CN106178113A - Sputtering target, sputter and prosthese coating process - Google Patents

Sputtering target, sputter and prosthese coating process Download PDF

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Publication number
CN106178113A
CN106178113A CN201610639742.8A CN201610639742A CN106178113A CN 106178113 A CN106178113 A CN 106178113A CN 201610639742 A CN201610639742 A CN 201610639742A CN 106178113 A CN106178113 A CN 106178113A
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Prior art keywords
sputtering
shutter
target
sputtering target
sputter
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Inventor
孟德松
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Beijing AK Medical Co Ltd
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Beijing AK Medical Co Ltd
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Priority to CN201610639742.8A priority Critical patent/CN106178113A/en
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L27/00—Materials for grafts or prostheses or for coating grafts or prostheses
    • A61L27/28—Materials for coating prostheses
    • A61L27/30—Inorganic materials
    • A61L27/306—Other specific inorganic materials not covered by A61L27/303 - A61L27/32
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L27/00—Materials for grafts or prostheses or for coating grafts or prostheses
    • A61L27/50—Materials characterised by their function or physical properties, e.g. injectable or lubricating compositions, shape-memory materials, surface modified materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5806—Thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2420/00—Materials or methods for coatings medical devices
    • A61L2420/02—Methods for coating medical devices

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Dermatology (AREA)
  • Physics & Mathematics (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Transplantation (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention provides a kind of sputtering target, sputter and prosthese coating process, sputtering target includes: sputtering plates, and sputtering plates is provided with sputtering hole；Shutter, shutter blocks at sputtering hole, and shutter arranges to adjust the flow area in the sputtering hole that shutter is blocked movingly.Sputtering target in the present invention solves life-span of borrowed structure of the prior art relatively low problem.

Description

Sputtering target, sputter and prosthese coating process
Technical field
The present invention relates to therapeutic treatment field, in particular to a kind of sputtering target, sputter and prosthese coating process.
Background technology
Ti6Al4V alloy is because preferable biocompatibility, corrosion resistance, high intensity, elastic modelling quantity are close with cortical bone etc. excellent More performance, is widely used in medical domain.But Al, V ion will be discharged in human body environment for a long time.Al and V ion Human body is had toxicity, the carcinogenic and possibility of teratogenesis.And Al makes Ti surface potential shuffle, in the environment contacted with thrombosis liquid Fibrinous deposition can be caused to form thrombosis, this reduces the safety and reliability of materials'use.
At present, the material that some borrowed structures use is Ti6Al4V alloy, due to Al, V elemental release can cause prosthese without Bacterium property loosens, and reduces the prosthese life-span.
Summary of the invention
Present invention is primarily targeted at a kind of sputtering target of offer, sputter and prosthese coating process, to solve existing skill The problem that life-span of the borrowed structure in art is relatively low.
To achieve these goals, according to the first aspect of the invention, it is provided that a kind of sputtering target, including: sputtering plates, Sputtering hole it is provided with on sputtering plates；Shutter, shutter blocks at sputtering hole, and shutter arranges movingly and blocks to adjust The flow area in the sputtering hole that plate is blocked.
Further, shutter is movably disposed on sputtering plates.
Further, sputtering hole is rectangular opening, and the length direction of shutter rectangular opening is movably disposed.
Further, shutter is rotatably arranged on sputtering plates.
Further, sputtering target also includes: driving means, and driving means is connected with shutter, to drive shutter to open Or Guan Bi sputtering hole.
Further, driving means is servomotor.
Further, being provided with and sputter the receiving chamber that hole connects in sputtering plates, shutter is movably disposed at receiving Intracavity.
Further, the back side of sputtering plates is provided with target bonnet, and target bonnet blocks the dorsal part in sputtering hole.
Further, sputtering plates being provided with fixed mount, target bonnet is fixed on fixed mount.
According to the second aspect of the invention, it is provided that a kind of sputter, sputter very with being arranged on including sputtering vacuum chamber Empty indoor sputtering target, sputtering target is above-mentioned sputtering target.
According to the third aspect of the present invention, it is provided that a kind of utilize above-mentioned sputter that prosthese is carried out the prosthese of coating Coating process, including: step one: make the shutter of sputter move to primary importance, and sputter first to the outer surface of prosthese Plant material；Step 2: after the scheduled time, makes the shutter of sputter move to the second position, and continues to the outer surface of prosthese Continuous the first material of sputtering.
Sputtering target in the present invention includes sputtering plates and for blocking the shutter in the sputtering hole on this sputtering plates, owing to hiding Baffle plate is movably disposed on sputtering plates, as such, it is possible to by spattering that the position adjustment shutter of regulation shutter is blocked The flow area of perforation, and then this sputtering plates can be utilized at the target atom of the surface of prosthese sputtering different specific weight, Jin Erke There is with the surface-coated at prosthese the protective coating of gradient, utilize this protective coating just can wrap material for Ti6Al4V closes The outer surface of the prosthetic main of gold, prevents the situation occurring prosthese aseptic loosening because of Al, V elemental release from occurring, improves The life-span of prosthese, and prevent Al ion and the infringement of V ion pair human body, improve the safety and reliability that prosthese uses.
Accompanying drawing explanation
The Figure of description of the part constituting the application is used for providing a further understanding of the present invention, and the present invention shows Meaning property embodiment and explanation thereof are used for explaining the present invention, are not intended that inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 shows the structural representation of the embodiment of the sputtering target according to the present invention；
Fig. 2 shows the rearview of the sputtering target in Fig. 1；And
Fig. 3 has used the structural representation of the embodiment of the sputter according to the present invention.
Wherein, above-mentioned accompanying drawing includes the following drawings labelling:
10, sputtering plates；11, sputtering hole；12, fixed mount；20, shutter；30, target bonnet；40, sputtering vacuum chamber；41、 Circular；42, vacuum system connecting portion；43, circular target position；44, keep forging ahead sample gate；45, rectangular target；50, driving means.
Detailed description of the invention
It should be noted that in the case of not conflicting, the embodiment in the application and the feature in embodiment can phases Combination mutually.Describe the present invention below with reference to the accompanying drawings and in conjunction with the embodiments in detail.
The invention provides a kind of sputtering target, refer to Fig. 1 to Fig. 3, this sputtering target includes: sputtering plates 10, sputtering plates 10 On be provided with sputtering hole 11；Shutter 20, shutter 20 blocks at sputtering hole 11, and shutter 20 arranges to adjust movingly The flow area in the sputtering hole 11 that shutter 20 is blocked.
Sputtering target in the present invention includes sputtering plates 10 and for blocking the shutter in the sputtering hole 11 on this sputtering plates 10 20, owing to shutter 20 is movably disposed on sputtering plates 10, as such, it is possible to hidden by the position adjustment of regulation shutter 20 The flow area in the sputtering hole 11 that baffle plate 20 is blocked, and then this sputtering plates 10 can be utilized to sputter the most on year-on-year basis on the surface of prosthese The target atom of weight, and then the protective coating of gradient can be had in the surface-coated of prosthese, utilize this protective coating the most permissible Wrapping material is Ti6Al4The outer surface of the prosthetic main of V alloy, prevents prosthese aseptic pine occur because of Al, V elemental release Dynamic situation occurs, improves the life-span of prosthese, and prevents Al ion and the infringement of V ion pair human body, improves what prosthese used Safety and reliability.
In order to adjust the aperture in sputtering hole 11 more easily, a kind of set-up mode is that shutter 20 is movably disposed On sputtering plates 10.As such, it is possible to regulate the position of shutter 20 more easily.
In the present embodiment, sputtering hole 11 is rectangular opening, and the length direction of shutter 20 rectangular opening is movably disposed.This Sample, is conducive to adjusting the aperture in sputtering hole 11.
Secondly, the another kind of set-up mode of shutter 20 is that shutter 20 is rotatably arranged on sputtering plates 10.
In order to drive shutter 20 to move, sputtering target also includes: as it is shown in figure 1, driving means 50, driving means 50 and screening Baffle plate 20 connects, to drive shutter 20 to open or close sputtering hole 11.
Specifically, driving means 50 is servomotor.
In the present embodiment, being provided with and sputter the receiving chamber that hole 11 connects in sputtering plates 10, shutter 20 is movably It is arranged on receiving intracavity.As such, it is possible to reduce the volume of sputtering plates, the mode of pull is utilized to drive shutter 20.
In the present embodiment, as in figure 2 it is shown, the back side of sputtering plates 10 is provided with target bonnet 30, target bonnet 30 blocks Dorsal part in sputtering hole 11.So, just can be by the sputtering of materials on target bonnet 30 to prosthese.
In the present embodiment, as in figure 2 it is shown, be provided with fixed mount 12 on sputtering plates 10, target bonnet 30 is fixed on fixing On frame 12.Preferably, sputtering plates 10 being provided with boss, fixed mount 12 is arranged on boss.
The present embodiment additionally provides a kind of sputter, as it is shown on figure 3, include sputtering vacuum chamber 40 and being arranged on sputtering vacuum Sputtering target in room 40, sputtering target is above-mentioned sputtering target.Preferably, this sputter includes that circular 41, vacuum system connect Portion 42, circular target position 43, keep forging ahead sample gate 44 and rectangular target 45.
The present embodiment additionally provides a kind of prosthese coating process utilizing above-mentioned sputter that prosthese carries out coating, bag Include: step one: make the shutter of sputter move to primary importance, and sputter the first material to the outer surface of prosthese；Step Two: after the scheduled time, make the shutter of sputter move to the second position, and continue to sputter the first to the outer surface of prosthese Material.Wherein, the first material forms the protective coating of prosthetic surface.
The present invention prepares TaTiMg gradient by the method for magnetron sputtering on the surface of hip prosthesis and knee-joint prosthesis Alloy coat.Therefore, in order to improve safety and the service life of hip prosthesis, coating can be prepared in prosthetic surface.
The purpose of this programme is the deficiency solving materials for joint prosthesis, in artificial hip prosthesis surface preparation one peace Entirely, nontoxic, durable graded alloy coating.
To achieve these goals, present invention employs the work of magnetron sputtering TaTiMg graded alloy coating+diffusion in vacuum Skill, technological principle is as follows:
Magnetron sputtering is i.e. the process of exchange of kinetic energy, when incoming particle with the energy-incident of tens volts to target material surface time, Elastic collision occurs, and energy passes to target surface atom, and target surface atom passes to interior atoms this energy again, so, and energy Amount is gradually transmitted.Pointing to, when one of them atom obtains, the momentum that target surface is outside, the most this momentum enough overcomes surface potential During base, i.e. can depart from target surface becomes sputtered atom.The energy of the atom being sputtered out is only 1% left side of projectile energy The right side, major part energy be consumed in in the collision of top layer atom.
Sputtering typically only occurs in the atom of a few nanometer in surface, it can thus be assumed that atom is from the beginning of surface when sputtering occurs Peel off.Sputtering sedimentation plated film is i.e. in high vacuum conditions, uses high-energy particle bombardment target, and the particle being shelled out is full of In vacuum chamber atmosphere thus be deposited on matrix surface generate needed for film layer.Splash coating technology has simple to operate, technique weight The advantages such as renaturation realization good, easy automatically controls.
Diffusion in vacuum is i.e. to make the cohesive force of splash coating increase further, expands through vacuum after having sputtered again Dissipate, be i.e. placed in vacuum high-temperature environment (not exceeding the fusing point of base material) held for some time, be then cut off power supply furnace cooling, Make coating atoms be sufficiently mixed at intersection with matrix atom, thus increase coating cohesive force.
The magnetic control sputtering device of this programme uses the form that TaTiMg sputters jointly, respectively by Ta target, Ti target and Mg target Material is contained in sputter.The target platform of sputter uses particular design, and target shutter can complete to beat under the drive of servomotor Open and closed action.When target shutter is fully open, then the gross area generation sputtering effect of target, that target atom escaped is just It is many, so the proportion containing this metal is the biggest in alloy coat；Otherwise, in alloy coat, the proportion containing this metal is the least.Except target Outside metal, miscellaneous part all uses the material being not susceptible to sputtering effect, it is to avoid coating is produced interference.
Design this device and can control the proportion of Ta, Ti and Mg element in real time when preparing TaTiMg graded alloy coating, Can prepare Ta content low Ti content height Mg content definite value at base material, contain away from the Ta content height low Mg of Ti content at base material The gradient coating of amount definite value.
What this programme was prepared on articular prosthesis surface is TaTiMg graded alloy coating, and the advantage using this coating is as follows:
(1) Ta metal, Ti metal and Mg metal are all biocompatible materialses, and human body is not had toxic and side effects.
(2) elastic modelling quantity of Ta metal, Ti metal and Mg metal is relatively low, especially Mg metal, its elastic modelling quantity (40Gpa) With the elastic modelling quantity (10-30Gpa) of people's bone closely, it is suitable for doing orthopedics transplanted material.
(3) Ta metal and Ti metal can generate Ta respectively with oxygen generation chemical reaction2O5With TiO2Oxide thin Film, corrosion resistance is strong, and the risk suffering human body fluid corrosion failure is low；Mg metal and oxygen generation chemical reaction, generate MgO, its Corrosion resisting property is not so good as Ta2O5With TiO2By force, but Mg is the trace element of needed by human, can be by being fallen by body metabolism, so to people Body does not results in impact.Secondly, the elastic modelling quantity of magnesium metal is 40Gpa, close with the elastic modelling quantity of human bone (10-30Gpa), Stress-shielding effect can be reduced.
(4) Ta coating surface modifying processes and can be effectively improved the anticorrosive of titanium alloy and resistance to electrochemical corrosion energy, for solving Certainly the problem of biological medical titanium alloy implant aseptic loosening provides guarantee.
(5) at high operating temperatures, Ti metal can be with matrix material (Ti6Al4V) the Ti phase double replacement in, thus improve alloy The adhesion of coating, extends hip prosthesis service life.
(6) there is solution strengthening effect in alloy coat, and i.e. a kind of metallic element is solid-solution in another kind of metal and causes necessarily The distortion of lattice of degree is so that the phenomenon of alloy strength raising, and this is better than simple substance coating mechanical property, it is not easy to produce coating The phenomenon of cracking.So adding the Mg of trace in TaTi alloy coat again, the solution strengthening effect of alloy coat can be improved, Increase the service life of coating.
(7) Ti is being pressed close to6Al4At V base material, the content of Ti is high, can make the demarcation line obfuscation of coating and matrix, it is possible to To strengthen the adhesiveness of coating, extend the hip prosthesis life-span；Outside alloy coat, the content of Ta is high, and coating can be made true After empty diffusion, Ta is sufficiently mixed in coating, strengthens solution strengthening effect, improves strength of coating, extends the hip prosthesis life-span. The content definite value of Mg, but be distributed to uniformly in coating, improve solution strengthening effect, improve strength of coating, extend hip. as far as possible The articular prosthesis life-span.
As can be seen from the above description, the above embodiments of the present invention achieve following technique effect:
Sputtering target in the present invention includes sputtering plates and for blocking the shutter in the sputtering hole on this sputtering plates, owing to hiding Baffle plate is movably disposed on sputtering plates, as such, it is possible to by spattering that the position adjustment shutter of regulation shutter is blocked The flow area of perforation, and then this sputtering plates can be utilized at the target atom of the surface of prosthese sputtering different specific weight, Jin Erke There is with the surface-coated at prosthese the protective coating of gradient, utilize this protective coating just can wrap material for Ti6Al4V closes The outer surface of the prosthetic main of gold, prevents the situation occurring prosthese aseptic loosening because of Al, V elemental release from occurring, improves The life-span of prosthese, and prevent Al ion and the infringement of V ion pair human body, improve the safety and reliability that prosthese uses.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for the skill of this area For art personnel, the present invention can have various modifications and variations.All within the spirit and principles in the present invention, that is made any repaiies Change, equivalent, improvement etc., should be included within the scope of the present invention.

Claims (11)

1. a sputtering target, it is characterised in that including:
Sputtering plates (10), described sputtering plates (10) is provided with sputtering hole (11)；
Shutter (20), described shutter (20) blocks at described sputtering hole (11) place, and described shutter (20) sets movingly Put to adjust the flow area of the described sputtering hole (11) that described shutter (20) is blocked.
Sputtering target the most according to claim 1, it is characterised in that described shutter (20) be movably disposed at described in spatter Penetrate on plate (10).
Sputtering target the most according to claim 1, it is characterised in that described sputtering hole (11) is rectangular opening, described shutter (20) length direction of described rectangular opening is movably disposed.
Sputtering target the most according to claim 1, it is characterised in that described shutter (20) be rotatably arranged in described in spatter Penetrate on plate (10).
Sputtering target the most according to claim 1, it is characterised in that described sputtering target also includes:
Driving means (50), described driving means (50) is connected with described shutter (20), to drive described shutter (20) to beat Open or close described sputtering hole (11).
Sputtering target the most according to claim 5, it is characterised in that described driving means (50) is servomotor.
Sputtering target the most according to claim 1, it is characterised in that be provided with in described sputtering plates (10) and described sputtering hole (11) the receiving chamber connected, described shutter (20) is movably disposed at described receiving intracavity.
Sputtering target the most according to claim 1, it is characterised in that the back side of described sputtering plates (10) is provided with target bonnet (30), described target bonnet (30) blocks the dorsal part described sputtering hole (11).
Sputtering target the most according to claim 8, it is characterised in that be provided with fixed mount (12) on described sputtering plates (10), Described target bonnet (30) is fixed on described fixed mount (12).
10. a sputter, including sputtering vacuum chamber (40) and the sputtering target being arranged in described sputtering vacuum chamber (40), it is special Levying and be, described sputtering target is the sputtering target according to any one of claim 1 to 9.
11. 1 kinds utilize the prosthese coating process that the sputter described in claim 10 carries out coating to prosthese, and its feature exists In, including:
Step one: make the shutter of described sputter move to primary importance, and sputter the first to the outer surface of described prosthese Material；
Step 2: after the scheduled time, makes the described shutter of described sputter move to the second position, and to described prosthese Outer surface continues sputtering the first material described.
CN201610639742.8A 2016-08-05 2016-08-05 Sputtering target, sputter and prosthese coating process Pending CN106178113A (en)

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DE10039478A1 (en) * 2000-08-08 2002-02-28 Cemecon Ceramic Metal Coatings Sputtering component
CN101376964A (en) * 2007-08-31 2009-03-04 鸿富锦精密工业（深圳）有限公司 Sputtering type film coating apparatus and film coating method
CN101503793A (en) * 2008-01-16 2009-08-12 应用材料公司 Sputter coating device
CN102324368A (en) * 2011-08-29 2012-01-18 安徽鑫昊等离子显示器件有限公司 Sputtering anode cap and sputtering device
CN102844460A (en) * 2010-02-17 2012-12-26 东曹Smd有限公司 Sputter target
CN206560552U (en) * 2016-08-05 2017-10-17 北京爱康宜诚医疗器材有限公司 Sputtering target and sputter

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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