KR100879380B1 - Batch type vacuum coating apparatus and coating method thereby - Google Patents

Abstract

A batch type vacuum deposition apparatus capable of improving sputtering efficiency and deposition method using the same are provided to obtain high quality product by grafting evaporation and a magnetron sputtering method. A batch type vacuum deposition method capable of improving sputtering efficiency comprises the following steps: a step for inputting frame(RF) inside a vacuum chamber(S100); a step for forming a base vacuum by a vacuum apparatus(S200); a step for moving a jig and a product by moving the frame(S300); a step for forming a deposition layer on surface of the product moved by the frame(S400); and a step for dissolving a vacuum inside the vacuum chamber(S500).

Description

Batch type vacuum deposition apparatus and deposition coating method using the same

The present invention relates to a batch type vacuum deposition apparatus and a deposition coating method, when a large amount of heat is generated when coating the necessary thin film thickness can be eliminated the phenomenon that the coating film is destroyed due to distortion of the substrate or severe expansion by heat, The present invention relates to a batch type vacuum deposition apparatus and a deposition coating method using the same, in which sputtering efficiency is improved, and even when a product is an insulator, the film formation (that is, deposition film formation) speed is relatively fast, and productivity can be expected.

Sputtering or vacuum deposition is adopted as a method of coating a conductive thin film on the surface of a product such as an injection molded product. However, sputtering method has adhesion, but a large amount of heat is generated when coating a required thin film thickness, so that the substrate is warped or There is a problem that the coating film is destroyed due to severe expansion, and the coating method by the resistance heating method also has a problem in the strength of the conductive thin film because the adhesion is weak.

On the other hand, the method of coating the coating film on the product by vacuum deposition method attaches the product to be coated on the tray, puts it into the chamber made into a vacuum state, and when a current flows through the target, plasma is formed on the target itself and ionized. The atoms, ie the coating material, are splashed forward in the form of sputtering (or spraying) to coat the product.

However, in the case of vacuum deposition using a conventional sputtering method, the sputtering yield is relatively low, resulting in a decrease in sputtering efficiency, and there is a concern that a defect such as product warping may occur due to an increase in the temperature of the product during sputtering. In addition, when the product is an insulator, the film formation (ie, deposition film formation) speed is slow.

The present invention is to solve the problems described above, an object of the present invention by combining the evaporation and magnetron sputtering method, a batch type that can take advantage of the two methods of vacuum deposition to obtain a better quality product It is to provide a vacuum deposition apparatus and a deposition coating method.

According to the present invention for realizing this object, a vacuum chamber having a door on one side, a structure having a revolving unit and a rotating unit, and a revolving rotating frame inserted into the vacuum chamber, and the revolving rotating frame. And an evaporator having a target equipped with a target for mounting a deposition material, wherein the revolving unit of the revolving frame includes a base plate provided with the evaporator on an upper surface thereof, and an outer side of the target. A revolving plate installed on an upper side of the base plate and having a gear unit formed on an outer circumferential surface thereof, the rotating unit of the revolving frame is fixed to an upper surface of the base plate at a position between the revolving plate and the target and The rotating guide with a threaded portion and the gear portion of the outer circumferential surface are engaged with the gear portion of the rotating guide outer circumferential surface and the idle A first magnetic plate rotatably installed on an upper surface of the first magnetic plate, a plurality of magnetic gears arranged in a circumferential direction on an upper surface of the first magnetic plate to be rotatable, and rotatably coupled to a central portion of the first magnetic plate; The screw portion of the outer circumferential surface is provided with a batch type vacuum deposition apparatus comprising a second magnetic plate engaged with the plurality of magnetic gear.

In addition, according to the present invention, by inserting the jig mounting the product on the revolving frame having a revolving unit and the revolving unit, the product input process for introducing the revolving frame into the vacuum chamber, and the vacuum inside the vacuum chamber A process of forming a base vacuum by an apparatus, and revolving and rotating the jig and the product by revolving and rotating the revolving unit and the revolving unit of the revolving frame installed inside the vacuum chamber by revolving driving means. And a deposition coating process for forming a deposition coating layer on the surface of the product being rotated and rotated by the operation of the revolution frame, and vacuum breaking process for releasing the vacuum inside the vacuum chamber. Deposition coating methods are provided.

According to the present invention, an evaporation method using resistive heat is adopted by an evaporator, and thus an advantageous effect can be expected even for deposition of metals having low melting points (Al, CU, AG, AU .....), and relatively Rapid deposition coating can be made, it is possible to obtain a relatively thick thin film deposition coating product compared to the prior art.

In addition, the present invention adopts a method of increasing the sputtering yield by arranging the magnetic material on the target (cathode), thereby increasing the sputtering efficiency, and can reduce the collision of electrons to the substrate and thin film by the vortex movement of the electrons As the temperature rise effect is small, it is possible to prevent defective products, and even the insulators such as SIO2 AL23 have a high film formation speed, the film formation speed is constant at a given input power, and the uniformity of the thickness of the thin film due to the proper arrangement of the magnetic material and the use of a shield. There is an advantage that can be easily adjusted.

For example, the present invention is an invention in which a better quality product can be obtained by utilizing the advantages of two types of vacuum deposition by combining evaporation and magnetron sputtering using an evaporator.

In addition, the present invention is to install the jig for fixing the product so as to rotate and rotate inside the vacuum chamber by rotating and rotating the product during the deposition, to obtain an even quality of the deposited product, the adhesion between the deposited product and the thin film through the ion source It raises the effect of improving the reliability of the product.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. 1 is a plan view showing a vacuum chamber and a vacuum apparatus of the present invention, Figure 2 is a side view of Figure 1, Figure 3 is a front view showing the door portion of the vacuum chamber shown in Figure 1, Figure 4 is a main part of the present invention Top view schematically showing the structure of the revolving frame and evaporator and magnetron sputter, Figure 5 is a perspective view schematically showing the configuration of the revolving frame shown in Figure 4, Figure 6 is a side view of the evaporator mounted in Figure 5 7 is a plan view showing an enlarged configuration of a part of the rotating unit in the rotating frame shown in Figure 4, Figure 8 is a structure of the upper rotating plate and the upper rotating plate in the rotating frame shown in Figure 4 9 is an enlarged view of a portion of the upper magnetic plate shown in FIG. 8. As shown, the present invention is provided with a jig for supporting the product in the interior of the vacuum chamber 10, the inner side of the vacuum chamber 10 is provided with an evaporator 40 (evaporator), and, It is a batch type vacuum deposition apparatus further provided with the magnetron sputter | spatter 60 in the other inner position of the chamber 10. As shown in FIG.

The vacuum chamber 10 is formed in a cylindrical barrel shape, a known vacuum device (shown in Figures 1 and 2) is connected to the vacuum chamber 10, a vacuum atmosphere is formed therein according to the operation of the vacuum device do. In other words, a base vacuum for evaporation is applied to the vacuum chamber 10.

The front of the vacuum chamber 10 is mounted so that the door 12 is pivotally opened and closed around the hinge portion, and the inner bottom of the vacuum chamber 10 is provided on the base plate 20 of the revolving frame RF to be described later. A conductive piece 42 is provided to be connected to the target 46 of the perlator 40 so that power can be supplied. In addition, a drive motor (not shown) is mounted on an outer bottom surface of the vacuum chamber 10, and a rotation shaft 4 of the drive motor protrudes to one bottom of the inside of the vacuum chamber 10, and a power is applied to the rotation shaft 4 of the drive motor. The transmission gear 6 is connected. That is, the power transmission gear 6 rotates on the upper surface of the drive gear 6a coupled to the rotation shaft 4 of the drive motor and the support block 8 slidably coupled around the rotation shaft 4 of the drive motor. It is composed of a driven gear 6b which is installed as possible and engaged with the drive gear 6a. The support block 8 rotatably supporting the driven gear 6b is slidably coupled to one side of the rotation shaft 4 of the drive motor and simultaneously uses a spring 7a on the inner wall of the vacuum chamber 10. It is configured to be able to move forward and backward. This driven gear 6b is gear-coupled to the outer circumferential surface of the revolving plate 22 constituting the revolving unit of the revolving frame RF.

In the vacuum chamber 10, a revolving frame RF including a revolving unit and a revolving unit is introduced. 5 and 6, the revolving unit, which is a main part of the revolving revolving frame RF, includes a disc-shaped base plate 20 and a ring-shaped revolving plate provided rotatably on the upper surface of the base plate 20. 22) and a plurality of upper revolving plates 28 connected to the base plate 20 via a plurality of bar-shaped vertical frames 26 and disposed at positions facing the revolving plates 22, respectively. .

5 and 6, a rotating unit, which is another main part of the revolving rotating frame RF, is fixed to the base plate 20 so as to be located inside the revolving plate 22 and has a ring plate shape having a gear part formed on an outer circumferential surface thereof. Upper rotating plate 28 so as to be disposed at a position facing the rotating guide 24, the plurality of first rotating plates 30 rotatably provided on the upper surface of the rotating plate 22, and the first rotating plate 30. It has a plurality of upper magnetic plate 32 provided in the.

4 to 6, the first magnetic plate 30 is rotatably coupled to the upper surface of the revolving plate 22, and is disposed at regular intervals along the circumferential direction of the revolving plate 22. In addition, the gear portion formed on the outer circumferential surface of the first magnetic plate 30 is engaged with the gear portion on the outer circumferential surface of the rotating guide 24.

As shown in FIG. 4, a plurality of brackets 30a (three in this embodiment) are provided on an upper surface of the first magnetic plate 30, and a lower end of the connection bar 34 is fixed to the bracket 30a. The upper end of the connection bar 34 is fixed to the bottom of the upper magnetic plate 32 so that the first magnetic plate 30 and the upper magnetic plate 32 can be rotated together.

In addition, a plurality of magnetic gears 36 are rotatably installed in the circumferential direction so as to be located between the brackets 30a on the upper surface of the first magnetic plate 30, and an outer circumferential surface at the center of the upper surface of the first magnetic plate 30. The second magnet plate 38 is provided with the gear portion of the gear meshed to the magnetism gear (36). A coupling fixing part 38a to which the plate-shaped jig is coupled is formed at the center of the upper surface of the second magnetic plate 38 to protrude a product (for example, a mobile phone case) placed on the plate-shaped jig. Supported by the coupling fixing portion (38a) is installed on the upper surface of the second magnetic plate (38). On the other hand, it is also possible to mount the product to the engaging fixing portion 38a of the second magnetic plate 38.

A jig groove 36a into which the lower end of the bar-shaped sealing jig is fitted is formed at the upper end of the magnetic gear 36 installed on the first magnetic plate 30. In the upper magnetic plate 32, a jig hole 32a (see FIG. 7) is formed at a position facing the jig groove 36a of the magnetic gear 36. As shown in FIG.

In the present invention, the revolving frame (RF) forms a structure having a revolving unit and a rotating unit. That is, in the embodiment of the present invention, the revolving unit includes a disk-shaped base plate 20, a ring-shaped revolving plate 22 rotatably installed on the upper surface of the base plate 20, and the revolving plate 22. It consists of an upper revolving plate 28 disposed on the upper surface of the revolving plate 22 is connected to the vertical frame 26 to the.

In addition, in the embodiment of the present invention, the rotating unit is fixed to the base plate 20 at an inner position of the revolving plate 22 and has a ring-shaped rotating guide 24 having a gear portion formed on an outer circumferential surface thereof, and an upper surface of the revolving plate 22. Is disposed rotatably in the circumferential direction and rotatably disposed along the circumferential direction on an upper surface of the first magnetic plate 30 engaged with the gear portion of the outer circumferential surface of the rotating guide 24. On the first magnetic plate 30 and the second magnetic plate 38 rotatably mounted on the first magnetic plate 30 by joining the plurality of magnetic gears 36 and the threaded portion of the outer circumferential surface to the magnetic gear 36. It is connected by the connecting bar 34 in the vertical direction and consists of the upper magnetic plate 32 disposed along the circumferential direction on the upper revolving plate 28.

In summary, the revolving unit of the revolving frame RF is composed of a base plate 20, a revolving plate 22, a vertical frame 26, an upper revolving plate 28, the rotating unit is a rotating guide 24, The first magnetic plate 30, the magnetic gear 36, the second magnetic plate 38, the connecting bar, and the upper magnetic plate 32 are formed. At this time, the rotating unit may be composed of only the rotating guide 24 and the first magnetic plate 30, the embodiment of the present invention in addition to the magnetic gear 36, the second magnetic plate 38, the connecting bar ( 34), a rotating unit further comprising an upper rotating plate 32 was taken.

Therefore, when the coating coating on the product using the plate-shaped jig, the plate-shaped jig on which the product is mounted is placed on the second magnetic plate 38, and the deposition is performed while the product and the plate-shaped jig are idled and rotated.

In addition, when the deposition coating is carried out by mounting the product on the bag jig, the lower part and the upper part of the bag jig are inserted into the jig groove 36a of the magnetic gear 36 and the jig hole 32a of the upper magnetic plate 32, respectively. The deposition coating operation is performed while idling and rotating.

4 and 6 show an evaporator 40, which is another principal part of the present invention. The evaporator 40 has a structure in which the lower part is fixed to the base plate 20 constituting the revolving unit and the upper part has a conductive frame 44 mounted on the upper revolving plate 28 of the revolving unit so as to be relatively rotatable. .

The conductive frame 44 is connected to the horizontal connecting bar 44a having a rectangular cross section and electrically connected to the conductive piece 42 provided on the bottom of the vacuum chamber 10, and is connected to the horizontal connecting bar 44a and at the same time in the vertical direction. A pair of vertical support bars 45 extending in a direction and connected to each of the vertical support bars 45 to be disposed in a direction orthogonal to the horizontal connection bar 44a, and at the same time parallel to the bottom of the vacuum chamber 10; It consists of a target support bar (44b) installed. The target 46 is electrically coupled to the distal end of the pair of target support bars 44b. The target support bar 44b is provided in plural in the vertical support bar 45 in the vertical direction, and the deposition material 2 such as a low melting point metal is inserted into the target 46 installed so as to energize the target support bar 44b. Will be mounted.

The evaporator 40 having such a structure evaporates the deposition material using resistive heat while the base vacuum (working vacuum) is held inside the vacuum chamber 10, thereby depositing the deposition material on the surface of the product (2). ) To be deposited coated. In other words, the deposition material 2, which is a low melting point metal attached to the target 46 of the evaporator 40, is evaporated to a low temperature to perform deposition coating on the surface of the product.

According to the present invention having such a configuration, when the door 12 on one side of the vacuum chamber 10 is opened and the revolving frame RF is introduced into the vacuum chamber 10 by a moving cart or the like, the vacuum chamber 10 A horizontal connecting bar 44a of the conductive frame 44 mounted on the base plate 20 of the revolving frame RF is connected to the conductive piece 42 (shown in FIG. 6) on the bottom surface so as to enable energization. Power supply to 46 is possible. Of course, the target 46 is in a state where the deposition material 2 (that is, the low melting point metal) is already attached.

In this state, the door 12 of the vacuum chamber 10 is closed, and then the batch type vacuum deposition apparatus of the present invention is operated by the control panel 16 (shown in FIG. 3) to perform the deposition coating operation. That is, a base vacuum (working vacuum) for evaporation of the deposition material 2 is formed by the vacuum apparatus 14 inside the vacuum chamber 10, and the process gas Ar is inside the vacuum chamber 10. After the injection, the evaporator evaporates the deposition material by using the resistance heat by the evaporator 40 to deposit and coat the metal, which is the deposition material 2, on the surface of the product.

At this time, the evaporation using the heat of resistance is advantageous to the deposition of a metal having a low melting point (for example, Al, Cu, Ag, Au, etc.), the vaporizer 40 is applied to the product by using the heat of resistance The wearing material 2 will be deposited.

In addition, the main feature of the present invention is that by performing a deposition coating while rotating or rotating the product by the revolving frame (RF), it is possible to perform a homogeneous deposition coating of the product, and also using a plate-shaped jig It is applicable to both the case of deposition coating on the product and the case of deposition coating on the product by using the seal.

When using the plate-shaped jig, the plate-shaped jig on which the product is mounted is joined to the coupling fixing portion 38a at the center of the upper surface of the second magnetic plate 38 to place the product on the second magnetic plate 38, and then the orthogonal frame RF is mounted. It feeds into the vacuum chamber 10 by a mobile cart or the like.

At this time, a plurality of plate-shaped jigs on which the product is mounted are arranged in a plurality of positions outside the target 46 in a state in which the revolving frame RF is supported on a separate cart, and then the revolving frame RF is moved by the cart. When moved to the inside of the vacuum chamber 10, the conductive piece 42 (shown in Fig. 4) of the bottom surface of the vacuum chamber 10 is mounted on the base plate 20 of the revolving frame (RF) The frame 44 is electrically connected (shown in FIG. 6) so that power can be supplied to the target 46.

On the other hand, the drive shaft 6a of the power transmission gear 6 is provided in the rotary shaft 4 of the drive motor inside the vacuum chamber 10, and the driven gear 6b is engaged on the inner wall surface of the vacuum chamber 10. When the revolving revolving frame RF is introduced into the vacuum chamber 10, the driven gear 6b is operatively connected to the rotating shaft 4 of the drive motor by the gear part of the revolving plate 22 constituting the revolving unit. Since it is coupled to the gear), the revolving plate 22 and the upper revolving plate 28 (shown in Figure 9) is able to revolve relative to the base plate 20 in accordance with the drive of the drive motor.

Batch type vacuum deposition apparatus of the present invention by the control panel 16 (shown in FIG. 3) by putting the revolving frame RF inside the vacuum chamber 10 and closing the door 12 as described above. When the motor is rotated, the first rotating plate 30 geared to the outer circumferential surface of the rotating guide 24 rotates while the rotating plate 22 and the upper rotating plate 28 revolve as the drive motor rotates. The plurality of magnetic gears 36 installed on the upper surface of the plate 30 are gear-coupled to the outer circumferential surface of the second magnetic plate 38 to rotate itself while the second magnetic plate 38 also rotates on the first magnetic plate 30. Be sure to

In other words, the product is formed by the revolving operation of the revolving plate 22 and the upper revolving plate 28 and the revolving operation of the upper rotating plate 32 and the lower first rotating plate 30 and the second rotating plate 38. Since the supported plate-shaped jig rotates and rotates, the product can be rotated and rotated. As such, the deposition material 2 mounted on the target 46 of the evaporator 40 is evaporated while the product rotates and rotates. The deposition coating process is performed.

On the other hand, if you want to deposit coating on the product by using the bag jig to mount the product (for example, mobile phone case) on the bag jig the bottom end of the bag jig into the jig groove (36a) of the electric gear 36, the top end of the bag jig The jig hole 32a of the plate 32 is inserted, the sealing jig and the product are installed upright on the revolving frame RF, and the revolving frame RF is introduced into the vacuum chamber by using a moving cart or the like.

As such, when the enclosed revolving frame RF mounted on the product by the sealing jig is introduced into the inside of the vacuum chamber 10, the revolving magnet is rotated on the conductive piece 42 (shown in FIG. 4) on the bottom surface of the vacuum chamber 10. The conductive frame 44 mounted on the base plate 20 of the frame RF is connected to enable energization so that power can be supplied to the target 46.

Batch type vacuum deposition apparatus of the present invention by the control panel 16 (shown in FIG. 3) by putting the revolving frame RF inside the vacuum chamber 10 and closing the door 12 as described above. When the motor is rotated, the first rotating plate 30 geared to the outer circumferential surface of the rotating guide 24 rotates while the revolving plate 22 revolves as the drive motor rotates, and the upper surface of the first rotating plate 30 is installed. The plurality of magnetic gears 36 are gear-coupled to the outer circumferential surface of the second magnetic plate 38 so that the second magnetic plate 38 also rotates on the first magnetic plate 30 at the same time.

That is, the revolution of the revolving plate 22, the upper magnetic plate 32, the lower first magnetic plate 30 and the second magnetic plate 38 is rotated at the same time, and at the same time, gears to the second magnetic plate 38 Since the combined magnetism gear 36 rotates itself, the product mounted on the bag jig can also be rotated, and thus the deposition coating process is performed while the product mounted on the bag jig rotates and rotates.

Therefore, in the present invention, the product is revolved and rotated by the operation of the revolving unit and the revolving unit of the revolving frame (RF), and thus the evaporation of the target 46 of the evaporator 40 while revolving and rotating the product as described above. Since the wear material 2 is deposited on the surface of the product, there is an effect of forming a homogeneous coating layer on the product, and furthermore, a high quality coating product can be obtained.

On the other hand, in the present invention, if you want to deposit coating on the product using only the plate-shaped jig to mount the product on the plate-shaped jig and work on the second magnetic plate (38), and only to use the sealing jig to deposit coating on the product In this case, the product may be mounted on the bag jig, and the bag jig may be inserted into the jig groove 36a of the magnetic gear 36 and the jig hole 32a of the upper magnet plate 32, and the plate jig and the bag jig may be deposited. In the case of coating, the product is mounted on a plate-shaped jig and placed on the second magnetic plate 38, and the product is mounted on the bag jig to seal the jig groove 36a and the upper magnet plate 32 of the magnetic gear 36. Work by inserting into the jig hole 32a.

On the other hand, the present invention is characterized in that the product mounted on the bag jig is made of a structure that can be rotated and rotated, even if the work must be mounted on the bag jig to perform the deposition coating work effectively.

In other words, a plurality of magnetism gears 36 are disposed on the top surface of the first magnetic plate 30 along the circumferential direction, and the second magnetism rotates so as to be engaged with the magnetism gears 36 at the center of the top surface of the first magnetic plate 30. The plate 38 is further installed, and the lower end of the bag jig on which the product is mounted is coupled to the jig groove 36a of the magnetic gear 36, and at the same time, the upper end of the bag jig is coupled to the jig hole 32a of the upper magnetic plate 32. When the vacuum deposition apparatus is operated, the upper plate 32, the lower first plate 30, the second plate 38, and the electromagnet 36 rotate while the revolving plate 22 rotates. Since the bag jig mounted on the product rotates and rotates, the product mounted on the bag jig can also effectively perform deposition coating while rotating and rotating.

For example, the vacuum deposition method of the present invention forms a more homogeneous deposition coating layer on the product while not only rotating or rotating the product, but also using only a plate jig, or using only a sealing jig, or simultaneously using a plate jig and a sealing jig. Since the method of vapor deposition can be selected to meet the needs, it is an invention that can obtain very desirable results in terms of work efficiency.

Meanwhile, the embodiment of the present invention has a structure in which the second magnetic plate 38 and the magnetic gear 36 are omitted, and the idler unit is idle while the plate-shaped jig and the product are placed on the first magnetic plate 30. By rotating the first magnetic plate 30, the deposition coating operation may be performed while corotating the product, and the second magnetic plate 38 and the magnetic gear 36 are provided on the upper surface of the first magnetic plate 30. The deposition coating may be performed while placing the product on the second magnetic plate 38 by using a plate-shaped jig and rotating and rotating.

In other words, when the deposition coating is carried out by mounting the product on the plate-shaped jig, only the first guide plate 30, the connection bar 34 in the vertical direction, and the top plate 32 of the rotation guide 24 may be performed.

In addition, according to the present invention, after the process gas is injected, the organic material on the surface of the product is removed using the ion source 50 and surface modification (surface improvement) is performed to further increase the adhesion of the deposition coding layer. You can increase it.

In other words, the inner side wall of the vacuum chamber 10 is installed with an ion source 50 in the vertical direction, the ion through the ion source 50 on the surface of the product when the coating coating on the product by evaporation (evaporation) method By supplying the modified surface of the product, the adhesion of the deposition coating film will be further enhanced. In other words, the ion source 50 is used when the deposition coating on the product by the evaporation (evaporation) method.

On the other hand, the present invention is configured to perform the deposition coating by the sputtering method by the magnetron sputter 60 further provided inside the vacuum chamber 10. That is, the magnetron sputter 60 has a structure having a target (cathodes) arranged in plural (three in the present invention) in the internal position of the vacuum chamber 10, and a magnetic body 64 arranged on the back of the target. . At this time, the magnetic body 64 is made of a permanent magnet or an electromagnet.

Accordingly, the present invention can form a deposition coating film on the surface of the product by the sputtering method using the magnetron sputtering (60). That is, by arranging the magnetic material 64 on the back surface of the target 62, the electrons emitted from the target 62 (cathode) by the electric field are locally collected in the magnetic field formed outside the target 62 to process gas (Ar). By promoting collision with gas atoms, it is possible to increase the sputtering yield.

By adopting such a method of increasing the sputtering yield by the magnetron sputter 60, there is an advantage that the sputtering efficiency is increased, and the collision with the electron product (for example, the substrate and the thin film) can be reduced by the vortex movement of the electron. Low temperature rise effect can prevent defective products, and insulator such as SIO2 AL2O3 has the advantage of fast film formation speed. In addition, there is an advantage in that the deposition rate is constant at a given input power, and the uniformity of the thickness of the thin film can be easily adjusted by the proper arrangement of the magnetic material 64 and the use of a shield.

In addition, the ion source 70 is installed at a position adjacent to the target 62 inside the magnetron sputter 60 installed at the other inner position of the vacuum chamber 10. The ion source 70 has a structure in which ion outlet holes are formed at regular intervals up and down in the ion supply pipes installed up and down, and the ion is injected into the ion discharge holes of the ion supply pipe when the coating is deposited on the surface of the product by sputtering. By modifying the surface of, the adhesion of the deposition coating film is further enhanced. That is, the ion source 70 installed in the magnetron sputter 60 is used in the deposition coating of the sputtering method.

Therefore, the present invention combines evaporation using the evaporator 40 and magnetron sputtering using the magnetron 60 to obtain a better quality product by utilizing the advantages of two types of vacuum deposition. It will be said that there is a characteristic, by depositing the product by the revolving unit and the rotating unit while revolving as well as rotating, it is also characterized in that the homogeneous deposition coating of the product can be realized.

Meanwhile, in the present invention, a non-conductive shielding plate 98 is further provided on the magnetron sputter 60 portion inside the vacuum chamber 10, and the magnetic material 64 provided on the rear surface of the target 62 inside the magnetron sputter 60 is provided. Is configured to shield the magnetic force. That is, the shielding plate 98 is made of stainless steel (SUS) to have a non-conductivity to shield the magnetic, the shielding plate 98 is installed on the front portion of the magnetron sputter 60 by a fixing means such as a bolt, When the coating is performed using the evaporator 40 without coating by the Marknetron sputtering method, the magnetism of the magnetic body 64 is blocked by the non-conductive shielding plate 98, so that the evaporation is prevented. This prevents the influence of the coating operation. Meanwhile, in the present invention, the shielding plate 98 is made of a non-conductive stainless steel (SUS) to shield the magnetic, but in the embodiment, all materials that can shield the magnetic can be adopted as the shielding plate (98). Let's find out.

In addition, according to the present invention, a plasma electrode 100 for forming the entire interior of the vacuum chamber 10 in the plasma atmosphere at the target 62 position of the magnetron sputter 60 is also included.

As shown in FIG. 10, the plate 102 is installed upright at the target (cathode) 62 position of the magnetron sputter 60, and the plasma electrode 100 is vertical to the horizontal portion 100a when viewed from the side. Comprising a tracer shape having a (100b), the horizontal portion (100a) of the plasma electrode 100 penetrates through the guide 106 made of sus (SUS) material supported by the plate 102 and the Teflon spacer 104 It is supported, and the vertical portion 100b of the plasma electrode 100 is installed in parallel with the plate 102. That is, the plasma electrode 100 is a structure accommodated inside the vacuum chamber 10.

According to the present invention, when a power source (for example, using MF power) is applied to the plasma electrode 100, plasma is formed in the entire interior of the vacuum chamber 10 by the plasma electrode 100. The deposition material 2 is deposited on the surface of the product (for example, a mobile phone case) by the generated plasma, and thus the deposition material on the surface of the product is coated by using the plasma to coat the deposition material on the product surface. The effect of further improving the adhesion of (2) can be expected. That is, in the present invention, by coating the surface of the product using a plasma, it is possible to expect the effect of improving the wear resistance and corrosion resistance, such as to improve the product life.

The plate 102 illustrated in FIGS. 10 and 11 serves to support the vacuum sealing and the plasma electrode 100, and the Teflon spacer 104 is a portion where the earth wire is matched.

On the other hand, according to the present invention, the cooling water input line 110 is embedded in the plasma electrode 100, the cooling water output line 112 between the outer peripheral surface of the cooling water input line 110 and the inner peripheral surface of the plasma electrode 100. Further formed structure. That is, the plasma electrode 100 is formed in a tubular shape having a hollow portion therein, and the coolant input line 110 is embedded therein, and the coolant output line 112 is disposed between the outer circumferential surface of the coolant input line 110 and the inner circumferential surface of the plasma electrode 100. ) Is formed, and an output port 100c is provided on an outer surface of the outer circumferential surface of the plasma electrode 100 adjacent to the inlet 110a of the coolant input line 110, and an inlet 110a of the coolant input line 110. The output port 100c and the coolant output line 112 of the plasma electrode 100 are connected in a closed circuit to an external coolant supply device.

Accordingly, the coolant is introduced into the plasma electrode 100 through the coolant input line 110 and through the coolant output line 112 formed between the inner circumferential surface of the plasma electrode 100 and the outer circumferential surface of the coolant input line 110. By discharging to the outside through the output port (100c) provided on the outer circumferential surface of the plasma electrode 100 via the cooling water, there is an effect of preventing the temperature of the plasma electrode 100 is increased by the heat generated during plasma generation.

Hereinafter, a process of performing the deposition coating method of the present invention using the batch type vacuum deposition apparatus according to the above configuration will be described. As shown in FIG. 12, the deposition coating method of the present invention includes a product input process (S100), a working vacuum forming process (S200), a co-rotating process (S300), a deposition coating process (S400), and a vacuum breaking process (S500). It includes.

In the product input process (S100), a jig on which a product (for example, a mobile phone case) is mounted is installed in the revolving frame RF to be introduced into the vacuum chamber 10.

As described above, when the vacuum deposition process is to be performed on the product using the plate-shaped jig, the plate-shaped jig on which the product is mounted is coupled to the coupling fixing portion 38a at the center of the upper surface of the second magnetic plate 38 to raise the product. After the release, the revolving frame RF is introduced into the vacuum chamber 10 by a moving cart or the like.

When the vacuum deposition process is to be performed on the product by using the sealing jig, a plurality of products are mounted on the sealing jig so that the lower end of the sealing jig is inserted into the jig groove 36a of the magnetic gear 36 and the upper part of the sealing jig is the upper magnetic plate 32. Insert the jig and the product into the upright frame (RF) upright by inserting into the jig hole (32a) of the), and then enters the inside of the vacuum chamber 10 using a moving cart or the like.

After the product input process (S100), a work cold (Poly cold cool gas on) is formed in the vacuum chamber 10. In the work vacuum forming process (S200), the vacuum chamber 10 is formed by the vacuum device 14. The base vacuum for evaporation of the vapor deposition material 2 is formed in the interior of the chamber C. At this time, the process gas Ar is also injected into the vacuum chamber 10.

The revolving process (S300) is a process of revolving and rotating the product for deposition coating by revolving and rotating the jig on which the product is mounted by the revolving frame (RF). That is, the drive plate 22 is driven by driving the drive motor in a state in which the gear portion of the outer circumferential surface of the revolving plate 22 constituting the revolving unit is geared to the driven gear 6b connected to the rotation shaft 4 of the drive motor. Allow it to revolve relative to the plate 20. Then, the first magnetic plate 30 geared to the outer circumferential surface of the rotating guide 24 is rotated, the plurality of magnetic gear 36 provided on the upper surface of the first magnetic plate 30 is the second magnetic plate 38 of the The second magnetic plate 38 is also rotated on the first magnetic plate 30 at the same time as the gear is coupled to the outer circumferential surface itself. That is, since the revolving plate 22 is revolved and the first revolving plate 30, the revolving gear 36, and the second revolving plate 38 are also rotated together, the jig and the product mounted thereon revolve and revolve.

In the deposition coating process (S400) to form the deposition layer on the surface of the product mounted on the jig by operating the evaporator 40 or the magnetron sputter provided in the interior of the vacuum chamber 10.

That is, the plate-shaped jig on which a product such as a mobile phone case is mounted is coupled to the plate fixing jig 38a protruding from the center on the second magnetic plate 38 to place the product on the second magnetic plate 38. When the evaporator 40 is operated while the product is rotated and rotated by the operation of the revolving unit and the revolving unit of the revolving frame RF in the state, the deposition unit is mounted on the target 46 of the evaporator 40. As the material 2 (eg, a low melting point metal) evaporates, a deposition coating layer is formed on the surface of the product.

At this time, the evaporator 40 deposits a metal, which is the deposition material 2, on the surface of the product by evaporating the deposition material using resistance heat in a state where the base vacuum is held inside the vacuum chamber 10. Allow to be coated. In other words, the deposition material 2 (i.e., low melting point metal) mounted on the target 46 of the evaporator 40 is evaporated to a low temperature to perform deposition coating on the product surface. Evaporation using resistance heat is advantageous for the deposition of metals having a low melting point (for example, Al, Cu, Ag, Au, etc.), and thus the vapor deposition material is applied to the product using resistance heat by the evaporator 40. (2) is deposited.

After the deposition coating process S400 is completed, a vacuum destruction process S500 is performed. That is, by stopping the operation of the vacuum device which has held the inside of the vacuum chamber 10 in the base vacuum state, the vacuum chamber 10 is switched to the state of poly cold hot gas on which releases the base vacuum in the vacuum chamber 10. .

After completing the deposition coating on the surface of the product and releasing the base vacuum inside the vacuum chamber 10, open the door of the vacuum chamber 10, take out the revolving frame (RF) again, and remove the product from the jig. If the take-out process (S500) is performed, the deposition coating work for the product is completed.

On the other hand, as described above, the plasma is formed on the entire interior of the vacuum chamber 10 by the plasma electrode rod 100 provided at the target 62 position of the magnetron sputter 60 to adhere to the surface of the product of the deposition material 2. By performing the process to improve the wear resistance and corrosion resistance, such as to improve the life of the product is further performed.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various permutations, modifications, and changes can be made without departing from the spirit of the present invention. It will be apparent to those who have it.

1 is a plan view showing a vacuum chamber and a vacuum apparatus of the present invention

FIG. 2 is a side view of FIG. 1

3 is a front view showing the door part of the vacuum chamber shown in FIG.

4 is a plan view schematically showing the structure of a revolving frame, an evaporator and a magnetron sputter which are main parts of the present invention;

FIG. 5 is a perspective view schematically showing the configuration of the co-rotating frame shown in FIG.

6 is a view showing a part of the side of the evaporator mounted in FIG.

FIG. 7 is an enlarged plan view of a part of a rotating unit in the rotating frame shown in FIG. 4; FIG.

FIG. 8 is a bottom view showing the structure of an upper rotating plate and an upper rotating plate in the rotating frame shown in FIG. 4; FIG.

9 is an enlarged view of a portion of the upper magnetic plate shown in FIG. 8;

10 is a side view conceptually showing the structure of a plasma electrode part which is another main part of the batch type vacuum deposition apparatus of the present invention;

11 is a front view of FIG. 10.

12 is a flow chart showing a deposition coating method of the present invention.

Claims (8)

A vacuum chamber 10 having a door 12 at one side, a revolving unit and a rotating unit, and a revolving rotating frame RF that is introduced into the vacuum chamber 10 and the revolving rotating frame It comprises an evaporator 40 which is provided in (RF) and equipped with the target 46 which mounts the vapor deposition material 2, The revolving unit of the revolving frame (RF) is installed on the upper surface of the base plate 20 and the base plate 20 provided with the evaporator 40 on the upper surface of the base plate 20 at an outer position of the target. The outer circumferential surface includes a revolving plate 22 formed with a gear, The rotating unit of the revolving frame (RF) is fixed to the upper surface of the base plate 20 at a position between the revolving plate 22 and the target 46 and a rotating guide 24 having a threaded portion on its outer circumferential surface; A first magnet plate 30 rotatably mounted on the top of the revolving plate 22 by being engaged with a gear part of the outer guide surface of the rotating guide 24 and an upper surface of the first magnet plate 30. A plurality of magnetism gears 36 arranged in a circumferential direction thereof to be rotatable, and rotatably coupled to a central portion of the first magnet plate 30, and a screw portion of an outer circumferential surface thereof meshes with the plurality of magnetism gears 36. Batch type vacuum deposition apparatus comprising a second magnetic plate (38). The upper surface of the revolving plate 22 is provided with a plurality of bar-shaped vertical frame 26, the lower end is fixed, the upper revolving plate 28 is coupled to the upper end of the vertical frame 26 Thus, the revolving plate 22 and the upper revolving plate 28 are connected via the vertical frame 26 and the upper revolving plate 28 is disposed at a position facing the revolving plate 22. Batch type vacuum deposition apparatus, characterized in that consisting of. According to claim 2, wherein the driving chamber is mounted to the vacuum chamber 10, the revolving frame (RF) is injected, the rotating shaft 4 of the drive motor is accommodated in the vacuum chamber 10, A power transmission gear 6 is provided on the rotation shaft 4 of the driving motor, and a gear part formed on an outer circumferential surface of the revolving plate 22 of the revolving frame RF is driven through the power transmission gear 6. Batch type vacuum deposition apparatus characterized in that the drive is connected to the rotary shaft (4) of the motor. According to claim 1, wherein the inside of the vacuum chamber 10 is further provided with a magnetron sputter 60, the magnetron sputter 60 is provided with a target 62 therein and a magnetic body on the back of the target 62 Batch type vacuum deposition apparatus, characterized in that configured to be provided (64). The method of claim 4, further comprising a plasma electrode 100 installed at the target 62 position of the magnetron sputter 60, the inside of the vacuum chamber 10 by using the plasma electrode 100 Batch type vacuum deposition apparatus, characterized in that to form a plasma to coat the material for deposition on the product surface (2). [Claim 6] The coolant input line 110 of claim 5, further comprising a coolant input line 110 embedded in the plasma electrode 100 to form a coolant output line 122 between an outer circumferential surface and an inner circumferential surface of the plasma electrode 100. Batch type vacuum deposition apparatus. Product input process (S100) for installing the jig mounting the product on the revolving frame (RF) having a revolving unit and the revolving unit to put the revolving frame (RF) into the vacuum chamber 10 (S100), and The operation of forming the base vacuum by the vacuum device in the vacuum chamber 10, the vacuum forming process (S200), and the revolving unit and the rotating unit of the revolving frame (RF) installed in the vacuum chamber 10 Forming a coating coating layer on the surface of the product is revolved and rotated by the operation of the revolving frame (RF) and the revolving process (S300) for revolving and rotating the jig and the product by revolving and rotating by the pre-drive means Deposition coating process (S400), and the deposition coating method comprising a vacuum breaking process (S500) for releasing the vacuum in the vacuum chamber (10). The vacuum chamber (10) of claim 7, further comprising a magnetron sputter (60) inside the vacuum chamber (10), the plasma electrode (100) provided at a target (62) position of the magnetron sputter (60). Deposition coating method characterized in that to form a plasma inside the 10) to coat the material for deposition on the product surface (2).

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