CN101376964A - Sputtering type film coating apparatus and film coating method - Google Patents
Sputtering type film coating apparatus and film coating method Download PDFInfo
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- CN101376964A CN101376964A CNA2007102015567A CN200710201556A CN101376964A CN 101376964 A CN101376964 A CN 101376964A CN A2007102015567 A CNA2007102015567 A CN A2007102015567A CN 200710201556 A CN200710201556 A CN 200710201556A CN 101376964 A CN101376964 A CN 101376964A
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Abstract
The invention relates to a sputtering type film coating device which comprises at least a film coating workshop, at least a target arranged in the film coating workshop and used to coat the film on a work piece, a carrier and an auxiliary rotary unit; the carrier carries the work piece along the extending direction of the bottom of the film coating workshop, and comprises a bearing bracket and at least a bearing shaft; the bearing shaft is used to bear the work piece and drives the work piece to rotate around the central shaft of the bearing shaft; the auxiliary rotary unit is used to assist the bearing shaft in rotating around the central shaft. The sputtering type film coating device and a film coating method can coat the film on the surface of the work piece, so that the surface film layer is even.
Description
Technical field
The present invention relates to a kind of film coating apparatus and film coating method, relate in particular to a kind of sputtering type coating device and adopt the film coating method of this sputtering type coating device.
Background technology
Sputter is to utilize the ion of plasma generation to remove to clash into cathode targets, and the atom in the target is knocking-on and be deposited on and be piled into rete on the substrate surface.Because sputter can be reached preferable sedimentation effect, accurate composition control, and lower manufacturing cost, therefore is widely used industrial.
The application of current phone digital camera lens is day by day popularized, and therefore is necessary to promote the manufacturing technology of its key components and parts, to reduce its manufacturing cost effectively and to promote its yield.Generally include microscope base, lens barrel and be housed in eyeglass, pad (Spacer), aperture, cutoff filter elements such as (IR-cutFilter) in the lens barrel as the camera lens module of one of camera lens key components and parts.The method of design of eyeglass sees also the paper Aspheric lens design that people such as Chao deliver in IEEE system in 2000, ultrasonic wave meeting (2000IEEE Ultrasonics Symposium).
In camera lens module assembling process, usually need elements such as described eyeglass, pad, aperture, cutoff filters again lens barrel to be screwed in microscope base to be assembled into a complete camera lens module by the definite sequence lens barrel of packing into.As shown in Figure 1, in order to reduce the degree that described camera lens module is subjected to electromagnetic interference, before described camera lens module is assembled, generally need to go up anti-electromagnetic interference (the Electromagnetic Interference of sputter last layer in the outer circumference surface 20a of microscope base 2a, EMI) rete is to promote the ability of the anti-electromagnetic interference of assembling rear lens module.Product needed behind the plated film is done multinomial environmental testing, such as High Temperature High Pressure test, thermal shock test, corrosion test etc., if the rete that plates is inhomogeneous, it comes off easily, and the area resistance value that rete is thin is higher, the poor effect of anti-electromagnetic interference (EMI), therefore, the homogeneity of thicknesses of layers is extremely important.
When prior art prepares the rete of described microscope base 2a outer circumference surface 20a with sputtering method, this microscope base 2a keep below the target certain speed towards below bearing of trend advance, in traveling process, for microscope base 2a outer circumference surface, different sites 20b, 20c is inconsistent with respect to the geometric position of target, and plating target bundle 1b thereon, the 1c range is also inconsistent, therefore, thicknesses of layers is inhomogeneous when causing plated film easily, and in order to improve the uniformity coefficient of described thicknesses of layers, general target is big more a lot of than microscope base, and the target beam disperses, therefore, target consumes more, and the plated film uniformity coefficient is undesirable to a certain extent.
In view of this, be necessary to provide a kind of, can further improve evenness of membranous layer, and can improve the sputtering type coating device and the film coating method of target utilization compared to prior art.
Summary of the invention
To a kind of raising evenness of membranous layer be described with embodiment below, and can improve the sputtering type coating device and the film coating method of target utilization.
The invention provides a kind of sputtering type coating device, it comprises a plated film working spaces; At least one target, it is arranged in the described plated film working spaces, is used for described workpiece is carried out plated film; A carrier, it can do motion of translation along the bearing of trend of the bottom of described plated film working spaces, this carrier comprises an anchor and at least one reach, this anchor is used for fixing this at least one reach, described at least one reach, be used to carry workpiece, and drive described workpiece around this at least one reach rotation.Described sputtering type coating device can further include an independent auxiliary swivel arrangement of controlling, and described auxiliary swivel arrangement can move with respect to transmission direction, thereby assists described at least one reach around its central shaft rotation.
And, a kind of sputtering type coating method that adopts above-mentioned sputtering type coating device, it may further comprise the steps:
(1) provides a kind of sputtering type coating device as claimed in claim 1; (2) described at least one reach moves linearly along the direction that approaches described at least one target; Simultaneously, described auxiliary rotary unit assists described at least one reach around its central shaft rotation.(3) described workpiece moves linearly along the direction that approaches described at least one target with this at least one reach, and simultaneously, around this at least one reach rotation; (4) described at least one target carries out plated film to described workpiece.
With respect to prior art, described sputtering type coating device and film coating method are via a carrier that can move linearly along the plated film working spaces is set, and at least one reach of this carrier is set to and can rotates around its central shaft, on the one hand, can drive the workpiece that carries at least one reach via described carrier and carry out plated film successively, thereby can realize working continuously of plated film; On the other hand, at least one reach drives workpiece together around its axle rotation, improves the uniformity coefficient of thicknesses of layers, and then improves yield.
Description of drawings
Fig. 1 is that existing the employing spattered the method for crossing is carried out plated film to microscope base synoptic diagram.
Fig. 2 is the synoptic diagram of the sputtering type coating device that provides of first embodiment of the invention.
Fig. 3 is the structural representation of microscope base.
Fig. 4 is the three-dimensional enlarged diagram of the carrier of sputtering type coating device shown in Figure 2.
Fig. 5 is sputtering type coating device shown in Figure 2 carries out plated film to the outer circumference surface of microscope base a synoptic diagram.
Fig. 6 is the synoptic diagram of the sputtering type coating device shown in the second embodiment of the invention.
Embodiment
The present invention is described in further detail below in conjunction with accompanying drawing.
See also Fig. 2, a kind of sputtering type coating device 20 that first embodiment of the invention provides, described sputtering type coating device 20 comprise 21, one carriers 22 in a plated film working spaces and a target 23.
Described plated film working spaces 21 is in order to provide a vacuum splashing and plating environment.Usually, this plated film working spaces 21 comprises a gas inlet that is connected with this plated film working spaces 21 (figure does not show) and a pneumatic outlet (not indicating).Wherein, the gas inlet is used in plated film working spaces 21 importing discharge gas, for example argon gas, nitrogen etc., and pneumatic outlet is used to make plated film working spaces 21 to keep certain vacuum tightness when work.This pneumatic outlet links to each other with a vacuum extractor 24 usually, and this vacuum extractor 24 can be molecular pump, Lip river thatch vacuum pump or dry type oil-sealed rotary pump etc.
Described target 23 is arranged in the described plated film working spaces 21, and in the present embodiment, this target 23 is the copper target, and its number can be set to three, and these three targets distribute along the direction of arrow among Fig. 2.In addition, these three targets 23 can be loaded into three target electrodes 230 respectively, and these three target electrodes 230 can be plate electrode, and it serves as negative electrode and its on off state can be distinguished independent control usually in the sputter process.Can carry out plated film to the to be coated surperficial 300b of as shown in Figure 3 microscope base 30 by bombardment target 23.The columnar structured 30b that described microscope base 30 generally includes a base 30a and extends out from this base 30a, described anti-electromagnetic interference rete is formed on the outer circumference surface 300b of this columnar structured 30b.
See also Fig. 4, described carrier 22 comprises a transmitting device 221, anchor 222, at least one reach 223, and the auxiliary rotary unit 224 of an independent control.Described transmitting device 221 is arranged at the bottom of described plated film working spaces 21 and can does motion of translation along the bearing of trend (direction shown in arrow among Fig. 2) of this bottom.Preferably, this transmitting device 221 can be a transport tape.Described anchor 222 is arranged on the described transmitting device 221, drives it by transmitting device 221 and moves, and described at least one reach 223 is arranged on this anchor 221 and can rotates around its central shaft.
Particularly, these at least one reach 223 two ends are set in two set collar 222a, the 221b of this anchor 222, and this at least one reach 223 drives motion with anchor 222 by transmitting device 221.This at least one reach 223 can be around its central shaft rotation with anchor 222 motions simultaneously.Particularly, this at least one reach 223 can pass through auxiliary rotary unit 224 driven rotary, preferably, should comprise two lath 224a by auxiliary rotary unit 224,224b, its middle plate strip 224a, 224b has a dentation contact surface respectively, this lath 224a, the dentation contact surface of 224b respectively with the two ends tooth-like part of anything 223a of this at least one reach, the 223b mechanical engagement, should can move with respect to transmitting device 221 by auxiliary rotary unit 224, drive described at least one reach 223 around its central shaft rotation, particularly, this lath 224a, 224b is moved to position 41 by position 40, drives described at least one reach 223 around its central shaft rotation.Certainly should also can include only a lath by auxiliary rotary unit 224, as the lath 224a of reach 223 1 ends as described in being arranged at, it moves with respect to transmitting device 221, also can drive 223 around its central shaft rotation.
Described at least one reach 223 is used to carry microscope base 30, two set collar 222a, 222b that are arranged on the described anchor 222 are passed at its two ends, do motion of translation to the direction that approaches target as described with anchor 222, particularly, this at least one reach 223 can be by electro-conductive material, make as metals such as iron, aluminium, it serves as anode in the sputter process.
Please further consult Fig. 2, Fig. 4 and Fig. 5, a kind of sputtering type coating device 20 that utilizes first embodiment of the invention to provide will briefly be provided below have the sputtering type coating method of anti-electromagnetic interference rete in last making of the outer circumference surface 300b of microscope base 30, it may further comprise the steps:
(1) workpiece 30 to be coated is loaded on described at least one reach 223.
As shown in Figure 4, described microscope base 30 is fixed on described at least one reach 223, and coaxial with this at least one reach, and can be driven around self central shaft rotation by at least one reach 223.
(2) described at least one reach 223 moves linearly along the direction that approaches described at least one target 23, and simultaneously around its central shaft rotation.
Described at least one reach 223 two ends are enclosed within on the set collar 222 of anchor 222, and can arbitrarily rotate around its central shaft, it will be with anchor 222, with transmitting device 221 along direction of motion (direction shown in horizontal arrow among Fig. 5) motion of this transmitting device 221 and near as described in target 23.Simultaneously, this auxiliary rotary unit 224 drives these at least one reach 223 around its central shaft rotation, makes to be enclosed within workpiece 30 on this at least one reach 223 also around self central shaft rotation.Particularly, should assist two boards bar 224a, the 224b of rotary unit 224, can move with respect to transmitting device 221, wherein, lath 224a, 224b have a dentation contact surface respectively, the dentation contact surface of this lath 224a, 224b respectively with at least one reach 223 two ends tooth-like part of anything 223a, 223b mechanical engagement, this auxiliary rotary unit 224 moves with respect to transmitting device 221 as described, drives 223 rotations of at least one reach.
Be understandable that, when described anchor 222 enters described plated film working spaces 21 under the drive of described transmitting device 221, can be evacuated to the vacuum state of predetermined pressure via 24 pairs of plated film working spacess 21 of the vacuum extractor that is connected with plated film working spaces 21, and feed discharge gass to plated film working spaces 21 via the gas inlet that is connected with plated film working spaces 21, as argon gas etc.
(3) 23 pairs of described workpiece 30 of described at least one target carry out plated film.
Described at least one target 23 can be provided with as required, for example, general plating anti-electromagnetic radiation film, needed target is divided into two districts, first district is the copper target, second district is the stainless steel target, each district can be made up of 3 targets, control target quantity can be plated different thickness, as, earlier plating layer of copper (in the about 2 μ m of copper film layer thickness) is sent described microscope base 30 into second district after having plated again, further sputter last layer stainless steel rete (in the about 0.5 μ m of stainless steel membrane layer thickness) on the copper film layer of the outer circumference surface 300b of described microscope base 30.
As shown in Figure 5, in the time of under described microscope base 30 moves at least one target 23, can apply negative voltage to described target electrode 230 by external power source (figure does not show), at least one reach 223 ground connection of while (figure does not show), make described copper target 23 lip-deep discharge gas ionization and produce plasma, on copper target 23, clash into atom or atomic group by this isoionic ion, and this atomic group is deposited on described outer circumference surface 300b to be coated, can on this outer circumference surface 300b, form a rete.
Be understandable that, when described microscope base 30 moves to when relative with described copper target 23, microscope base 30 is around self central shaft rotation, and the outer circumference surface 300b of microscope base 30 goes up any part with respect to copper target 23 geometric position unanimities, and therefore the thicknesses of layers that forms on this outer circumference surface 300b is even.Controls revolution speed can obtain suitable thickness.And for sputtering type coating device of the present invention, owing to do not need bigger target is set, and the target bundle do not need to disperse, and therefore, can improve target utilization, reaches the effect that reduces cost.
See also Fig. 6, a kind of sputtering type coating device 60 that second embodiment of the invention provides, sputtering type coating device 20 structures that itself and first embodiment of the invention provide are basic identical, its difference is: described sputtering type coating device 60 also further comprises a load chamber 62, a relief chamber 63, a heating chamber 64 and a purge chamber 65, described transmitting device 221 is arranged at this load chamber 62 respectively, heating chamber 64, purge chamber 65, the bottom 210 of plated film working spaces 21 and relief chamber 63, described vacuum extractor 24 are respectively by an extraction pipe and described load chamber 62, heating chamber 64, purge chamber 65 and relief chamber 63 are connected.
Particularly, the adjacent successively setting of described load chamber 62, heating chamber 64, purge chamber 65, plated film working spaces 21 and relief chamber 63.Wherein, described load chamber 62 is used to accommodate microscope base to be coated 30, and described relief chamber 63 is used to accommodate the microscope base 30 of plated film.
Described heating chamber 64 is used for carrying out before plasma cleans described microscope base to be coated 30 being sent into described purge chamber 65, accommodate and heat this microscope base 30, so that this microscope base 30 is carried out drying, and the plated film quality when promoting this microscope base 30 and carrying out plated film in described plated film working spaces 21.
Described purge chamber 65 is used for before described microscope base 30 is sent into plated film working spaces 21 carrying out plated film, outer circumference surface 300b to be coated to this microscope base 30 carries out plasma clean (plasma cleaning), so that the outer circumference surface 300b to be coated of described microscope base 30 keeps clean, thereby in described plated film working spaces 21, obtain preferable coating effects.
Described transmitting device 221 is arranged at the bottom of described load chamber 62, heating chamber 64, purge chamber 65, plated film working spaces 21 and relief chamber 63, is moving linearly in this load chamber 62, heating chamber 64, purge chamber 65, plated film working spaces 21 and relief chamber 63 respectively successively thereby can drive described microscope base 30.
In addition, described vacuum extractor 24 can vacuumize described load chamber 62, heating chamber 64, purge chamber 65, plated film working spaces 21 and relief chamber 63 respectively independently, and the vacuum tightness of this load chamber 62, heating chamber 64, purge chamber 65, plated film working spaces 21 and relief chamber 63 can be adjusted according to the operation needs.
The sputtering type coating device 20,60 that the first embodiment of the invention and second embodiment are provided respectively, its via a carrier 22 that can move linearly along plated film working spaces 21 is set, and at least one reach 223 of this carrier 22 is set to can be around its central shaft rotation, can carry out plated film successively via the microscope base 30 that described carrier 22 drives described at least one reach 223 and upward carrying thereof, thereby can realize working continuously of plated film; And the microscope base 30 that simultaneously drives described at least one reach 223 and go up carrying via the auxiliary rotary unit of an independent control is around its central shaft rotation, thereby realizes that microscope base 30 needs the outer circumference surface 300b of plated film to obtain even rete.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.
Claims (10)
- [claim 1] a kind of sputtering type coating device, it comprises:A plated film working spaces;A carrier, this carrier comprises a transmitting device, an anchor and at least one reach, described transmitting device is arranged at the bottom of described working spaces, and can do motion of translation along the bearing of trend of the bottom of this working spaces, described anchor is arranged on the described transmitting device, and drive along the bearing of trend of the bottom of described plated film working spaces by described transmitting device and to do motion of translation, this at least one reach is arranged on this anchor, and be used to carry workpiece, and drive described workpiece and rotate around it; AndAt least one target, it is arranged in the described plated film working spaces, is used for described workpiece is carried out plated film.
- [claim 2] sputtering type coating device as claimed in claim 1, it is characterized in that, described carrier further comprises an auxiliary rotary unit, and this auxiliary swivel arrangement couples this at least one reach, makes this at least one reach around its central shaft rotation.
- [claim 3] sputtering type coating device as claimed in claim 2, it is characterized in that, described at least one reach one end has a gear, described one auxiliary rotary unit comprises at least one plate, it has a serrated face, the gear mechanism engagement of this serrated face and described at least one reach one end when this at least one plate moves with respect to described anchor, can rotate described at least one reach around its central shaft.
- [claim 4] sputtering type coating device as claimed in claim 1 is characterized in that, described transmitting device is a transport tape.
- [claim 5] sputtering type coating device as claimed in claim 1 is characterized in that, described sputtering type coating device further comprises a purge chamber, and described purge chamber and the adjacent setting in described plated film working spaces are used to accommodate and clean described workpiece.
- [claim 6] sputtering type coating device as claimed in claim 5 is characterized in that, described sputtering type coating device further comprises a heating chamber, and the adjacent setting with described purge chamber of described heating chamber is used to accommodate and described workpiece is carried out drying.
- [claim 7] sputtering type coating device as claimed in claim 6, it is characterized in that, described sputtering type coating device further comprises a load chamber and a relief chamber, the adjacent setting of described load chamber with described heating chamber, described relief chamber and the adjacent setting in described plated film working spaces, described load chamber is used to accommodate workpiece to be coated, and described relief chamber is used to accommodate the workpiece of plated film.
- [claim 8] sputtering type coating device as claimed in claim 7, it is characterized in that, described sputtering type coating device further comprises a vacuum extractor, described vacuum extractor is connected with described load chamber, described heating chamber, described purge chamber, described plated film working spaces and described relief chamber respectively by an extraction pipe, independently this load chamber, heating chamber, purge chamber, plated film working spaces and relief chamber are vacuumized respectively.
- [claim 9] sputtering type coating device as claimed in claim 1 is characterized in that, described sputtering type coating device further comprises at least one target electrode that is arranged in the described working spaces, corresponding respectively each target that loads of described each target electrode.
- [claim 10] a kind of sputtering type coating method, it may further comprise the steps:(1) provides a kind of sputtering type coating device as claimed in claim 1;(2) sheathed at least one workpiece on described at least one reach, described transmitting device drive this at least one reach and move linearly along the direction that approaches described at least one target; Simultaneously, described at least one reach is around its central shaft rotation.(3) the described at least one target of bombardment carries out plated film to described at least one workpiece.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710201556A CN101376964B (en) | 2007-08-31 | 2007-08-31 | Sputtering type film coating apparatus and film coating method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710201556A CN101376964B (en) | 2007-08-31 | 2007-08-31 | Sputtering type film coating apparatus and film coating method |
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| CN101376964A true CN101376964A (en) | 2009-03-04 |
| CN101376964B CN101376964B (en) | 2012-08-29 |
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| CN200710201556A Expired - Fee Related CN101376964B (en) | 2007-08-31 | 2007-08-31 | Sputtering type film coating apparatus and film coating method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101921992B (en) * | 2009-06-16 | 2013-03-20 | 鸿富锦精密工业（深圳）有限公司 | Carrying device |
| CN105734509A (en) * | 2016-05-04 | 2016-07-06 | 河南鸿昌电子有限公司 | Plasma sputtering refrigeration device crystal plate coating device and refrigeration device crystal plate coating method |
| CN106178113A (en) * | 2016-08-05 | 2016-12-07 | 北京爱康宜诚医疗器材有限公司 | Sputtering target, sputter and prosthese coating process |
| CN107326334A (en) * | 2017-07-12 | 2017-11-07 | 维达力实业(深圳)有限公司 | Continuous type coating apparatus |
| CN107475677A (en) * | 2017-08-18 | 2017-12-15 | 嘉兴申宁精密科技有限公司 | A kind of device using physical gas-phase deposition sputter coating |
| CN112281123A (en) * | 2020-10-23 | 2021-01-29 | 业成科技（成都）有限公司 | Sputtering system |
| CN114438577A (en) * | 2022-01-10 | 2022-05-06 | 上饶市兴杰达光电科技有限公司 | Anti-oxidation coating device for optical lens shell |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US4042128A (en) * | 1975-11-26 | 1977-08-16 | Airco, Inc. | Substrate transfer apparatus for a vacuum coating system |
| US4701251A (en) * | 1986-02-03 | 1987-10-20 | Bvt Limited | Apparatus for sputter coating discs |
| CN2086749U (en) * | 1990-12-25 | 1991-10-16 | 航空航天工业部第五研究院五一一研究所 | Multifunctional coating equipment using multiarc-magnetic control sputtering |
| CN2732757Y (en) * | 2004-07-15 | 2005-10-12 | 北京清华阳光能源开发有限责任公司 | Continuous coating device for coating capable of selectively absorbing solar spectrum |
| CN2797387Y (en) * | 2005-02-16 | 2006-07-19 | 友威科技股份有限公司 | Continuous vacuum film coating machine with built-in electrostatic dusting mechanism |
-
2007
- 2007-08-31 CN CN200710201556A patent/CN101376964B/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101921992B (en) * | 2009-06-16 | 2013-03-20 | 鸿富锦精密工业（深圳）有限公司 | Carrying device |
| CN105734509A (en) * | 2016-05-04 | 2016-07-06 | 河南鸿昌电子有限公司 | Plasma sputtering refrigeration device crystal plate coating device and refrigeration device crystal plate coating method |
| CN106178113A (en) * | 2016-08-05 | 2016-12-07 | 北京爱康宜诚医疗器材有限公司 | Sputtering target, sputter and prosthese coating process |
| CN107326334A (en) * | 2017-07-12 | 2017-11-07 | 维达力实业(深圳)有限公司 | Continuous type coating apparatus |
| CN107475677A (en) * | 2017-08-18 | 2017-12-15 | 嘉兴申宁精密科技有限公司 | A kind of device using physical gas-phase deposition sputter coating |
| CN112281123A (en) * | 2020-10-23 | 2021-01-29 | 业成科技（成都）有限公司 | Sputtering system |
| CN114438577A (en) * | 2022-01-10 | 2022-05-06 | 上饶市兴杰达光电科技有限公司 | Anti-oxidation coating device for optical lens shell |
| CN114438577B (en) * | 2022-01-10 | 2023-07-25 | 广东伊菲特光学科技有限公司 | Optical lens shell anti-oxidation coating device |
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