CN101376964B - Sputtering type film coating apparatus and film coating method - Google Patents
Sputtering type film coating apparatus and film coating method Download PDFInfo
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- CN101376964B CN101376964B CN200710201556A CN200710201556A CN101376964B CN 101376964 B CN101376964 B CN 101376964B CN 200710201556 A CN200710201556 A CN 200710201556A CN 200710201556 A CN200710201556 A CN 200710201556A CN 101376964 B CN101376964 B CN 101376964B
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Abstract
The invention relates to a sputtering type film coating device which comprises at least a film coating workshop, at least a target arranged in the film coating workshop and used to coat the film on a work piece, a carrier and an auxiliary rotary unit; the carrier carries the work piece along the extending direction of the bottom of the film coating workshop, and comprises a bearing bracket and at least a bearing shaft; the bearing shaft is used to bear the work piece and drives the work piece to rotate around the central shaft of the bearing shaft; the independent control auxiliary rotary unit is used to assist the bearing shaft in rotating around the central shaft. The sputtering type film coating device and a film coating method can coat the film on the surface of the work piece, so that the surface film layer is even.
Description
Technical field
The present invention relates to a kind of film coating apparatus and film coating method, relate in particular to a kind of sputtering type coating device and adopt the film coating method of this sputtering type coating device.
Background technology
Sputter is to utilize the ion of plasma generation to remove to clash into cathode targets, and the atom in the target is knocking-on and be deposited on and be piled into rete on the substrate surface.Because sputter can be reached preferable sedimentation effect, accurate composition control, and lower manufacturing cost, therefore in industry, is widely used.
The application of current phone digital camera lens is day by day popularized, and therefore is necessary to promote the manufacturing technology of its key components and parts, to reduce its manufacturing cost effectively and to promote its yield.Camera lens module as one of camera lens key components and parts generally includes microscope base, lens barrel and is housed in eyeglass, pad (Spacer), aperture, the cutoff filter elements such as (IR-cut Filter) in the lens barrel.The method of design of eyeglass sees also the paper Aspheric lens design that people such as Chao deliver in IEEE system in 2000, UW meeting (2000 IEEE UltrasonicsSymposium).
In camera lens module assembling process, usually need elements such as said eyeglass, pad, aperture, cutoff filters again lens barrel to be screwed in microscope base to be assembled into a complete camera lens module through the definite sequence lens barrel of packing into.As shown in Figure 1; In order to reduce the degree that said camera lens module receives EMI; Before said camera lens module is assembled; (Electromagnetic Interference, EMI) rete is to promote the ability of the anti-EMI of assembling rear lens module generally to need to go up the anti-EMI of sputter last layer in the outer circumference surface 20a of microscope base 2a.Product needed behind the plated film is done multinomial environmental testing; Such as HTHP test, thermal shock test, corrosion test etc., if the rete that plates is inhomogeneous, it comes off easily; And the area resistance value that rete is thin is higher; The poor effect of anti-electromagnetic interference (EMI), therefore, the homogeneity of thicknesses of layers is extremely important.
When prior art prepared the rete of said microscope base 2a outer circumference surface 20a with sputtering method, this microscope base 2a bearing of trend below keeping certain speed court below the target was advanced, in traveling process; For microscope base 2a outer circumference surface, different sites 20b, 20c are inconsistent with respect to the geometric position of target, and plating target bundle 1b, 1c range above that is also inconsistent; Therefore, thicknesses of layers is inhomogeneous when causing plated film easily, in order to improve the uniformity coefficient of said thicknesses of layers; General target is big more a lot of than microscope base, and the dispersion of target beam, therefore; Target consumes more, and the plated film uniformity coefficient is undesirable to a certain extent.
In view of this, be necessary to provide a kind of, can further improve evenness of membranous layer, and can improve the sputtering type coating device and the film coating method of target utilization compared to prior art.
Summary of the invention
To a kind of raising evenness of membranous layer be described with embodiment below, and can improve the sputtering type coating device and the film coating method of target utilization.
The present invention provides a kind of sputtering type coating device, and it comprises a plated film working spaces; At least one target, it is arranged in the said plated film working spaces, is used for said workpiece is carried out plated film; A carrier, it can do motion of translation along the bearing of trend of the bottom of said plated film working spaces, and this carrier comprises an anchor and at least one reach; This anchor is used for fixing this at least one reach; Said at least one reach is used to carry workpiece, and drives said workpiece around this at least one reach rotation; Said sputtering type coating device; Also further comprise the auxiliary swivel arrangement of an independent control, said auxiliary swivel arrangement moves with respect to transmission direction, carries out independent rotation thereby drive said at least one reach around its hub.
And, a kind of sputtering type coating method that adopts above-mentioned sputtering type coating device, it may further comprise the steps:
(1) a kind of sputtering type coating device as claimed in claim 1 is provided; (2) said at least one reach is done motion of translation along the direction that approaches said at least one target; Simultaneously, said auxiliary rotary unit assists said at least one reach to carry out independent rotation around its hub.(3) said workpiece is done motion of translation with this at least one reach along the direction that approaches said at least one target, and simultaneously, around this at least one reach rotation; (4) said at least one target carries out plated film to said workpiece.
With respect to prior art; Said sputtering type coating device and film coating method are via the carrier that can do motion of translation along the plated film working spaces is set; And at least one reach of this carrier is set to and can rotates around its hub; On the one hand, can drive the workpiece that carries at least one reach via said carrier and carry out plated film successively, thereby can realize working continuously of plated film; On the other hand, at least one reach drives workpiece together around its axle rotation, improves the uniformity coefficient of thicknesses of layers, and then improves yield.
Description of drawings
Fig. 1 is that existing the employing spattered the method for crossing is carried out plated film to microscope base synoptic diagram.
Fig. 2 is the synoptic diagram of the sputtering type coating device that provides of first embodiment of the invention.
Fig. 3 is the structural representation of microscope base.
Fig. 4 is the three-dimensional enlarged diagram of the carrier of sputtering type coating device shown in Figure 2.
Fig. 5 is sputtering type coating device shown in Figure 2 carries out plated film to the outer circumference surface of microscope base a synoptic diagram.
Fig. 6 is the synoptic diagram of the sputtering type coating device shown in the second embodiment of the invention.
Embodiment
To combine accompanying drawing that the present invention is done further detailed description below.
See also Fig. 2, a kind of sputtering type coating device 20 that first embodiment of the invention provides, said sputtering type coating device 20 comprise 21, one carriers 22 in a plated film working spaces and a target 23.
Said plated film working spaces 21 is in order to provide a vacuum splashing and plating environment.Usually, this plated film working spaces 21 comprises a gas inlet that is connected with this plated film working spaces 21 (figure does not show) and a pneumatic outlet (not indicating).Wherein, the gas inlet is used in plated film working spaces 21 importing discharge gas, for example argon gas, nitrogen etc., and pneumatic outlet is used to make plated film working spaces 21 when work, to keep certain vacuum tightness.This pneumatic outlet links to each other with a vacuum extractor 24 usually, and this vacuum extractor 24 can be molecular pump, Lip river thatch vacuum pump or dry type oil-sealed rotary pump etc.
Said target 23 is arranged in the said plated film working spaces 21, and in the present embodiment, this target 23 is the copper target, and its number can be set to three, and these three targets distribute along the direction of arrow among Fig. 2.In addition, these three targets 23 can be loaded into three target electrodes 230 respectively, and these three target electrodes 230 can be plate electrode, and it serves as negative electrode and its on off state can be distinguished independent control usually in the sputter process.Can carry out plated film to the to be coated surperficial 300b of microscope base as shown in Figure 3 30 through bombardment target 23.The columnar structured 30b that said microscope base 30 generally includes a base 30a and extends out from this base 30a, said anti-EMI rete is formed on the outer circumference surface 300b of this columnar structured 30b.
See also Fig. 4, said carrier 22 comprises a transmitting device 221, anchor 222, at least one reach 223, and the auxiliary rotary unit 224 of an independent control.Said transmitting device 221 is arranged at the bottom of said plated film working spaces 21 and can does motion of translation along the bearing of trend (direction shown in arrow among Fig. 2) of this bottom.Preferably, this transmitting device 221 can be a transport tape.Said anchor 222 is arranged on the said transmitting device 221, drives it by transmitting device 221 and moves, and said at least one reach 223 is arranged on this anchor 221 and can rotates around its hub.
Particularly, these at least one reach 223 two ends are set in two the set collar 222a, 221b of this anchor 222, and this at least one reach 223 drives motion with anchor 222 by transmitting device 221.This at least one reach 223 can be around its hub rotation with anchor 222 motions simultaneously.Particularly, this at least one reach 223 can pass through auxiliary rotary unit 224 driven rotary, preferably; Should comprise two lath 224a, 224b by auxiliary rotary unit 224; Its middle plate strip 224a, 224b have a dentation contact surface respectively, the dentation contact surface of this lath 224a, 224b respectively with two ends tooth-like part of anything 223a, the 223b mechanical engagement of this at least one reach, this auxiliary rotary unit 224 can move with respect to transmitting device 221; Drive said at least one reach 223 around its hub rotation; Particularly, this lath 224a, 224b are moved to position 41 by position 40, drive said at least one reach 223 around its hub rotation.Certainly should also can include only a lath by auxiliary rotary unit 224, as be arranged at the lath 224a of said reach 223 1 ends, it moves with respect to transmitting device 221, also can drive 223 around its hub rotation.
Said at least one reach 223 is used to carry microscope base 30; Two set collar 222a, the 222b that is arranged on the said anchor 222 passed at its two ends; Do motion of translation as said to the direction that approaches target with anchor 222, particularly, this at least one reach 223 can be by electro-conductive material; Process like metals such as iron, aluminium, it serves as anode in the sputter process.
Please further consult Fig. 2, Fig. 4 and Fig. 5; To briefly describe a kind of sputtering type coating device 20 that utilizes first embodiment of the invention to provide below and have the sputtering type coating method of anti-EMI rete in last making of the outer circumference surface 300b of microscope base 30, it may further comprise the steps:
(1) workpiece 30 to be coated is loaded on said at least one reach 223.
As shown in Figure 4, said microscope base 30 is fixed on said at least one reach 223, and coaxial with this at least one reach, and can be driven around self hub rotation by at least one reach 223.
(2) said at least one reach 223 is done motion of translation along the direction that approaches said at least one target 23, and simultaneously around its hub rotation.
Said at least one reach 223 two ends are enclosed within on the set collar 222 of anchor 222; And can arbitrarily rotate around its hub; It will be with anchor 222, with heading (as in Fig. 5 horizontal arrow shown in direction) motion and the approaching said target 23 of transmitting device 221 along this transmitting device 221.Simultaneously, this auxiliary rotary unit 224 drives these at least one reach 223 around its hub rotation, makes to be enclosed within workpiece 30 on this at least one reach 223 also around self hub rotation.Particularly; Should assist two boards bar 224a, the 224b of rotary unit 224, can move with respect to transmitting device 221, wherein; Lath 224a, 224b have a dentation contact surface respectively; The dentation contact surface of this lath 224a, 224b respectively with at least one reach 223 two ends tooth-like part of anything 223a, 223b mechanical engagement, this auxiliary rotary unit 224 moves with respect to transmitting device 221 as said, drives 223 rotations of at least one reach.
It is understandable that; When said anchor 222 gets into said plated film working spaces 21 under the drive of said transmitting device 221; Can be evacuated to the vacuum state of predetermined pressure via 24 pairs of plated film working spacess 21 of the vacuum extractor that is connected with plated film working spaces 21; And feed discharge gass to plated film working spaces 21 via the gas inlet that is connected with plated film working spaces 21, like argon gas etc.
(3) 23 pairs of said workpiece 30 of said at least one target carry out plated film.
Said at least one target 23 can be provided with as required, for example, generally plates the anti-electromagnetic radiation film; Needed target is divided into two districts, and first district is the copper target, and second district is the stainless steel target; Each district can be made up of 3 targets; Control target quantity can be plated different thickness, as, plate layer of copper (in the about 2 μ m of copper film layer thickness) earlier; Again said microscope base 30 is sent into second district after having plated, further sputter last layer stainless steel rete (in the about 0.5 μ m of stainless steel membrane layer thickness) on the copper film layer of the outer circumference surface 300b of said microscope base 30.
As shown in Figure 5; In the time of under said microscope base 30 moves at least one target 23; Can apply negative voltage to said target electrode 230 by external power source (figure does not show); At least one reach 223 ground connection (figure does not show) simultaneously make said copper target 23 lip-deep discharge gas ionization and produce plasma, on copper target 23, clash into atom or atomic group through this isoionic ion; And this atomic group is deposited on said outer circumference surface 300b to be coated, can on this outer circumference surface 300b, form a rete.
It is understandable that; When said microscope base 30 moves to said copper target 23 relatively; Microscope base 30 is around self hub rotation, and it is consistent with respect to copper target 23 geometric positions that the outer circumference surface 300b of microscope base 30 goes up any part, and the thicknesses of layers that therefore on this outer circumference surface 300b, forms is even.Controls revolution speed can obtain suitable thickness.And for sputtering type coating device of the present invention, owing to bigger target need be set, and the target bundle do not need to disperse, and therefore, can improve target utilization, reaches the effect that reduces cost.
See also Fig. 6; A kind of sputtering type coating device 60 that second embodiment of the invention provides; Sputtering type coating device 20 structures that itself and first embodiment of the invention provide are basic identical; Its difference is: said sputtering type coating device 60 also further comprises a load chamber 62, relief chamber 63, a heating chamber 64 and a purge chamber 65; Said transmitting device 221 is arranged at the bottom 210 of this load chamber 62, heating chamber 64, purge chamber 65, plated film working spaces 21 and relief chamber 63 respectively, and said vacuum extractor 24 is connected with said load chamber 62, heating chamber 64, purge chamber 65 and relief chamber 63 through an extraction pipe respectively.
Particularly, said load chamber 62, heating chamber 64, purge chamber 65, the adjacent successively setting in plated film working spaces 21 and relief chamber 63.Wherein, said load chamber 62 is used to accommodate microscope base to be coated 30, and said relief chamber 63 is used to accommodate the microscope base 30 of plated film.
Said heating chamber 64 is used for carrying out before plasma cleans said microscope base to be coated 30 being sent into said purge chamber 65; Accommodate and heat this microscope base 30; So that this microscope base 30 is carried out drying, and the plated film quality when promoting this microscope base 30 and carrying out plated film in said plated film working spaces 21.
Said purge chamber 65 is used for before said microscope base 30 is sent into plated film working spaces 21 carrying out plated film; Outer circumference surface 300b to be coated to this microscope base 30 carries out plasma clean (plasma cleaning); So that the outer circumference surface 300b to be coated of said microscope base 30 keeps clean, thereby in said plated film working spaces 21, obtain preferable coating effects.
Said transmitting device 221 is arranged at the bottom of said load chamber 62, heating chamber 64, purge chamber 65, plated film working spaces 21 and relief chamber 63, is doing motion of translation in this load chamber 62, heating chamber 64, purge chamber 65, plated film working spaces 21 and relief chamber 63 respectively successively thereby can drive said microscope base 30.
In addition; Said vacuum extractor 24 can be respectively vacuumizes said load chamber 62, heating chamber 64, purge chamber 65, plated film working spaces 21 and relief chamber 63 independently, and the vacuum tightness of this load chamber 62, heating chamber 64, purge chamber 65, plated film working spaces 21 and relief chamber 63 can be adjusted according to the operation needs.
The sputtering type coating device 20,60 that the first embodiment of the invention and second embodiment are provided respectively; Its via the carrier 22 that can do motion of translation along plated film working spaces 21 is set, and at least one reach 223 of this carrier 22 is set to can be around its hub rotation; Can carry out plated film successively via the microscope base 30 that said carrier 22 drives said at least one reach 223 and upward carrying thereof, thereby can realize working continuously of plated film; And simultaneously drive said at least one reach 223 and go up the microscope base 30 that carries, thereby realize that microscope base 30 needs the outer circumference surface 300b of plated film to obtain even rete around its hub rotation via the auxiliary rotary unit of an independent control.
It is understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.
Claims (8)
1. sputtering type coating device, it comprises:
A plated film working spaces;
A carrier; This carrier comprises the auxiliary rotary unit of a transmitting device, anchor, at least one reach and an independent control; Said transmitting device is arranged at the bottom of said working spaces, and can do motion of translation along the bearing of trend of the bottom of this working spaces, and said anchor is arranged on the said transmitting device; And drive along the bearing of trend of the bottom of said plated film working spaces by said transmitting device and to do motion of translation; This at least one reach is arranged on this anchor, and is used to carry workpiece, and drives said workpiece and carry out independent rotation around its hub; Said auxiliary rotary unit can move with respect to said transmitting device; Said auxiliary rotary unit comprises that at least one has the plate of a serrated face, and the gear mechanism engagement of this serrated face and said at least one reach one end is rotated around its hub when this at least one plate makes said at least one loading bearing when said anchor moves;
And
At least one target, it is arranged in the said plated film working spaces, is used for said workpiece is carried out plated film.
2. sputtering type coating device as claimed in claim 1 is characterized in that, said transmitting device is a transport tape.
3. sputtering type coating device as claimed in claim 1 is characterized in that, said sputtering type coating device further comprises a purge chamber, and said purge chamber and the adjacent setting in said plated film working spaces are used to accommodate and clean said workpiece.
4. sputtering type coating device as claimed in claim 3 is characterized in that, said sputtering type coating device further comprises a heating chamber, and the adjacent setting with said purge chamber of said heating chamber is used to accommodate and said workpiece is carried out drying.
5. sputtering type coating device as claimed in claim 4; It is characterized in that; Said sputtering type coating device further comprises a load chamber and a relief chamber, the adjacent setting with said heating chamber of said load chamber, said relief chamber and the adjacent setting in said plated film working spaces; Said load chamber is used to accommodate workpiece to be coated, and said relief chamber is used to accommodate the workpiece of plated film.
6. sputtering type coating device as claimed in claim 5; It is characterized in that; Said sputtering type coating device further comprises a vacuum extractor; Said vacuum extractor is connected with said load chamber, said heating chamber, said purge chamber, said plated film working spaces and said relief chamber respectively through an extraction pipe, independently this load chamber, heating chamber, purge chamber, plated film working spaces and relief chamber are vacuumized respectively.
7. sputtering type coating device as claimed in claim 1 is characterized in that, said sputtering type coating device further comprises at least one target electrode that is arranged in the said working spaces, corresponding respectively each target that loads of said each target electrode.
8. sputtering type coating method, it may further comprise the steps:
(1) a kind of sputtering type coating device as claimed in claim 1 is provided;
(2) sheathed at least one workpiece on said at least one reach, said transmitting device drive this at least one reach and do motion of translation along the direction that approaches said at least one target, and simultaneously, said at least one reach is rotated around its hub;
(3) the said at least one target of bombardment carries out plated film to said at least one workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710201556A CN101376964B (en) | 2007-08-31 | 2007-08-31 | Sputtering type film coating apparatus and film coating method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710201556A CN101376964B (en) | 2007-08-31 | 2007-08-31 | Sputtering type film coating apparatus and film coating method |
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| Publication Number | Publication Date |
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| CN101376964A CN101376964A (en) | 2009-03-04 |
| CN101376964B true CN101376964B (en) | 2012-08-29 |
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| CN200710201556A Expired - Fee Related CN101376964B (en) | 2007-08-31 | 2007-08-31 | Sputtering type film coating apparatus and film coating method |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101921992B (en) * | 2009-06-16 | 2013-03-20 | 鸿富锦精密工业（深圳）有限公司 | Carrying device |
| CN105734509A (en) * | 2016-05-04 | 2016-07-06 | 河南鸿昌电子有限公司 | Plasma sputtering refrigeration device crystal plate coating device and refrigeration device crystal plate coating method |
| CN106178113A (en) * | 2016-08-05 | 2016-12-07 | 北京爱康宜诚医疗器材有限公司 | Sputtering target, sputter and prosthese coating process |
| CN107326334A (en) * | 2017-07-12 | 2017-11-07 | 维达力实业(深圳)有限公司 | Continuous type coating apparatus |
| CN107475677A (en) * | 2017-08-18 | 2017-12-15 | 嘉兴申宁精密科技有限公司 | A kind of device using physical gas-phase deposition sputter coating |
| CN112281123B (en) * | 2020-10-23 | 2022-11-11 | 业成科技（成都）有限公司 | Sputtering system |
| CN114438577B (en) * | 2022-01-10 | 2023-07-25 | 广东伊菲特光学科技有限公司 | Optical lens shell anti-oxidation coating device |
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| US4042128A (en) * | 1975-11-26 | 1977-08-16 | Airco, Inc. | Substrate transfer apparatus for a vacuum coating system |
| US4701251A (en) * | 1986-02-03 | 1987-10-20 | Bvt Limited | Apparatus for sputter coating discs |
| CN2086749U (en) * | 1990-12-25 | 1991-10-16 | 航空航天工业部第五研究院五一一研究所 | Multi-arc-magnetron sputtering multifunctional coating equipment |
| CN2732757Y (en) * | 2004-07-15 | 2005-10-12 | 北京清华阳光能源开发有限责任公司 | Continuous coating device for coating capable of selectively absorbing solar spectrum |
| CN2797387Y (en) * | 2005-02-16 | 2006-07-19 | 友威科技股份有限公司 | Continuous vacuum film coating machine with built-in electrostatic dusting mechanism |
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2007
- 2007-08-31 CN CN200710201556A patent/CN101376964B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4042128A (en) * | 1975-11-26 | 1977-08-16 | Airco, Inc. | Substrate transfer apparatus for a vacuum coating system |
| US4701251A (en) * | 1986-02-03 | 1987-10-20 | Bvt Limited | Apparatus for sputter coating discs |
| CN2086749U (en) * | 1990-12-25 | 1991-10-16 | 航空航天工业部第五研究院五一一研究所 | Multi-arc-magnetron sputtering multifunctional coating equipment |
| CN2732757Y (en) * | 2004-07-15 | 2005-10-12 | 北京清华阳光能源开发有限责任公司 | Continuous coating device for coating capable of selectively absorbing solar spectrum |
| CN2797387Y (en) * | 2005-02-16 | 2006-07-19 | 友威科技股份有限公司 | Continuous vacuum film coating machine with built-in electrostatic dusting mechanism |
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