CN206560552U - Sputtering target and sputter - Google Patents
Sputtering target and sputter Download PDFInfo
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- CN206560552U CN206560552U CN201620847833.6U CN201620847833U CN206560552U CN 206560552 U CN206560552 U CN 206560552U CN 201620847833 U CN201620847833 U CN 201620847833U CN 206560552 U CN206560552 U CN 206560552U
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- sputtering
- shutter
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- sputtering target
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Abstract
The utility model provides a kind of sputtering target and sputter, and sputtering target includes：Sputtering hole is provided with sputtering plates, sputtering plates；Shutter, shutter is blocked at sputtering hole, and shutter movingly sets to adjust the flow area in the sputtering hole that shutter is blocked.Sputtering target in the utility model solve borrowed structure of the prior art life-span it is relatively low the problem of.
Description
Technical field
The utility model is related to therapeutic treatment field, in particular to a kind of sputtering target and sputter.
Background technology
Ti6Al4V alloy is because preferable biocompatibility, corrosion resistance, high intensity, modulus of elasticity and cortex of bone are close etc. excellent
More performance, is widely used in medical domain.But be used to that in human body environment Al, V ion will be discharged for a long time.Al and V ions
There is toxicity, the possibility of carcinogenic and teratogenesis to human body.And Al shuffles Ti surface potentials, in the environment contacted with thrombus liquid
Fibrinous deposition can be caused and thrombus is formed, this reduces the safety and reliability of materials'use.
At present, the material that some borrowed structures are used is Ti6Al4V alloy, due to Al, V elemental release can cause prosthese without
Bacterium property loosens, and reduces the prosthese life-span.
Utility model content
Main purpose of the present utility model is to provide a kind of sputtering target and sputter, to solve prosthese of the prior art
The problem of life-span of structure is relatively low.
To achieve these goals, according to one side of the present utility model there is provided a kind of sputtering target, including：Splash
Penetrate and sputtering hole is provided with plate, sputtering plates；Shutter, shutter is blocked at sputtering hole, and shutter movingly sets to adjust
The flow area in the sputtering hole that whole shutter is blocked.
Further, shutter is movably disposed on sputtering plates.
Further, sputtering hole is rectangular opening, and the length direction of shutter rectangular opening is movably disposed.
Further, shutter is rotatably arranged on sputtering plates.
Further, sputtering target also includes：Drive device, drive device is connected with shutter, to drive shutter to open
Or closure sputtering hole.
Further, drive device is servomotor.
Further, the accommodating chamber connected with sputtering hole is provided with sputtering plates, shutter is movably disposed at receiving
Intracavitary.
Further, the back side of sputtering plates is provided with target bonnet, and target bonnet blocks the dorsal part in sputtering hole.
Further, fixed mount is provided with sputtering plates, target bonnet is fixed on fixed mount.
According to second aspect of the present utility model there is provided a kind of sputter, including sputtering vacuum chamber and being arranged on splashes
The sputtering target penetrated in vacuum chamber, sputtering target is above-mentioned sputtering target.
Sputtering target in the utility model includes sputtering plates and the shutter for blocking the sputtering hole on the sputtering plates, by
It is movably disposed on sputtering plates, so, can be blocked by adjusting the position adjustment shutter of shutter in shutter
Sputtering hole flow area, and then can using the sputtering plates prosthese surface sputter different specific weight target atom, enter
And can have the protective coating of gradient in the surface coating of prosthese, material just can be wrapped using the protective coating is
Ti6Al4The outer surface of the prosthetic main of V alloy, prevents the situation for prosthese aseptic loosening occur because of Al, V elemental release from going out
It is existing, the life-span of prosthese is improved, and prevent the infringement of Al ions and V ion pair human bodies, improve security that prosthese uses and can
By property.
Brief description of the drawings
The Figure of description for constituting the part of the application is used for providing further understanding to of the present utility model, this practicality
New schematic description and description is used to explain the utility model, does not constitute to improper restriction of the present utility model.
In the accompanying drawings：
Fig. 1 shows the structural representation of the embodiment according to sputtering target of the present utility model；
Fig. 2 shows the rearview of the sputtering target in Fig. 1；And
Fig. 3 has used the structural representation of the embodiment according to sputter of the present utility model.
Wherein, above-mentioned accompanying drawing is marked including the following drawings：
10th, sputtering plates；11st, hole is sputtered；12nd, fixed mount；20th, shutter；30th, target bonnet；40th, vacuum chamber is sputtered；41、
Circular；42nd, vacuum system connecting portion；43rd, circular target position；44th, keep forging ahead sample gate；45th, rectangular target；50th, drive device.
Embodiment
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.Describe the utility model in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
The utility model provides a kind of sputtering target, refer to Fig. 1 to Fig. 3, the sputtering target includes：Sputtering plates 10, sputtering
Sputtering hole 11 is provided with plate 10；Shutter 20, shutter 20 block sputtering hole 11 at, shutter 20 movingly set with
The flow area in the sputtering hole 11 that adjustment shutter 20 is blocked.
Sputtering target in the utility model includes sputtering plates 10 and the screening for blocking the sputtering hole 11 on the sputtering plates 10
Baffle plate 20, because shutter 20 is movably disposed on sputtering plates 10, so, can be adjusted by adjusting the position of shutter 20
The flow area in the sputtering hole 11 that whole shutter 20 is blocked, and then can be sputtered not on the surface of prosthese using the sputtering plates 10
With the target atom of proportion, and then there can be the protective coating of gradient in the surface coating of prosthese, using the protective coating just
Material can be wrapped for Ti6Al4The outer surface of the prosthetic main of V alloy, prevents from prosthese occur because of Al, V elemental release sterile
Property situation about loosening occur, improve the life-span of prosthese, and prevent the infringement of Al ions and V ion pair human bodies, improving prosthese makes
Safety and reliability.
In order to more easily adjust the aperture in sputtering hole 11, a kind of set-up mode is that shutter 20 is movably disposed
On sputtering plates 10.So, the position of shutter 20 can more easily be adjusted.
In the present embodiment, sputtering hole 11 is rectangular opening, and the length direction of the rectangular opening of shutter 20 is movably disposed.This
Sample, is conducive to the aperture in adjustment sputtering hole 11.
Secondly, another set-up mode of shutter 20 is that shutter 20 is rotatably arranged on sputtering plates 10.
In order to drive shutter 20 to move, sputtering target also includes：As shown in figure 1, drive device 50, drive device 50 is with hiding
Baffle plate 20 is connected, to drive shutter 20 to open or close sputtering hole 11.
Specifically, drive device 50 is servomotor.
In the present embodiment, the accommodating chamber connected with sputtering hole 11 is provided with sputtering plates 10, shutter 20 is movably
It is arranged in accommodating chamber.So, the volume of sputtering plates can be reduced, shutter 20 is driven using the mode of pull.
In the present embodiment, as shown in Fig. 2 the back side of sputtering plates 10 is provided with target bonnet 30, target bonnet 30 is blocked
Dorsal part in sputtering hole 11.So, just can be by the sputtering of materials on target bonnet 30 to prosthese.
In the present embodiment, as shown in Fig. 2 being provided with fixed mount 12 on sputtering plates 10, target bonnet 30 is fixed on fixation
On frame 12.Preferably, boss is provided with sputtering plates 10, fixed mount 12 is arranged on boss.
The present embodiment additionally provides a kind of sputter, as shown in figure 3, including sputtering vacuum chamber 40 and being arranged on sputtering vacuum
Sputtering target in room 40, sputtering target is above-mentioned sputtering target.Preferably, the sputter includes circular 41, vacuum system connection
Portion 42, circular target position 43, keep forging ahead sample gate 44 and rectangular target 45.
The present embodiment additionally provides a kind of prosthese coating process for carrying out coating to prosthese using above-mentioned sputter, bag
Include：Step one：The shutter of sputter is moved to first position, and the first material is sputtered to the outer surface of prosthese；Step
Two：After the scheduled time, the shutter of sputter is set to move to the second place, and the first is sputtered to the outer surface continuation of prosthese
Material.Wherein, the protective coating of the first material formation prosthetic surface.
The utility model prepares TaTiMg by the method for magnetron sputtering on the surface of hip prosthesis and knee-joint prosthesis
Graded alloy coating.Therefore, can be in prosthetic surface prepares coating in order to improve the security and service life of hip prosthesis.
The purpose of this programme is the deficiency for solving materials for joint prosthesis, and a kind of peace is prepared on artificial hip prosthesis surface
Entirely, nontoxic, durable graded alloy coating.
To achieve these goals, the utility model employs magnetron sputtering TaTiMg graded alloy coating+diffusion in vacuum
Technique, technological principle is as follows：
Magnetron sputtering is the process of exchange of kinetic energy, when incoming particle with tens volts of energy-incident to target material surface when,
Generation elastic collision, energy transmission gives target surface atom, and target surface atom is again this energy transmission to interior atoms, so, energy
Amount is gradually transmitted.The outside momentum of target surface is pointed to when one of atom is obtained, while this momentum overcomes surface potential enough
During base, you can to depart from target surface as sputtered atom.The energy for the atom being sputtered out is only 1% left side of projectile energy
The right side, most of energy is consumed in the collision with top layer atom.
Sputtering is typically only occurred in the atom on several nanometers of surface, it can thus be assumed that atom is since surface when sputtering occurs
Peel off.Sputtering sedimentation plated film is in high vacuum conditions, to use high-energy particle bombardment target, and the particle being shelled out is full of
So as to the film layer being deposited on needed for matrix surface generation in vacuum chamber atmosphere.Splash coating technology has simple to operate, technique weight
The advantages of renaturation is good, easy realization is automatically controlled.
Diffusion in vacuum is that sputtering is expanded by vacuum again after completing in order that the cohesive force of splash coating further increases
Dissipate, that is, be placed in vacuum high-temperature environment (fusing point for not exceeding base material) held for some time, furnace cooling of then cutting off the electricity supply,
Coating atoms are made to be sufficiently mixed with matrix atom in intersection, so as to increase coating cohesive force.
The magnetic control sputtering device of this programme uses the form that TaTiMg is sputtered jointly, respectively by Ta targets, Ti targets and Mg targets
Material is mounted in sputter.The target platform of sputter uses particular design, and target shutter can complete to beat under the drive of servomotor
Open and closed action.When target shutter is fully open, then sputtering effect occurs for the gross area of target, and the target atom that is escaped is just
It is many, so the proportion containing this metal is just big in alloy coat；Conversely, the proportion containing this metal is just small in alloy coat.Except target
Outside metal, miscellaneous part is using the material for being not susceptible to sputtering effect, it is to avoid produce interference to coating.
The proportion of Ta, Ti and Mg element can be controlled in real time when preparing TaTiMg graded alloy coatings by designing this device,
The high Mg contents definite value of the low Ti contents of Ta contents at base material can be prepared, contained away from the high low Mg of Ti contents of Ta contents at base material
Measure the gradient coating of definite value.
What this programme was prepared on articular prosthesis surface is TaTiMg graded alloy coatings, as follows using the advantage of this coating：
(1) Ta metals, Ti metals and Mg metals are all biocompatible materialses, do not have toxic side effect to human body.
(2) modulus of elasticity of Ta metals, Ti metals and Mg metals is relatively low, especially Mg metals, its modulus of elasticity (40Gpa)
With the modulus of elasticity (10-30Gpa) of people's bone closely, it is adapted to do orthopedics transplanted material.
(3) Ta metals can be chemically reacted with Ti metals with oxygen, and Ta is generated respectively2O5With TiO2Oxide it is thin
Film, corrosion resistance is strong, and the risk by human body fluid corrosion failure is low；Mg metals chemically react with oxygen, generate MgO, its
Corrosion resisting property is not so good as Ta2O5With TiO2By force, but Mg is the essential trace elements of the human body, can be by being fallen by body metabolism, so to people
Body does not result in influence.Secondly, the modulus of elasticity of magnesium metal is 40Gpa, close with the modulus of elasticity (10-30Gpa) of human body bone,
Stress-shielding effect can be reduced.
(4) Ta coating surface modifyings processing can effectively improve the anticorrosive and resistance to electrochemical corrosion energy of titanium alloy, for solution
Certainly provide and ensure the problem of biological medical titanium alloy implant aseptic loosening.
(5) at high operating temperatures, Ti metals can be with matrix material (Ti6Al4V the Ti phase double replacements in), so as to improve alloy
The adhesion of coating, extends hip prosthesis service life.
(6) there is solution strengthening effect in alloy coat, i.e., a kind of metallic element, which is solid-solution in another metal, causes certain
The distortion of lattice of degree is so that the phenomenon that alloy strength is improved, this is better than simple substance coating mechanical property, it is not easy to produce coating
The phenomenon of cracking.So adding micro Mg again in TaTi alloy coats, the solution strengthening effect of alloy coat can be improved,
Increase the service life of coating.
(7) Ti is being pressed close to6Al4At V base materials, Ti content is high, can make the line of demarcation obfuscation of coating and matrix, also may be used
To strengthen the adhesiveness of coating, extend the hip prosthesis life-span；Outside alloy coat, Ta content is high, coating can be made true
Ta is sufficiently mixed in coating after sky diffusion, strengthens solution strengthening effect, improves strength of coating, extends the hip prosthesis life-span.
Mg content definite value, but be uniformly distributed to as far as possible in coating, solution strengthening effect is improved, strength of coating is improved, extends hip
The articular prosthesis life-span.
As can be seen from the above description, the utility model the above embodiments realize following technique effect：
Sputtering target in the utility model includes sputtering plates and the shutter for blocking the sputtering hole on the sputtering plates, by
It is movably disposed on sputtering plates, so, can be blocked by adjusting the position adjustment shutter of shutter in shutter
Sputtering hole flow area, and then can using the sputtering plates prosthese surface sputter different specific weight target atom, enter
And can have the protective coating of gradient in the surface coating of prosthese, material just can be wrapped using the protective coating is
Ti6Al4The outer surface of the prosthetic main of V alloy, prevents the situation for prosthese aseptic loosening occur because of Al, V elemental release from going out
It is existing, the life-span of prosthese is improved, and prevent the infringement of Al ions and V ion pair human bodies, improve security that prosthese uses and can
By property.
Preferred embodiment of the present utility model is the foregoing is only, the utility model is not limited to, for this
For the technical staff in field, the utility model can have various modifications and variations.It is all it is of the present utility model spirit and principle
Within, any modification, equivalent substitution and improvements made etc. should be included within protection domain of the present utility model.
Claims (10)
1. a kind of sputtering target, it is characterised in that including：
Sputtering hole (11) is provided with sputtering plates (10), the sputtering plates (10)；
Shutter (20), the shutter (20) is blocked at sputtering hole (11) place, and the shutter (20) movingly sets
Put to adjust the flow area for the sputtering hole (11) that the shutter (20) is blocked.
2. sputtering target according to claim 1, it is characterised in that the shutter (20) is movably disposed at described splash
Penetrate on plate (10).
3. sputtering target according to claim 1, it is characterised in that the sputtering hole (11) is rectangular opening, the shutter
(20) length direction of the rectangular opening is movably disposed.
4. sputtering target according to claim 1, it is characterised in that the shutter (20) is rotatably arranged in described splash
Penetrate on plate (10).
5. sputtering target according to claim 1, it is characterised in that the sputtering target also includes：
Drive device (50), the drive device (50) is connected with the shutter (20), to drive the shutter (20) to beat
Open or close the sputtering hole (11).
6. sputtering target according to claim 5, it is characterised in that the drive device (50) is servomotor.
7. sputtering target according to claim 1, it is characterised in that be provided with and the sputtering hole in the sputtering plates (10)
(11) accommodating chamber of connection, the shutter (20) is movably disposed in the accommodating chamber.
8. sputtering target according to claim 1, it is characterised in that the back side of the sputtering plates (10) is provided with target bonnet
(30), the target bonnet (30) blocks the dorsal part in the sputtering hole (11).
9. sputtering target according to claim 8, it is characterised in that be provided with fixed mount (12) on the sputtering plates (10),
The target bonnet (30) is fixed on the fixed mount (12).
10. a kind of sputter, including vacuum chamber (40) and the sputtering target being arranged in the sputtering vacuum chamber (40) are sputtered, it is special
Levy and be, the sputtering target is the sputtering target any one of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620847833.6U CN206560552U (en) | 2016-08-05 | 2016-08-05 | Sputtering target and sputter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620847833.6U CN206560552U (en) | 2016-08-05 | 2016-08-05 | Sputtering target and sputter |
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| Publication Number | Publication Date |
|---|---|
| CN206560552U true CN206560552U (en) | 2017-10-17 |
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ID=60029764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620847833.6U Active CN206560552U (en) | 2016-08-05 | 2016-08-05 | Sputtering target and sputter |
Country Status (1)
| Country | Link |
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| CN (1) | CN206560552U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106178113A (en) * | 2016-08-05 | 2016-12-07 | 北京爱康宜诚医疗器材有限公司 | Sputtering target, sputter and prosthese coating process |
| CN110066983A (en) * | 2019-05-17 | 2019-07-30 | 南京邮电大学 | Film preparation auxiliary device and method for manufacturing thin film |
-
2016
- 2016-08-05 CN CN201620847833.6U patent/CN206560552U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106178113A (en) * | 2016-08-05 | 2016-12-07 | 北京爱康宜诚医疗器材有限公司 | Sputtering target, sputter and prosthese coating process |
| CN110066983A (en) * | 2019-05-17 | 2019-07-30 | 南京邮电大学 | Film preparation auxiliary device and method for manufacturing thin film |
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