CN110592550A - Magnetron sputtering and electron beam evaporation double-cavity coating device and using method thereof - Google Patents
Magnetron sputtering and electron beam evaporation double-cavity coating device and using method thereof Download PDFInfo
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- CN110592550A CN110592550A CN201911033160.5A CN201911033160A CN110592550A CN 110592550 A CN110592550 A CN 110592550A CN 201911033160 A CN201911033160 A CN 201911033160A CN 110592550 A CN110592550 A CN 110592550A
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- 239000011248 coating agent Substances 0.000 title claims abstract description 68
- 238000000576 coating method Methods 0.000 title claims abstract description 68
- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 37
- 238000005566 electron beam evaporation Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000010894 electron beam technology Methods 0.000 claims abstract description 77
- 238000005086 pumping Methods 0.000 claims abstract description 23
- 230000008569 process Effects 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 43
- 230000007246 mechanism Effects 0.000 claims description 31
- 238000001704 evaporation Methods 0.000 claims description 29
- 230000008020 evaporation Effects 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 239000013077 target material Substances 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000007888 film coating Substances 0.000 claims description 6
- 238000009501 film coating Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 5
- 239000000498 cooling water Substances 0.000 claims description 4
- 230000001965 increasing effect Effects 0.000 claims description 4
- 239000000523 sample Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000001771 vacuum deposition Methods 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims description 2
- 238000005477 sputtering target Methods 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- 230000008016 vaporization Effects 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000013212 metal-organic material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a magnetron sputtering and electron beam evaporation double-cavity coating device which comprises a magnetron cavity, wherein the magnetron cavity is fixed on the upper surface of an equipment frame, a Fu horse wheel is installed at the bottom of the equipment frame, the magnetron cavity is communicated with a magnetron cavity gate valve through a vacuumizing pipeline, the magnetron cavity gate valve is connected with one end of a three-way pipeline, the three-way pipeline is fixed on the upper surface of the equipment frame through a bracket, the other two ends of the three-way pipeline are respectively connected with a molecular pump and an electron beam cavity gate valve, the electron beam cavity gate valve is communicated with an electron beam cavity, the molecular pump pipeline is connected with a mechanical pump, the mechanical pump is connected with the magnetron cavity and the electron beam cavity through a rough pumping pipeline, a control cabinet is arranged on one side of the equipment frame, and the control cabinet is. The device integrates magnetron sputtering and electron beam evaporation processes for preparing the hard film into one device, and the double cavities share one set of pump set structure, so that the cost and the occupied area are saved.
Description
Technical Field
The invention relates to the technical field of coating devices, in particular to a magnetron sputtering and electron beam evaporation double-cavity coating device and a using method thereof.
Background
At present, many research and development units in colleges and universities have extensive demands on preparation of hard films and decorative films, but most of the existing equipment can only prepare one film structure, so that the situation that the same instrument is required to prepare two film structures is difficult to meet, when two films are required to be prepared, two sets of independent film coating devices are required, the cost is higher, and the overall size is larger.
Disclosure of Invention
The invention aims to provide a magnetron sputtering and electron beam evaporation double-cavity coating device and a using method thereof, and aims to solve the problems that the situation that two kinds of membrane structures are required to be prepared by the same instrument is difficult to meet in the background technology, and when two kinds of membranes are required to be prepared, two sets of independent coating devices are required, so that the cost is high, and the overall volume is large. In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a magnetron sputtering and electron beam evaporation double-chamber coating device, includes the magnetic control cavity, the magnetic control cavity is fixed in equipment frame upper surface, equipment frame bottom is installed the fortune horse wheel, the magnetic control cavity passes through evacuation pipeline intercommunication magnetic control cavity push-pull valve, magnetic control cavity push-pull valve connects three-way pipe one end, three-way pipe is fixed in equipment frame upper surface through the bracket, molecular pump and electron beam cavity push-pull valve are connected respectively to the other both ends of three-way pipe, electron beam cavity push-pull valve intercommunication electron beam cavity, molecular pump pipe connection mechanical pump, the mechanical pump passes through the thick pipeline of taking out and connects magnetic control cavity and electron beam cavity, equipment frame one side is equipped with the switch board, switch board and molecular pump and mechanical pump electrical connection.
Preferably, the inside lateral wall of magnetic control cavity installs the magnetron sputtering target, the vertical frock pedestal that is equipped with in magnetic control cavity middle part, the frock pedestal is cylindrical frame construction, be equipped with 6 rotatable frock posts along the circumference on the frock pedestal, the frock pedestal passes through gear wheel connection planet slewing mechanism, frock columnar connection pinion, the pinion is connected with gear wheel meshing, frock pedestal middle part is fixed with the work piece installation station, work piece installation station is furnished with the stirring gear, stir gear horizontal contact stirring piece, stirring piece is fixed in on the frock post, frock pedestal inside is fixed with the heating bucket, heating bucket internally mounted heater strip.
Preferably, the electron beam cavity is internally provided with a vacuum direct current electrode, the vacuum direct current electrode is connected with the evaporation boat through a copper block clamp, one side of the vacuum direct current electrode is provided with a six-turn crucible, the six-turn crucible is internally provided with a rotating mechanism, the upper side of the six-turn crucible is provided with a crucible baffle, the front side of the six-turn crucible is provided with an electron gun, one end of the crucible baffle is fixed on the bottom surface of the electron beam cavity through a support column, the upper side of the crucible baffle is provided with a substrate frame, a heating plate is arranged right above the substrate frame, the same horizontal height of one side of the substrate frame is provided with a film thickness gauge probe, a substrate baffle is arranged between the substrate frame and the heating plate, one end of the substrate baffle is fixed on the upper surface of the electron beam cavity through the support column, the substrate frame is connected with a rotating mechanism through a rotating, and the electronic beam cavity is fixed on the electronic beam cavity through a flange and a bolt.
Preferably, the magnetron sputtering and electron beam evaporation double-cavity coating device is provided with an air path module, a water path module and a solenoid valve module, wherein the air path module is connected with the magnetron cavity and the electron beam cavity through a pipeline and a solenoid valve, the water path module is connected with each component of the magnetron sputtering and electron beam evaporation double-cavity coating device through a hand valve and a pipeline, and the solenoid valve module is electrically connected with the solenoid valve of the electron beam cavity gate valve, the magnetron cavity gate valve and the air path module.
Preferably, an electron beam cavity cover is arranged outside the electron beam cavity, the electron beam cavity cover is hinged to one side of the electron beam cavity, and the other side of the electron beam cavity cover can be locked through a sealing lock.
A use method of a magnetron sputtering and electron beam evaporation double-cavity coating device specifically comprises the following steps:
(1) when carrying out the coating film, need to take out into vacuum two vacuum coating cavity, switch on the switch board, then open the equipment inlet channel of water route module and let the cooling water circulate, open the control software on the computer, after getting into the software, need select the coating film mode: magnetron sputtering or electron beam evaporation, and the interface can display a control interface according to the selected coating mode;
(2) and clicking the electromagnetic valve of the mechanical pump control and the rough pumping pipeline, starting the mechanical pump to work, starting rough pumping on the cavity, and observing the change of the vacuum degree. When the vacuum degree of the cavity is lower than 5Pa, closing an electromagnetic valve of a rough pumping pipeline, clicking a foreline electromagnetic valve, vacuumizing the foreline of the molecular pump by the mechanical pump, clicking a control of the molecular pump after the vacuum degree of the front level is lower than 5Pa, starting the molecular pump to rotate, observing the current rotating speed (gradually increasing the speed) of the molecular pump, and indicating that the molecular pump is completely started when the rotating speed reaches 630Hz (37800 RPM);
(3) manually opening a magnetic control cavity gate valve or an electron beam cavity gate valve of the corresponding cavity, finishing the vacuumizing step at the moment, and coating the film only by waiting for the vacuum degree of the cavity to meet the process requirement;
(4) when the magnetron sputtering coating is carried out by using the magnetron cavity, the heating barrel in the middle of the tool column frame is heated by using the heating wire in the heating barrel, and the workpiece is heated through thermal radiation. A gear wheel is connected in the middle of the planetary rotating structure, the gear wheel drives 6 peripheral small gears to rotate, the small gears and the gear wheel are meshed together, after the gear wheel rotates, the small gears rotate along with the gear wheel, the small gears and the six tool columns are connected together through flanges, and therefore the six tool columns of the tool column frame can also achieve the autorotation function. Each tool post is provided with a workpiece mounting station, a shifting gear is independently arranged below the workpiece mounting station, and a shifting piece is arranged at the horizontal position of the shifting gear. Through the poking piece, when the six tool columns rotate, the poking piece can touch the poking gear, and the effect of poking the poking gear is achieved through contact, so that all workpieces on the tool columns rotate at the same angle at the same time when the tool columns rotate for each circle, and therefore 360-degree film coating of the workpieces is achieved;
(5) when the electron beam cavity is used for carrying out electron beam evaporation coating, one mode is that a control cabinet is started to supply direct current to a vacuum direct current electrode in the electron beam cavity, and a copper block clamp is used for supplying electricity to an evaporation boat, wherein the higher the current flowing on the evaporation boat is, the higher the temperature of the evaporation boat is, and evaporation is carried out at high temperature; the other mode is that the control cabinet is started to electrify the electron gun, the sexually-rotated crucible on one side is heated by the electron gun, the crucible is rotated at a fixed angle by a rotating mechanism in the sexually-rotated crucible, and the corresponding crucible is selected by software of the control cabinet for evaporation. The target that will need the coating by vaporization is placed in the inside heating of crucible of selection, and aim and the bombardment target through electron gun acceleration electron beam, make the inside target evaporation of crucible, and preheat the target through adjustment electron gun acceleration electron beam, when the size of adjustment electron gun acceleration electron beam satisfies the coating film speed, open the baffle and carry out the coating by vaporization coating film, and then deposit on the substrate of placing on the substrate frame after making the target evaporation, the substrate frame drives the substrate and passes through rotary mechanism and elevating system rotation or reduction, thereby change the height and the angle of substrate, realize that different materials and material surface carry out whole coating by vaporization, when coating by vaporization thickness reaches the requirement, stop the electron gun, take out the substrate.
The invention has the technical effects and advantages that: the vacuum unit of the device adopts a molecular pump combined with a mechanical pump quasi-oilless vacuum system; magnetron sputtering and electron beam evaporation processes for preparing a hard film are integrated into one device, and a double-cavity chamber shares a set of pump set structure, so that the cost and the occupied area are saved; the workpiece holder for magnetron sputtering adopts a planetary workpiece holder structure, the motion of each workpiece comprises rotation, revolution around an earth axis and revolution around a sun axis, and the time of each surface of each workpiece in a film forming area is ensured to be uniform so as to meet the requirement of uniformity of a surface film layer; the heating system of magnetron sputtering adopts a resistance-type heating barrel to provide high temperature, so that the workpiece is heated in a radiation mode, heating wires of the resistance-type heating barrel are uniformly distributed, the temperature on the heating barrel is ensured to be uniform, the workpiece is uniformly radiated from four sides of the outer wall of the barrel in the barrel, and the surface temperature of the workpiece is uniform; the outer surface of the cavity is cooled by circulating water, so that the overhigh temperature of the surface of the cavity is avoided; the evaporation source of the evaporation chamber is designed by adopting an evaporation source compatible with metal materials and organic materials; 6 crucibles are placed in the electron beam cavity, the selection of the crucible to be used can be realized through software operation, 6 materials can be placed in the cavity in advance, and a user can freely select the crucible when coating the film, thereby realizing the process of continuously coating multiple films; the film thickness appearance can real time monitoring coating film rate and thick, uses through thick appearance of membrane and electron gun cooperation, realizes automatic coating film, does not need the experimenter to observe coating film rate and thick in real time, and equipment can use and keep coating film in a stable coating film rate within range, also can edit process flow and realize multiple material coating film.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a top view of the present invention;
FIG. 3 is a schematic structural view of a magnetron chamber according to the present invention;
FIG. 4 is a schematic diagram of an electron beam cavity according to the present invention;
fig. 5 is a flow chart of the operation of the present invention.
In the figure: 1-a magnetron cavity, 2-an equipment frame, 3-a Fuma wheel, 4-a vacuum-pumping pipeline, 5-a magnetron cavity gate valve, 6-a three-way pipeline, 7-a bracket, 8-a molecular pump, 9-an electron beam cavity gate valve, 10-an electron beam cavity, 11-a mechanical pump, 12-a rough-pumping pipeline, 13-a control cabinet, 14-a gas circuit module, 15-a water circuit module, 16-a solenoid valve module, 17-an electron beam cavity cover, 18-a sealing lock, 101-a magnetron sputtering target, 102-a tooling column frame, 103-a tooling column, 104-a planetary rotating mechanism, 105-a workpiece mounting station, 106-a toggle gear, 107-a toggle sheet, 108-a heating barrel, 1001-a vacuum direct current electrode and 1002-an evaporation boat, 1003-a six-rotation crucible, 1004-a crucible baffle, 1005-a substrate frame, 1006-a heating plate, 1007-a film thickness instrument probe, 1008-a substrate baffle, 1009-a rotating mechanism, 1010-a lifting mechanism and 1011-an electron gun.
Detailed Description
In the description of the present invention, it should be noted that unless otherwise specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements.
Example 1
The magnetron sputtering and electron beam evaporation dual-cavity coating device shown in fig. 1 ~ and fig. 3 comprises a magnetron cavity 1, wherein the magnetron cavity 1 is fixed on the upper surface of an equipment frame 2, a Fu horse wheel 3 is mounted at the bottom of the equipment frame 2, the magnetron cavity 1 is communicated with a magnetron cavity gate valve 5 through a vacuum pumping pipeline 4, the magnetron cavity gate valve 5 is connected with one end of a three-way pipeline 6, the three-way pipeline 6 is fixed on the upper surface of the equipment frame 2 through a bracket 7, the other two ends of the three-way pipeline 6 are respectively connected with a molecular pump 8 and an electron beam cavity gate valve 9, the electron beam cavity gate valve 9 is communicated with an electron beam cavity 10, the molecular pump 8 is connected with a mechanical pump 11 through a rough pumping pipeline 12, the mechanical pump 11 is connected with the magnetron cavity 1 and the electron beam cavity 10 through a rough pumping pipeline 12, rough pumping of the equipment is performed through the rough pumping of the magnetron cavity 1 and the electron beam cavity 10, and then high vacuum is performed through the magnetron cavity gate valve 5 and the molecular pump 8, a control cabinet 13 is arranged on one side of the equipment.
Preferably, a magnetron sputtering target 101 is installed on the side wall inside the magnetron chamber 1, a tool column 102 is vertically arranged in the middle of the magnetron chamber 1, the tool column 102 is a cylindrical frame structure, 6 rotatable tool columns 103 are circumferentially arranged on the tool column 102, the tool column 102 is connected with a planetary rotating mechanism 104 through a large gear, the tool column 103 is connected with a small gear, the small gear is meshed with the large gear, the large gear drives peripheral small gears to rotate, a workpiece installation station 105 is fixed in the middle of the tool column 102, the workpiece installation station 105 is provided with a toggle gear 106, the toggle gear 106 is horizontally contacted with a toggle piece 107, the toggle piece 107 is fixed on the tool column 103, each workpiece can rotate through the toggle piece 107, a heating barrel 108 is fixed inside the tool column 102, and a heating wire is installed inside the heating barrel 108, for heating the heating barrel 108 and then indirectly heating the material by thermal radiation.
Example 2
The magnetron sputtering and electron beam evaporation double-cavity coating device shown in fig. 1 ~ and fig. 5 comprises a magnetron cavity 1, wherein the magnetron cavity 1 is fixed on the upper surface of an equipment frame 2, a Fu horse wheel 3 is mounted at the bottom of the equipment frame 2, the magnetron cavity 1 is communicated with a magnetron cavity gate valve 5 through a vacuum pumping pipeline 4, the magnetron cavity gate valve 5 is connected with one end of a three-way pipeline 6, the three-way pipeline 6 is fixed on the upper surface of the equipment frame 2 through a bracket 7, the other two ends of the three-way pipeline 6 are respectively connected with a molecular pump 8 and an electron beam cavity gate valve 9, the electron beam cavity gate valve 9 is communicated with an electron beam cavity 10, the molecular pump 8 is connected with a mechanical pump 11 through a rough pumping pipeline 12, the mechanical pump 11 is connected with the magnetron cavity 1 and the electron beam cavity 10 through a rough pumping pipeline 12, rough pumping of the equipment is performed through the rough pumping of the magnetron cavity 1 and the electron beam cavity 10, and then high vacuum is performed through the magnetron cavity gate valve 5 and the molecular pump 8, a control cabinet 13 is arranged on one side of the equipment.
Preferably, a magnetron sputtering target 101 is installed on the side wall inside the magnetron chamber 1, a tool column 102 is vertically arranged in the middle of the magnetron chamber 1, the tool column 102 is a cylindrical frame structure, 6 rotatable tool columns 103 are circumferentially arranged on the tool column 102, the tool column 102 is connected with a planetary rotating mechanism 104 through a large gear, the tool column 103 is connected with a small gear, the small gear is meshed with the large gear, the large gear drives peripheral small gears to rotate, a workpiece installation station 105 is fixed in the middle of the tool column 102, the workpiece installation station 105 is provided with a toggle gear 106, the toggle gear 106 is in horizontal contact with a toggle piece 107 in a movable manner, the toggle piece 107 is fixed on the tool column 103, each workpiece can rotate through the toggle piece 107, a heating barrel 108 is fixed inside the tool column 102, and a heating wire is installed inside the heating barrel 108, for heating the heating barrel 108 and then indirectly heating the material by thermal radiation.
Preferably, a vacuum dc electrode 1001 is installed inside the electron beam chamber 10, the vacuum dc electrode 1001 is connected to an evaporation boat 1002 through a copper block clamp, a hexagonal crucible 1003 is installed on one side of the vacuum dc electrode 1001, a rotation mechanism is installed inside the hexagonal crucible 1003 and can rotate at a fixed angle, a corresponding crucible can be selected through software for evaporation, a crucible baffle 1004 is installed on the upper side of the hexagonal crucible 1003, one end of the crucible baffle 1004 is fixed on the bottom surface of the electron beam chamber 10 through a support column, a substrate frame 1005 is installed on the upper side of the crucible baffle 1004, an electron gun 1011 is installed on the front side of the crucible baffle 1004 and is used for accelerating electron bombardment of a coating material, a heating plate 1006 is installed right above the substrate frame 1005, a film thickness gauge probe 1007 is installed at the same horizontal height on one side, a substrate baffle 1008 is installed between the substrate frame 1005 and the heating plate 1006, one end of the substrate baffle 1008 is fixed on the upper surface of the electron beam chamber, the substrate holder 1005 is connected with the rotating mechanism 1009 through a rotating shaft, one side of the rotating mechanism is provided with the lifting mechanism 1010, the lifting mechanism 1010 is connected with the substrate holder 1005, the substrate holder 1005 can rotate through the rotating mechanism 1009, the vertical height of the substrate holder 1005 can also be adjusted through the lifting mechanism 1010, and the rotating mechanism 1009 and the lifting mechanism 1010 are installed at the top of the electron beam cavity 10 and are fixed on the electron beam cavity 10 through flanges and bolts.
Preferably, the magnetron sputtering and electron beam evaporation dual-cavity coating device is provided with an air path module 14, a water path module 15 and an electromagnetic valve module 16, wherein the air path module 14 is connected with the magnetron cavity 1 and the electron beam cavity 10 through a pipeline and an electromagnetic valve, the magnetron cavity 1 and the electron beam cavity 10 can select an air inlet mode through control software, and the required air inlet flow and pressure can be adjusted according to process parameters; the waterway module 15 is connected with each component of the magnetron sputtering and electron beam evaporation double-cavity coating device through a hand valve and a pipeline, controls the cooling of each equipment component, and can monitor the temperature, the pressure and the flow in real time; the electromagnetic valve module 16 set is electrically connected with the electromagnetic valves of the electron beam cavity gate valve 9, the magnetic control cavity gate valve 5 and the gas path module 14.
Preferably, an electron beam cavity cover 17 is arranged outside the electron beam cavity 10, and the electron beam cavity cover 17 is hinged to one side of the electron beam cavity 10, and the other side can be locked by a sealing lock 18.
A use method of a magnetron sputtering and electron beam evaporation double-cavity coating device specifically comprises the following steps:
(1) when carrying out the coating film, need to take out into vacuum two vacuum coating cavity, switch on switch board 13, then open the equipment inlet channel of water route module 15 and let the cooling water circulate, open the control software on the computer, after getting into the software, need select the coating film mode: magnetron sputtering or electron beam evaporation, and the interface can display a control interface according to the selected coating mode;
(2) and clicking the electromagnetic valve of the mechanical pump 11 control and the rough pumping pipeline 12, starting the mechanical pump 11 to work, starting rough pumping on the cavity, and observing the change of the vacuum degree. When the vacuum degree of the cavity is lower than 5Pa, closing an electromagnetic valve of the rough pumping pipeline 12, clicking a foreline electromagnetic valve, vacuumizing a foreline of the molecular pump 8 by the mechanical pump 11, clicking a control of the molecular pump 8 after the vacuum degree of the foreline is lower than 5Pa, starting the rotation of the molecular pump 8, observing the current rotating speed (gradually increasing the speed) of the molecular pump 8, and indicating that the molecular pump 8 is completely started when the rotating speed reaches 630Hz (37800 RPM);
(3) manually opening a magnetic control cavity gate valve 5 or an electron beam cavity gate valve 9 of the corresponding cavity, finishing the vacuumizing step at the moment, and coating the film only by waiting for the vacuum degree of the cavity to meet the process requirement;
(4) when the magnetron sputtering coating is carried out by using the magnetron cavity 1, the heating barrel 108 in the middle of the tool column frame is heated by using the heating wire in the heating barrel 108, and the workpiece is heated through heat radiation. A gear wheel is connected in the middle of the planet rotating structure 104, the gear wheel drives 6 peripheral small gears to rotate, the small gears and the gear wheel are meshed together, after the gear wheel rotates, the small gears rotate along with the gear wheel, the small gears and the six tool columns 103 are connected together through flanges, and therefore the six tool columns 103 of the tool column frame 102 can also achieve the autorotation function. Each tool post 103 is provided with a workpiece mounting station 105, a toggle gear 106 is independently arranged below the workpiece mounting station 105, and a toggle piece 107 is arranged at the horizontal position of the toggle gear 106. Through the poking piece 107, when the six tool columns 103 rotate, the poking piece 107 can touch the poking gear 106, and the effect of poking the poking gear 107 is achieved through contact, so that all workpieces on the tool columns 103 rotate at the same angle at the same time when the tool columns 103 rotate for one circle, and therefore 360-degree film coating of the workpieces is achieved;
(5) when the electron beam cavity 10 is used for carrying out electron beam evaporation coating, one mode is that the control cabinet 13 is started to supply direct current to a vacuum direct current electrode 1001 in the electron beam cavity 10, the evaporation boat 1002 is electrified through a copper block clamp, the higher the current flowing on the evaporation boat 1002 is, the higher the temperature of the evaporation boat is, and evaporation coating is carried out through high temperature; in another embodiment, the control cabinet 13 is started to energize the electron gun 1011, the hexagonal crucible 1003 on one side is heated by the electron gun 1011, the crucible is rotated at a fixed angle by a rotating mechanism inside the hexagonal crucible 1003, and the corresponding crucible is selected by software of the control cabinet 13 to be evaporated. The target material to be evaporated is placed in a selected crucible to be heated, the electron beam is accelerated by the electron gun 1011 to aim and bombard the target material, the target material in the crucible is evaporated, the target material is preheated by the accelerated electron beam of the electron gun 1011, when the size of the accelerated electron beam of the electron gun 1011 is adjusted to meet the film coating rate, the baffle is opened to perform evaporation coating, the target material is deposited on a substrate placed on the substrate frame 1005 after being evaporated, the substrate frame 100 drives the substrate to rotate or reduce through the rotating mechanism 1009 and the lifting mechanism 1010, the height and the angle of the substrate are changed, all evaporation coating of different materials and material surfaces is realized, when the thickness of the evaporation coating meets the requirement, the electron gun is stopped, and the substrate is taken out.
The process flow and the working principle of the invention are as follows: two vacuum coating cavity when evacuation, need switch on switch board 13, then open the equipment inlet channel of water route module 15 and let the cooling water circulation, open the control software on the computer, after getting into the software, need select the coating film mode: magnetron sputtering or electron beam evaporation, and the interface can display a control interface according to the selected coating mode. Then clicking a control of the mechanical pump 11 and an electromagnetic valve of the rough pumping pipeline 12, starting the mechanical pump 11 to work, starting rough pumping on the cavity, and observing the change of the vacuum degree. When the vacuum degree of the cavity is lower than 5Pa, the electromagnetic valve of the rough pumping pipeline 12 is closed, the foreline electromagnetic valve is clicked, the mechanical pump 11 is used for vacuumizing the foreline of the molecular pump 8, when the vacuum degree of the foreline is lower than 5Pa, the control of the molecular pump 8 is clicked, the molecular pump 8 starts to rotate, the current rotating speed (gradually increased speed) of the molecular pump 8 is observed, and when the rotating speed reaches 630Hz (37800 RPM), the molecular pump 8 is indicated to be completely started. Then manually opening a magnetic control cavity gate valve 5 or an electron beam cavity gate valve 9 of the corresponding cavity, finishing the vacuumizing step at the moment, and coating the film only by waiting for the vacuum degree of the cavity to meet the process requirement; the workpiece mounting station 105 of the magnetron chamber 1 is realized by a planetary rotating mechanism 104 and a toggle gear 106. The middle of the planet rotating structure 104 is composed of a large gear and 6 small gears at the periphery, the large gear and the small gears are positioned at the top of the whole cylindrical frame structure, and a tool column frame 102 composed of six tool columns 103 is arranged below the gears. The tooling column frame 102 is fixedly connected with a gearwheel in the middle of the planetary rotating mechanism 104, so that the whole tooling column frame 102 can synchronously rotate along with the gearwheel. Six tool posts 103 of tool post frame 102 also can rotate, and a gear wheel drives peripheral 6 pinion gears to rotate, and the pinion gear and the gear wheel are meshed together, and after the gear wheel rotates, the pinion gear rotates along with the gear wheel, and the pinion gear and six tool posts 103 are connected together through a flange, so that the function of rotating six tool posts 103 is realized. Then, each tool post 103 can be provided with a workpiece mounting station 105, and because the workpieces need to be coated in 360 degrees, the lower part of the workpiece mounting station 105 is independently provided with a toggle gear 106 and a toggle piece 107 at the horizontal position of the toggle gear 106. Through the plectrum 107, six frock posts 103 when the rotation, the plectrum 107 can touch toggle gear 106, reaches the effect of stirring toggle gear 107 through the contact, and every rotatory round of frock post 103 like this, all work pieces on the frock post 103 also rotate same angle simultaneously. Because the work piece probably needs heating to the certain temperature when the coating film, consequently be furnished with a heating barrel 108 in the centre of frock pylon, through the heat radiation, reach the heating of work piece. The heating barrel 108 is provided with a heating wire in the middle.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. The utility model provides a magnetron sputtering and two-chamber coating film device of electron beam evaporation, includes the magnetron cavity, its characterized in that: the device comprises a magnetic control cavity, a three-way pipeline, a carrier and a control cabinet, wherein the magnetic control cavity is fixed on the upper surface of a device frame, a Fu horse wheel is installed at the bottom of the device frame, the magnetic control cavity is communicated with a magnetic control cavity gate valve through a vacuumizing pipeline, the magnetic control cavity gate valve is connected with one end of the three-way pipeline, the three-way pipeline is fixed on the upper surface of the device frame through the carrier, the other two ends of the three-way pipeline are respectively connected with a molecular pump and an electron beam cavity gate valve, the electron beam cavity gate valve is communicated with an electron beam cavity, the molecular pump pipeline is connected with a mechanical pump, the mechanical pump is.
2. The magnetron sputtering and electron beam evaporation dual-chamber coating device according to claim 1, wherein: the magnetic control sputtering target is installed to the inside lateral wall of magnetic control cavity, the vertical frock column frame that is equipped with in magnetic control cavity middle part, the frock column frame is cylindrical frame construction, be equipped with 6 rotatable frock posts along the circumference on the frock column frame, the frock column frame passes through gear wheel connection planet slewing mechanism, frock column connection pinion, the pinion is connected with gear wheel meshing, frock column frame middle part is fixed with the work piece installation station, the work piece installation station is furnished with the stirring gear, stir gear horizontal contact stirring piece, the stirring piece is fixed in on the frock post, frock column frame inside is fixed with the heating bucket, heating bucket internally mounted heater strip.
3. The magnetron sputtering and electron beam evaporation dual-chamber coating device according to claim 2, wherein: the vacuum direct current electrode is arranged in the electron beam cavity and is connected with the evaporation boat through a copper block clamp, a six-turn crucible is arranged on one side of the vacuum direct current electrode, a rotating mechanism is arranged in the six-turn crucible, a crucible baffle is arranged on the upper side of the six-turn crucible, an electron gun is arranged on the front side of the six-turn crucible, one end of the crucible baffle is fixed on the bottom surface of the electron beam cavity through a supporting column, a substrate frame is arranged on the upper side of the crucible baffle, a heating disc is arranged right above the substrate frame, a film thickness gauge probe is installed at the same horizontal height of one side of the substrate frame, a substrate baffle is arranged between the substrate frame and the heating disc, one end of the substrate baffle is fixed on the upper surface of the electron beam cavity through the supporting column, the substrate frame is connected with the rotating mechanism through a rotating shaft, a lifting mechanism is, and the electronic beam cavity is fixed on the electronic beam cavity through a flange and a bolt.
4. The magnetron sputtering and electron beam evaporation dual-chamber coating device according to claim 1, wherein: the magnetron sputtering and electron beam evaporation double-cavity coating device is provided with an air circuit module, a water path module and a solenoid valve module, wherein the air circuit module is connected with a magnetron cavity and an electron beam cavity through a pipeline and a solenoid valve, the water path module is connected with each component of the magnetron sputtering and electron beam evaporation double-cavity coating device through a hand valve and a pipeline, and the solenoid valve module is electrically connected with an electron beam cavity gate valve, a magnetron cavity gate valve and a solenoid valve of the air circuit module.
5. The magnetron sputtering and electron beam evaporation dual-chamber coating device according to claim 1 or 3, wherein: and an electron beam cavity cover is arranged outside the electron beam cavity, the electron beam cavity cover is hinged with one side of the electron beam cavity, and the other side of the electron beam cavity cover can be locked through a sealing lock.
6. A using method of a magnetron sputtering and electron beam evaporation double-cavity coating device is characterized by comprising the following steps:
(1) when carrying out the coating film, need to take out into vacuum two vacuum coating cavity, switch on the switch board, then open the equipment inlet channel of water route module and let the cooling water circulate, open the control software on the computer, after getting into the software, need select the coating film mode: magnetron sputtering or electron beam evaporation, and the interface can display a control interface according to the selected coating mode;
(2) when the vacuum degree of the cavity is lower than 5Pa, the electromagnetic valve of the rough pumping pipeline is closed, the foreline electromagnetic valve is clicked, the mechanical pump vacuumizes the foreline of the molecular pump, when the foreline vacuum degree is lower than 5Pa, the control of the molecular pump is clicked, the molecular pump starts rotating, the current rotating speed (gradually increased speed) of the molecular pump is observed, and when the rotating speed reaches 630Hz (37800 RPM), the molecular pump is indicated to be completely started;
(3) manually opening a magnetic control cavity gate valve or an electron beam cavity gate valve of the corresponding cavity, finishing the vacuumizing step at the moment, and coating the film only by waiting for the vacuum degree of the cavity to meet the process requirement;
(4) when a magnetron sputtering coating is carried out by using a magnetron cavity, a heating wire in the heating barrel is firstly used for heating the heating barrel in the middle of a tool column frame and heating a workpiece through heat radiation, a large gear is connected in the middle of a planetary rotating structure and drives 6 small gears on the periphery to rotate, the small gear and the large gear are meshed together, after the large gear rotates, the small gear rotates along with the planetary rotating structure, the small gear and six tool columns are connected together through flanges, so that the six tool columns of the tool column frame can also realize the self-rotation function, a workpiece mounting station is arranged on each tool column, a shifting gear is independently arranged below the workpiece mounting station, a shifting piece is arranged at the horizontal position of the shifting gear, and when the six tool columns rotate, the shifting piece can touch the shifting gear, the effect of shifting the gear is achieved through contact, so that each circle of the tool column rotates, all the workpieces on the tool post also rotate by the same angle at the same time, so that 360-degree film coating of the workpieces is realized;
(5) when the electron beam cavity is used for carrying out electron beam evaporation coating, one mode is that a control cabinet is started to supply direct current to a vacuum direct current electrode in the electron beam cavity, and a copper block clamp is used for supplying electricity to an evaporation boat, wherein the higher the current flowing on the evaporation boat is, the higher the temperature of the evaporation boat is, and evaporation is carried out at high temperature; in another mode, the control cabinet is started to electrify the electron gun, the hexagonal crucible on one side is heated by the electron gun, the crucible is rotated at a fixed angle by a rotating mechanism in the hexagonal crucible, the corresponding crucible is selected by software of the control cabinet for evaporation, a target material to be evaporated is placed in the selected crucible for heating, the electron gun accelerating electron beam is used for aiming and bombarding the target material, the target material in the crucible is evaporated, the electron gun accelerating electron beam is adjusted to preheat the target material, when the size of the electron gun accelerating electron beam is adjusted to meet the film coating rate, a baffle is opened for evaporation coating, the target material is evaporated and then deposited on a substrate placed on a substrate frame, the substrate frame drives the substrate to rotate or reduce through a rotating mechanism and a lifting mechanism, so that the height and the angle of the substrate are changed, and the complete evaporation coating of different materials and material surfaces is realized, when the thickness of the vapor deposition coating film meets the requirement, the electron gun is stopped, and the substrate is taken out.
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