhythmically that surface to be applied obtains homogeneity and paint thickness uniformly.

Coupling between the open circumferential in vacuum chamber, substrate carrier and/or the cover body and the profile of deposition surface can deposit the high-quality film of one deck on pending substrate surface, the whole area of the deposition surface of wherein being handled all has higher precision.

And, can be of different sizes at this cover body that can change and/or the opening in the substrate carrier, therefore, can be used for laying substrate, for example CRT or flat-panel screens (for example 14 ", 17 ", 19 " and 21 ") with different standards size.

In substrate carrier in the zone that is arranged in the vacuum chamber opening that is parallel to the treatment unit plane of movement and/or the cover body opening can be set.This makes the small size substrate be fixed on it on the surface of vacuum chamber inside, increases the multifunctionality of module thus, and maintenance simultaneously is deposited on the height of the quality of the film on the substrate surface.

Opening in substrate carrier and/or the cover body can also be handled the substrate of different standards size simultaneously, improve the performance of vacuum module thus and strengthen its function, and guarantee to form high-quality coating, because the profile phase on the parameter of these openings and surface to be applied coupling at substrate surface.

The sealing member that is placed in the opening of this vacuum chamber, substrate carrier or cover body guarantees that substrate is arranged on this opening tightly, forms sealing thus and forms high-quality deposit film at substrate surface.

Because it is dismountable that the structure of substrate carrier and/or cover body can be made, so this has further guaranteed the versatility of this module again.

In this case, this module cover body is parallel to the plane of movement layout of this treatment unit.

This treatment unit is mounted to this device can be parallel to the substrate surface to-and-fro movement.This positioned opposite of cover body, substrate and treatment unit has not only been guaranteed the versatility of vacuum module, and has guaranteed to have higher quality having the coating that applies on the standard-sized in a big way substrate.

The transporting mechanism that constitutes according to the present invention can deposit at the coating with various materials or its oxide compound or other materials and carry out a kind of successive in the process on the substrate surface and handle.

Brief Description Of Drawings

That shown in Figure 1 is the total figure that is referred to as the vacuum module of variant 1;

That shown in Figure 2 is the total figure that is referred to as the vacuum module of variant 2;

Shown in Figure 3 is substrate carrier and vacuum module cover body, and wherein in the substrate carrier, A is a substrate carrier that does not have opening, and B has the carrier of an opening, and C has the carrier of two openings; D is a vacuum module cover body that does not have opening, and E has the vacuum module cover body of an opening, and F has the vacuum module cover body of two openings;

That shown in Figure 4 is total figure of treatment unit transporting mechanism, and this mechanism constitutes the balladeur train form that processing element is installed on it, and wherein A is suitable for being equipped with an ion sputtering source and the prismatical balladeur train of a pair of commentaries on classics, and B is mounted in the processing element on the balladeur train;

Shown in Figure 5 is is used to apply total figure of the vacuum system of film coating.

The explanation of preferred embodiment

Be used for comprising to the vacuum module of substrate applying coatings according to first variant (Fig. 1): have the vacuum chamber 1 of opening 2, this opening is used to lay substrate 3; Sealing member 4 and treatment unit 5; Valve 6, this valve are installed in the planar plane, opening 2 place that is parallel to vacuum chamber 1, and are used for a part of space with treatment unit 5 and the opening 2 of this cavity 1 are separated; And the mechanism 7 that is used to transmit treatment unit 5.

It may be noted that the mechanism 7 that is used to transmit treatment unit 5 is mounted to and can be parallel to substrate 3 surperficial to-and-fro movements.

Different with first variant is, is provided with at least two openings 2,8 that are used to lay substrate 3 (3 ') on the vacuum module described in second variant, and this treatment unit 5 is mounted to the surperficial to-and-fro movement that can be parallel to this substrate 3 (3 ').

Different with preceding two variants is, it comprises cover body 9 (Fig. 3, D, the E that is used to lay substrate 3 (3 ') vacuum module of the 3rd variant, F) and the mechanism 7 that is used to transmit a treatment unit 5, this mechanism is mounted to the surperficial to-and-fro movement that can be parallel to described substrate.

Can be provided with a substrate carrier 10 on the module that constitutes by any described variant, this carrier can be positioned at the outside in the zone of vacuum chamber opening, even in the outside of module, guarantee the fixing of substrate in this case thus and guarantee with substrate from a location security be sent to the another location.

In other cases, substrate carrier can be positioned at the opening 2 or the opening 2 of this vacuum chamber 1, within 8 the zone, and can be designed to there is not opening or be designed to have at least an opening 11 or two openings 11, (11 ') (Fig. 3, A, B C) be used to lay substrate 3 (3 '), and sealing element 12 (12 ') is along opening 11, the periphery of (11 ') also is used for fixing substrate mouth 3, (3 ').In addition, this substrate carrier 10 can be made detachable.

Vacuum chamber 1 have sealing member 4,4 ' opening 2,8 make substrate carrier 10 can tightly be provided with and be fixed on the opening 2,8 of vacuum chamber 1.

The profile phase coupling on the periphery of the opening 11 of substrate carrier 10 (or opening 11,11 ') and surface to be applied, and reasonable be that substrate carrier 10 is mounted to the plane of movement that is parallel to treatment unit 5.

In the 3rd variant of vacuum module, the cover body 9 of vacuum chamber 1 is the same with substrate carrier 10, can constitute does not have opening that an opening 13 or two openings 13 and 14 maybe can be arranged, and can be provided with sealing

member

12a and 12b on it, so that fixing and sealing be placed in

substrate

3 and 3 on opening 13 and 14 ', and this cover body can be made detachable (Fig. 3, D, E, F).

In this case, sealing

member

12a and 12b critically are installed on the opening 13 and 14 of cover body 9 along the profile of described opening.

In addition, cover body 9 can act on substrate carrier 10 or lay substrate carrier 10 and substrate thereon.Like this, this cover body is mounted to the plane of movement that is parallel to treatment unit 5.

With the same in above-mentioned two kinds of (first and second) vacuum variants, guarantee that this cover body 9 tightly is provided with and fixed sealing member 4,4 ' the profile phase coupling on the surface to be applied among this periphery and the 3rd embodiment is installed along the opening 2 of vacuum chamber 1 or the periphery of opening 2,8.

For example, when some module variants provide two or more openings at vacuum chamber 1 (variant 2) or in vacuum chamber cover body 9 (variant 3), can will be installed in the additional valve 15 that is parallel in the substrate rest planar plane for each opening is provided with one on this vacuum chamber.

In first, second and the 3rd variant of module, be formed at vacuum chamber 1 or substrate carrier 10 (variant 1,2,3) or the periphery of the opening in the cover body 9 (variant 3) must with the profile optimum matching on surface to be applied, and be installed on these openings sealing member must with the profile phase coupling of described opening.

In addition, all module variants all relate to the mechanism 7 that adopts balladeur train 16 conducts to be used to transmit treatment unit 5, and this treatment unit comprises some processing elements.

The formation of the processing element on the balladeur train constitutes from following group, this group comprises vaporizer 17, magnetron cathode 18, cathode sputtering target compound 19, ion cleaning system 20 and the ion sputtering system 21 with rotary prism 22, and this rotary prism 22 is mounted to the plane, opening place that is parallel to vacuum chamber 1 and it has at least a working-surface to be provided with a kind of material (Fig. 4) for the treatment of sputter.

In addition, all processing

elements

17,18,19,20,21,22 and 23 are all made the form that can replace, and its combination on treatment unit can and treat that the material of sputter regulates according to required treatment step.

Also be provided with a kind of gas/water/electric plenum system 24 (Fig. 1) and Optical devices 25 and quartz devices 26 on this module (in all three kinds of variants), be used to control the thickness (Fig. 2) of thin film deposition, and, in addition, also be provided with a forepump 27 and a diffusion pump 28 (Fig. 1), and preferably also be provided with an additional forepump 29 (Fig. 2).

Also be provided with valve V1, V2, V3 and V4 and a drive unit C1 on this vacuum module, wherein valve V1, V2, V3 and V4 are used for

pump

27,28 and 29 is connected to vacuum chamber 1, and drive unit C1 (Fig. 1) is used for opening and closing valve 6 or valve 6,15 (Fig. 2).

Shown in Figure 5 is the modular system that is used for the pattern coated substrates of a kind of automatic loading and unloading substrate 3 (3 '), and this system for example comprises two according to any one vacuum module made 30,31 in three kinds of variants.

Described module is provided with a common pumped vacuum systems 32, processes sensor 33, common pumped vacuum systems 34, a common operating gear Controlling System 35, this Controlling System comprises a transporting mechanism 36 and a common mechanical manipulator shovel loader 37 and is used for automatically loading and unloading substrate 3 (3 '), and also is provided with and vacuumizes station 38,39.It is pointed out that described module is positioned at the operating area of common mechanical manipulator shovel loader 37.

A high vacuum module (variant 1) that proposes as an invention is operated in the following manner.

When originally opening, utilize forepump 27 diffusion pump 28 to be vacuumized by the valve V3 that opens, be heated and be forced into operation mode fully up to diffusion pump.

Utilizing forepump 27 by valve V2 vacuum chamber 1 to be vacuumized then makes pressure be reduced to a specific pressure.This valve 6 is closed under original state, and the segment space that is furnished with treatment unit 5 and the opening 2 of vacuum chamber 1 are separated.

In case reach required pressure, valve V2 closes, and diffusion pump 28 links to each other with the described space of vacuum chamber 1 so that make the required vacuum pressure of generation in it.

Simultaneously, substrate 3 (for example CRT front surface) is placed on the elastic sealing element 4 on the opening 2 that is installed on vacuum chamber 1 or is placed on the sealing member 12 on the opening 11 that is installed on substrate carrier 10, valve V 1 opens subsequently, and utilizes 27 pairs of spaces that limited by the front surface that has elastic sealing element and the valve 6 of this substrate of forepump to vacuumize.In case reach required pressure, valve V1 just closes and utilizes drive unit C1 Open valve 6, and this drive unit C1 for example is a kind of pneumatic linear actuator (not shown in the accompanying drawings).

After after a while, the pressure in the whole vacuum chamber 1 at first reaches balance, and reaches this preset value subsequently.

In case reach required pressure, be enabled in on-chip coated technique step with regard to actual.

For this reason, be generally Ar or O ₂Working gas flow to ion cleaning system 20 in the initial treatment stage by gas/water/electric delivery system 24 (Fig. 1), and start to adopt the mechanism 7 of balladeur train 16 forms, this mechanism is used to transmit treatment unit 5.

Processing

element

17,18,19,20,21,22 and 23 (Fig. 4) are installed on the treatment unit 5, and these elements are used to carry out and the relevant particular step of deposition certain material on the substrate front surface.

Supply with a high-voltage to ion sputtering system 20, and in a special time period, the surface of substrate 3 is exposed under the geseous discharge ion.In case reach the terminal point in this section timed interval, this feed unit and working gas supply Controlling System just are transported to argon-oxygen mixture among the gas main so that obtain a specific pressure in vacuum chamber 1.

Then, an ionic current flows to rotary prism 22 from ion sputtering source 21, and places the wherein a kind of material on the surface 23 of this rotary prism 22 to be splashed on the substrate 3.

In this case, balladeur train 16 or any other mechanism 7 that is used to transmit treatment unit 5 can be parallel to the surperficial to-and-fro movement of substrate 3.

During the front surface to substrate 3 deposits the timed interval of the first layer, the device of indicating this processing step to reach home, especially optics control transmitter 25 and quartzy control transmitter 26 (Fig. 2) are opened, in case and this signal reads the required value on this indicating unit, the step of deposition the first layer just stops.

After outage and cutting off the supply of this gaseous mixture, rotary prism 22 rotates to the position that has 23 places, surface of another kind of material on its another its.

This argon-carrier of oxygen mixture is fed to ion sputtering system 21, supplies with high pressure and lights discharge gas.Subsequently, when balladeur train 16 is kept in motion, sputter and this material of deposition, especially a kind of oxidation synthetics on the surface of substrate 3 in a designated time intervals.

Preset value on this signal arrival indicating unit when promptly reaching the preset value on optics control transmitter 25 and the quartzy control transmitter 26, then finishes the deposition of the second layer.

And, as required, can be repeated repeatedly in on-chip first and second layer deposition steps

In other cases, the combination that is deposited on the material on the substrate surface can be different, and comprise pure metal and its oxide compound and the nitride on some working-surface 23 that is positioned at rotary prism 22 or be positioned at other compounds on the working-surface 23 of rotary prism 22.

For this reason, can pass through

processing element

17,18,19,21,22,23 and the ion cleaning system 20 that gas/water/electric system 24 (Fig. 1) is given the gas delivery of necessity treatment unit (Fig. 4).

According to the difference of purpose of coating thin film layer, not only can adopt optics control transmitter 25 and quartzy control transmitter 26 as indicating unit, and the combination that can adopt these two kinds of transmitters is as indicating unit.

Under minimum sweep limit, obtain maximum homogeneity in order to ensure substrate 3 surface applied, adopt a kind of software program of special exploitation to be used to provide the computer control instruction so that scan with respect to substrate 3 by the balladeur train 16 that has processing

element

17,18,19,20,21,22 and 23 on it.

Therefore, can on the surface of substrate 3, alternately form oxide compound and metallic paint.The electroconductibility of metal level guarantees that resistivity is lower, adopts oxide compound to reduce the reflection coefficient of substrate 3 front surfaces simultaneously.

In case finish the applying step on substrate 3, valve 6 is just closed and air just is fed to space under the substrate, then substrate 3 is taken out and change a new substrate from the opening 2 of vacuum chamber 1.Under this feelings, the treatment unit 5 that processing element is installed still is in the high vacuum region.

After new substrate is arranged, repeat this circulation.

Processing element that it should be noted that the treatment unit 5 that always is in the high vacuum environment can turn round under the situation that does not need to spend the long period to carry out prophylactic cleaning and maintenance.In addition, can not appear at and depart from sedimentary accumulation on vacuum wall and the instrument, can not see the pollution of processing element yet.

Running in order to ensure the module that constitutes according to variant 2, wherein vacuum chamber 1 be provided with at least two openings 2 and 8 and treatment unit 5 be parallel to substrate 3 and 3 ' surperficial to-and-fro movement, the former is provided with an additional forepump 29, this forepump is used for continuously diffusion pump 28 being vacuumized by valve V3, makes module reach its operating readiness faster thus.

When having two operation aperture 2 and 8 and the module (Fig. 2) of valve 6 and 15 when switching at first, vacuum chamber 1 substrate 3 and 3 ' and valve 6 and 15 between the space adopt forepump 27 alternately to vacuumize by valve V1 and V4.

Valve 6 and 15 was closed and the space and the opening 2 and 8 of vacuum chamber 1 is separated in the starting stage.When module arrives operating readiness, substrate 3 is placed on the sealing member 12 (Fig. 2) of opening 2 of vacuum chamber 1.Adopt forepump 27 space between valve 6 and the substrate 3 to be vacuumized by valve V1.

In case reach specific pressure in the described space in the vacuum chamber 1, valve 6 is opened and beginning applies on substrate 3.

For this reason, transporting mechanism 7 is for example taked the form of balladeur train 16 and is furnished with a

cover processing element

17,18,19,20,21,22 and 23 thereon, and this transporting mechanism scans so that alternately deposit the required number of plies on the surface at this substrate the surface of substrate 3 in the zone of opening 2 in the mode similar with aforesaid way.

When the substrate 3 on the opening 2 that places vacuum chamber 1 is in applying step, on the opening 8 that has sealing member 12 (Fig. 2), and adopt forepump 27 space that is limited by the valve 15 and second substrate of vacuum chamber 1 to be vacuumized second substrate rest through valve V4.

Till applying step to the substrate 3 finishes, place the bottom of second substrate on the opening 2 of vacuum chamber 1 can produce required pressure.

In case the applying step on the substrate 3 finishes, valve 6 is just closed, change substrate 3 and open vacuum valve 15 immediately, the balladeur train 16 that is furnished with processing element on it begins the surface of second substrate in the zone of the opening 8 that is arranged in vacuum chamber 1 is scanned so that by the above-mentioned steps coating of deposition necessary amount on this substrate surface alternately.

Therefore, in described second module variants, processing element turns round in the layout of this necessity and carries out the alternative applying step, promptly at first carries out applying step on the substrate in placing the zone of opening 2 and is placing subsequently on second substrate in opening 8 regional and carry out applying step.

Described module variants also provides a kind of purposes for the substrate carrier 10 that is installed on the sealing member 4 (4 '), guarantees that promptly substrate carrier tightly arranges and be fixed on the opening 2 or opening 2,8 of vacuum chamber 1.

In this case, the substrate carrier 10 (Fig. 3 A) that does not have an opening is parallel to the plane of movement of treatment unit 5 to be installed, and with the small size substrate be fixed on this substrate carrier on the surface of the inside of vacuum chamber 1.

On described substrate, carry out applying step in the above described manner.

If substrate carrier is positioned at the outside of module, this carrier just plays an effect that is fixed to substrate on this carrier surface or is fixed on the retaining element on the opening that forms in this carrier, and help transmitting substrate and with substrate rest on module so that apply its surface.

Perhaps, substrate carrier 10 can be made detachable and which is provided with the opening 11 (11 ') that at least one has a sealing member 12 (12 '), and substrate 3 (3 ') is laid on this opening and with the step similar with above-mentioned steps it is carried out applying step.

In the 3rd variant of module, it comprises that one is used to lay the cover body 9 of substrate, and treatment unit transporting mechanism 5 is mounted to and can makes it be parallel to the surperficial to-and-fro movement of the substrate in the cover body 9 that is arranged in vacuum chamber 1.

In described module variants, cover body 9 can be made detachable and as substrate carrier 10.As in the second module embodiment, undersized substrate can be fixed to not processing opening and on the surface of the inside of vacuum chamber 1, and on described substrate, carrying out applying step of cover body 9 according to above-mentioned steps.

In addition, can in this cover body 9, be formed with and be used to lay one, an opening of two or more employing sealing member fixed large size substrates 13, two openings 13,14 or a plurality of openings.

Adopt the method described in the variant of first and second modules on substrate, to carry out applying step.

The vacuum module that employing constitutes according to aforementioned any variant

On the glass surface of CRT (substrate), carry out the specific embodiment of thin film cladding technology

The vacuum module that constitutes according to variant 1 is used for applying on the front glass surface of CRT in the following manner with following mode operation.

Originally, utilize forepump 27 diffusion pump 28 to be vacuumized till diffusion pump is heated and is forced into operation mode through valve V3.

Utilizing forepump 27 through valve V2 vacuum chamber 1 to be vacuumized subsequently makes pressure be reduced to about 6-10Pa.Valve 6 in the early stage the stage close and will have in the vacuum chamber 1 of treatment unit 5 segment space separate with opening 2.

In case reach described pressure, valve V2 closes and diffusion pump 28 links to each other with the described space of vacuum chamber 1 and produce ≈ 1.3 * 10 therein ^-3The pressure of Pa.

The front glass surface of CRT places on the elastic sealing element 4 on the opening 2 that is placed in vacuum chamber 1.Follow open valve V1 and utilize forepump 27 in the space of CRT front glass surface and valve 6 qualifications, to form ≈ 10Pa pressure.In case reach this pressure, with regard to shut-off valve V1 and adopt pneumatic linear actuator (not illustrating in the accompanying drawing) driving mechanism C1 to open valve 6.

After 30 seconds, this pressure at first reaches balance and reaches ≈ 8 * 10 subsequently in the whole space of vacuum chamber 1 ^-3Pa.In case reach described pressure, just in fact be enabled in the lip-deep applying step of front glass of CRT.

For this reason, processing gas (is generally Ar or O first the treatment stage ₂) flow to ion cleaning source 20, and start the transporting mechanism 7 of a balladeur train 16 forms, particle cleaning source 20 and ion sputtering source 21 are installed on this balladeur train, have rotary prism 22 on this sputtering source, this rotary prism is furnished with a kind of metal on surface 23 therein and is furnished with a kind of metal oxide on its another surface (Fig. 4).

Give the electrode of particle cleaning source 20 with the high-pressure delivery of 2-2.5KV, and the teletron glass surface is continued to be exposed under the venting ion 0.5-1 minute, thus described lip-deep all impurity are all disposed fully.

After that for some time of process, thereby adopt power supply unit and working gas transport control system to make the pressure in the vacuum chamber 1 reach 7～8.5 * 10 the gas main that a kind of argon-oxygen mixture flows to gas/water/electric system 24 ^-2Pa.

Ionic current with 0.4-0.6A flows to rotary prism from ion sputtering source 21 subsequently,, and make metal (for example In-Sn) on one of them surface 23 be positioned at rotary prism 22 deposit on the CRT glass surface and continue one minute.

When doing like this, the balladeur train 16 that is furnished with processing element on it is parallel to the CRT glass surface and moves back and forth.

During the timed interval of deposition the first layer on the CRT front glass surface, open the step device for indicating end, especially optics control transmitter 25 and quartzy control transmitter 26 (Fig. 2), in case and this signal reach desirable value on this indicating unit, the step of this deposition the first layer just stops.

After outage and cutting off the supply of gaseous mixture, rotary prism 22 rotates to another surface, places another kind of material on this another surface.

Argon-carrier of oxygen mixture is flowed to ion sputtering source 21, supply with the high pressure of 2000～3500V and light by the electric current of one 0.3～0.4A, by this effect, when balladeur train 16 is parallel to this CRT surface and moves back and forth, the sputter second layer also continues 1-2 minute on the CRT glass surface, especially sputter second class nonmetal oxide, for example SiO ₂

When this signal reaches designated value on this indicating unit, when promptly reaching the designated value on optics control transmitter 25 and the quartzy control transmitter 26, finish the deposition of the second layer.

According to the needs of coating ion processes, can also repeatedly repeat the step of one and the second layer of coating on substrate 3.

In other cases, the combination that will be deposited on the material on the substrate surface can be different, and both comprised that the pure metal on the different operating surface 23 that is positioned at rotary prism 22 also comprised its oxide compound or nitride or other compounds.

For this reason, by gas/water/electric system 24 should necessity gas delivery give on the

processing element

18,19,21,22 and ion sputtering source 20 of treatment unit 5.

According to the difference of purpose of coating thin film layer, not only can adopt optics (reflection and transmission) control transmitter and quartzy control transmitter as indicating unit, and the combination that can adopt these two kinds of transmitters is as indicating unit.

Obtain maximum homogeneity in order to ensure the CRT surface applied in minimum sweep limit, adopted a kind of software program of special exploitation to be used to provide the computer control instruction so that scan with respect to CRT surface to be applied by the balladeur train 16 that has processing

element

17,18,19,20,21,22 and 23 on it.

Therefore, on the glass surface of CRT, alternately form oxide compound and metallic paint.The electroconductibility of metal level guarantees that resistivity is lower, promptly～and 10 Ω/cm ², adopt simultaneously oxide compound with the reflection coefficient of CRT glass front from originally 6.5% be reduced to ≈ 1.5%.

In case finish the applying step on the CRT glass surface, flow in the space under the CRT with regard to valve-off 6 and with air, then CRT is taken out and changes a new CRT from the opening 2 of vacuum chamber 1.In this case, the treatment unit 5 of installation processing element still is arranged in high vacuum region.

After new CRT is arranged, repeat this coating circulation.

Processing element that it should be noted that the treatment unit 5 that continues to be in the high vacuum environment can turn round under the situation that does not need long-time prophylactic cleaning and maintenance.In addition, the sedimentary accumulation that departs from vacuum wall and the instrument can not occur, can not occur the pollution of processing element yet.

Running in order to ensure the module that constitutes according to embodiment 2, wherein vacuum chamber 1 be provided with at least two openings 2 and 8 and treatment unit 5 be parallel to the surperficial to-and-fro movement of the substrate that is placed on the described opening, the former is provided with additional forepump 29, be used for continuously diffusion pump 28 being vacuumized, make module reach its operating readiness faster thus by valve V3.

When originally to having two operation aperture 2 and 8 and during the energising of the module (Fig. 2) of valve 6 and 15, adopt forepump 27 by valve V2 vacuum chamber 1 tentatively to be vacuumized, then forepump 27 by valve V1 and V4 vacuumizing vacuum chamber 1 with being placed in CRT on opening 2 and 8 and the space-alternating between valve 6 and 15.

Valve 6 and 15 was closed and the space and the opening 2 and 8 of vacuum chamber 1 is separated in the starting stage.When module arrives operating readiness, a CRT is placed on the sealing member 12 (Fig. 2) of opening 2 of vacuum chamber 1.Adopt forepump 27 valve 6 of vacuum chamber 1 and the space between the CRT front glass surface to be vacuumized by valve V1.

In case the pressure in the described space in the vacuum chamber 1 reaches specified pressure～1 to 10Pa, with regard to Open valve 6 and be enabled in applying step on the CRT.

For this reason, the balladeur train 16 that is furnished with a

cover processing element

17,18,19,20,21,22 and 23 on it adopts aforesaid step in the zone of opening 2 surface of CRT to be scanned so that alternately deposit the required number of plies in its surface.

When the CRT glass surface on the opening 2 that places vacuum chamber 1 is in applying step, the 2nd CRT3 ' is placed on second opening 8 that has sealing member 12 ' (Fig. 2).

Adopt forepump 27 valve 15 by vacuum chamber 1 of vacuum chamber 1 to be vacuumized with the space that the front glass surface that is positioned at the 2nd CRT3 ' on the opening 8 limits subsequently through valve V4.

When the applying step on the CRT3 to the opening 2 that is positioned at vacuum chamber 1 finishes, can produce～1 to 10Pa pressure in the bottom of the 2nd CRT3 '.

In case the lip-deep applying step of a CRT3 finishes,, adopt next CRT to replace a CRT3 and also open vacuum valve 15 immediately with regard to valve-off 6.

At that time, being furnished with a balladeur train 16 that overlaps processing element on it begins the surface of the 2nd CRT in the zone that is placed in opening 8 is scanned so that alternately deposit the coating of the necessary number of plies on the front surface of CRT by above-mentioned steps.

Therefore, in described second module variants, the processing element operate continuously is with a kind of over-over mode applying coatings and placing applying coatings on second substrate in opening 8 regional subsequently on the substrate 3 in placing the zone of opening 2 at first.

Provide one as substrate carrier 10 in the variant of all vacuum modules and the function that can enlarge claimed theme as the cover body in the 3rd embodiment of module 9 significantly; and not only can for example apply film coating on the front glass surface of CRT or the flat-panel screens on the surface of large-size, and can be fixed on substrate carrier or do not contain opening and small size surface on the cover body 9 of the inside of vacuum chamber 1 on apply film coating.

In this case, the step that applies on the surface of described substrate remains unchanged.

In addition, substrate carrier 10 can be positioned at the outside of module, plays the effect of a substrate retaining element, and create a kind ofly be used for preliminary favourable condition of placing, transmit substrate and and with substrate rest on module so that carry out applying step in its surface.

The modular system that is used for applying coatings on picture tube surface (Fig. 5) of asking for protection comprises at least two that make according to any variant of three kinds of variants and have common vacuum pumping system 32 and processes sensor 33

vacuum modules

30,31.

These

modules

30,31 are provided with a common vacuum pumping Controlling System 34, a common operating gear Controlling System 35, this operating gear Controlling System comprises a transport unit 36 and a mechanical manipulator shovel loader 37, and the module that this mechanical manipulator shovel loader can be not simultaneously be limit for the number of the operating area that is positioned at this common mechanical manipulator shovel loader 37 provides service.

This common vacuum pumping system 32 comprises two

forvacuum stations

38 and 39, and this common mechanical manipulator shovel loader 37 is placed into CRT on the module with different structure and with CRT and takes away from these modules.

CRT can be placed in advance and is fixed in the opening of substrate carrier 10, and mechanical manipulator shovel loader 37 can be placed on the module CRT that combines with substrate carrier 10 so that apply film in its surface.

The claimed modular system that is used for applying on substrate is worked in the following manner.

For being applicable to simultaneously having on the CRT of different structure (for example CRT of 19 " and 21 "), module group (two or more) applies, to have standard-sized CRT and place on the opening of vacuum chamber of

module

30,31, the parameter of its size and affiliated opening is complementary.

Vacuum pumping Controlling System 34 comprises that vacuum pump sees off 38,39.All diffusion pump that 39 pairs of this vacuum station are integrated into the common pumped vacuum systems 32 of

module

30 and 31 vacuumize, and the vacuum chamber 1 of 38 pairs of described modules of vacuum station alternately vacuumizes simultaneously.

Simultaneously, operating gear Controlling System 35 flows to transport unit 36 and common mechanical manipulator shovel loader 37 by transmitter 33 with a signal, wherein, transport unit 36 is carried CRT and mechanical manipulator shovel loader 37 is placed on CRT on the opening of

module

30,31 so that its front surface is applied.

In this case, transmitter 33 provides the information of CRT size and type aspect.This information is used to be enabled in the particular step at particular module variant place, and the processing element of guaranteeing the coating of necessary material promptly will be installed, and keeps its suitable applying step and pattern thereof constant simultaneously.

Move this applying step of common computer control of a kind of software program of special exploitation.In order to carry out described step, required processing element, for example ion cleaning source and ion sputtering source 21 with rotary prism 22 are installed on the balladeur train 16, contain the various materials for the treatment of sputter on the surface of this rotary prism.

In other cases, when needs sputter other materials 1, a magnetron cathode 18 or cathodic deposition target 19 can be installed on balladeur train 16.In some cases, can with any other processing element for example vaporizer 17 be installed on the balladeur train 16 as a material source to be applied.

Working gas flows to the source 20 that is installed on the movable balladeur train 16 by cable laying machine C1,21 house steward and one gas/water/electric plenum system 24, thereby simultaneously cooling vacuum chamber 1 and

processing element

17,18,19,20,21,22 and 23 and to these vacuum chambers 1 and processing element power supply are provided with one and overlap metal hose and cable in this layings machine.

When signal when transmitter 33 reaches common mechanical manipulator shovel loader 37, the CRT that this mechanical manipulator shovel loader 37 (according to this embodiment module difference) will have a specific criteria size places on each opening of vacuum chamber 1 of disparate modules, or place on each opening of substrate carrier 10 of disparate modules, perhaps place the opening of the cover body 9 of disparate modules, and in case adopt forepump (forepump) 27 and high vacuum vacuum pumping pump (diffusion pump) 28 to make the vacuum chamber 1 of affiliated module reach required pressure, just begin to begin CRT applying step on glass, this module included all devices and element are all turned round by aforesaid technology.

The described system that is used for applying on substrate compares with the traditional vacuum series system with similar purposes has higher reliability, because the inefficacy of one or more modules can not make total system all shut down.

In addition, if necessary, by some add-on modules of integrated interpolation or remove certain module from this system can be so that this system has elasticity.

The multifunctionality of this vacuum module and its variant has been guaranteed not only can be on the surface of reduced size but also can apply high-quality coating on the large size surface.

Optics control and quartzy control to coat-thickness not only can apply multilayer film structure on the CRT glass surface, and can apply multilayer film structure on other substrates of needs reprocessing.

This claimed vacuum module and its variant are multi-functional and have performance characteristics.

In addition, because its multifunctionality, claimed vacuum module and its variant can adopt any combination and version to be used for applying on substrate in maneuverable vacuum system.

Claimed module can not hinder this vacuum system to do to exchange under the situation of as a whole continuous operation.

In addition, the unitary inefficacy of any individual system can not influence the running of total system, i.e. the inefficacy of at least one module can not cause the shutdown of total system, therefore, has kept reliability and its further running of this system.

The module that is used for applying on substrate (and variant) and the modular system that propose as an invention have versatility and commercial practicality.

Reference:

1. U.S. Pat 5489369; IPC:C23C14/56; The open date: on February 6th, 1996.

2. German Patent P4313353.3; IPC:C23C14/22; The open date: on October 27th, 1994.

3. U.S. Pat 5372693; IPC:C23C14/34; The open date: on December 13rd, 1994.

Claims

1. vacuum module that is used for applying coatings on a kind of substrate, this module comprises:

Vacuum chamber, this vacuum chamber is provided with the opening that is used to lay substrate;

Sealing member and the treatment unit that is used for applying coatings;

Valve, this valve arrangement are in being parallel to the planar plane, described opening place of this vacuum chamber and be used for a part of space that is furnished with treatment unit and the described opening of this vacuum chamber are separated; And

The treatment unit transporting mechanism is characterized in that, described treatment unit transporting mechanism is mounted to it and is parallel to the substrate surface to-and-fro movement.

2. vacuum module that is used for applying coatings on a kind of substrate, this module comprises:

Sealing member and the treatment unit that is used for applying coatings;

The treatment unit transporting mechanism is characterized in that, described vacuum chamber is provided with at least two openings that are used to lay substrate, and wherein treatment unit is mounted to and is parallel to the substrate surface to-and-fro movement.

3. vacuum module that is used for applying coatings on a kind of substrate, this module comprises:

Vacuum chamber, this vacuum chamber is provided with the opening that is used to arrange substrate;

Sealing member and the treatment unit that is used for applying coatings;

The treatment unit transporting mechanism is characterized in that, also is provided with the cover body that is used to place substrate on the described vacuum chamber, and described treatment unit transporting mechanism is mounted to it and is parallel to the substrate surface to-and-fro movement.

4. as any one the described vacuum module that is used for applying coatings on a kind of substrate among the claim 1-3, wherein, the profile phase on the periphery of described vacuum chamber opening and surface to be applied mates.

5. as claim 1, any one the described vacuum module that is used for applying coatings on a kind of substrate in 2,3, wherein, described module is provided with substrate carrier, and this carrier is arranged in the zone at vacuum chamber opening place.

6. the vacuum module that is used for applying coatings on a kind of substrate as claimed in claim 5, wherein, the described substrate carrier of this module is made detachable.

7. as any one the described vacuum module that is used for applying coatings on a kind of substrate among the claim 1-3, wherein, the described substrate carrier of this module is provided with the opening that at least one is used to lay substrate.

8. as any one the described vacuum module that is used for applying coatings on a kind of substrate among the claim 1-3, wherein, the described substrate carrier of this module is parallel to the plane of movement of treatment unit and arranges.

9. the vacuum module that is used for applying coatings on a kind of substrate as claimed in claim 7, wherein, the opening of this substrate carrier is provided with a sealing member, and the sealing part is installed and is used for fixing this substrate along the periphery of described opening.

10. as any one the described vacuum module that is used for applying coatings on a kind of substrate among the claim 1-3, wherein, the periphery of described substrate carrier opening and the profile phase on surface to be coated mate.

11. the vacuum module that is used for applying coatings on a kind of substrate as claimed in claim 3, wherein, the cover body of vacuum chamber is made detachable.

12. as claim 3, any one the described vacuum module that is used for applying coatings on a kind of substrate in 11, wherein, the described cover body of described vacuum chamber is provided with an opening.

13. as claim 3, any one the described vacuum module that is used for applying coatings on a kind of substrate in 11, wherein, the described cover body of described vacuum chamber is provided with at least two openings that are used to place substrate.

14. as any one the described vacuum module that is used for applying coatings on a kind of substrate in the claim 3,11, wherein, the described cover body of described vacuum chamber is as substrate carrier.

15. as any one the described vacuum module that is used for applying coatings on a kind of substrate in the claim 3,11, wherein, described cover body opening is provided with a sealing member, the sealing part is installed and is used for fixing this vacuum chamber cover body along the periphery of described opening.

16. as any one the described vacuum module that is used for applying coatings on a kind of substrate in the claim 3,11, wherein, described vacuum chamber cover body is parallel to the plane of movement of treatment unit and arranges that this treatment unit is mounted to the surperficial to-and-fro movement that is parallel to substrate in the opening that is arranged in the vacuum chamber cover body.

17. as any one the described vacuum module that is used for applying coatings on a kind of substrate among the claim 1-3,11, wherein, for each opening is provided with an independent valve, this valve is installed in and is parallel in the substrate rest planar plane on the described vacuum chamber.

18., wherein, adopt balladeur train as the treatment unit transporting mechanism as any one the described vacuum module that is used for applying coatings on a kind of substrate among the claim 1-3.

19. the vacuum module that is used for applying coatings on a kind of substrate as claimed in claim 18, wherein, this treatment unit comprises some processing elements, the formation of these processing elements on balladeur train is selected from the group that following element constitutes, this element group comprises: vaporizer, magnetron cathode, the cathodic deposition target compound, ion cleaning system and have the prismatical ion sputtering of a pair of commentaries on classics system, wherein rotary prism is parallel to the floor plan at vacuum chamber opening place, and at least one operating surface of this rotary prism is provided with a kind of material for the treatment of sputter.

20. the vacuum module that is used for applying coatings on a kind of substrate as claimed in claim 19, wherein, described processing element is all made detachable.

21. modular system that is used for applying coatings on a kind of substrate, this modular system comprises at least two as any one the described vacuum module among the claim 1-3,11, described at least two vacuum modules have a common pumped vacuum systems, wherein, described module is provided with a common and vacuumizes Controlling System, a common operating gear Controlling System, this operating gear Controlling System is used for the automatic loading and unloading substrate and has some processes sensor, wherein has two module arrangement at least in the operating area of this common Manipulators.