KR20200129615A - Plastic vacuum deposition coating system capable of coating with uniform thickness - Google Patents

Abstract

The present invention relates to a plastic vacuum deposition coating device capable of uniform thickness coating. The plastic vacuum deposition coating device capable of uniform thickness coating comprises a vacuum chamber (33), a mobile cart (36), an external jig (39), an inner jig (40), a plurality of water-cooled plasma electrodes (50), a plurality of magnetron sputtering sources (60), an exhaust pipe (82), a diffusion pump (85), a booster pump (88), a rotary pump (86), and a vacuum exhaust system (80). According to the present invention, the quality of a coated product can be increased.

Description

Plastic vacuum deposition coating system capable of coating with uniform thickness}

The present invention relates to a plastic vacuum evaporation coating apparatus capable of coating with a uniform thickness, and more particularly, to the provision of an apparatus capable of easily coating a conductive shield thin film layer on the surface of a plastic product.

Plastic is an organic material composed of carbon and hydrogen, and its chemical structure is electrically neutral and has distinct insulation, but has low heat resistance and a weak adhesion to the coating.

Plastic products are widely used as cases for mobile phones, computers, home appliances, and other industrial electrical and electronic products.

Currently, most of the coatings for plastic products are chemically dry copper coating followed by wet coating or spray coating.

This coating method is complicated to operate, increases non-uniformity in film thickness and environmental pollution, and causes problems such as separation of the coating layer over time.

In general, parts of electric, electronic and communication devices that are widely used are precision coating or shield coating to block harmful electromagnetic waves.In the case of spraying, conductive metal powder is mixed and sprayed with such coating, so workability Since it is not good and the electrical resistance is large, there are problems such as a problem in that the coating thickness needs to be thickened, and the coated thickness becomes uneven.

Recently, a vacuum coating device has been developed and used to perform vacuum deposition after a plastic product undergoes low-temperature ion beam treatment or RF plasma treatment in a vacuum chamber.

In addition to the disadvantage that devices such as an ion beam device and RF power are expensive, such a vacuum coating device can coat complex structures because the flat magnetron sputtering source used in the conventional vacuum coating device has a limited (limited) evaporation angle. In this case, there are various problems in that efficiency and productivity are deteriorated due to the occurrence of non-uniform coated or uncoated surfaces.

Accordingly, in the present invention, as invented to solve the above problems, the surface of the plastic product is subjected to plasma treatment in a vacuum state, so that the surface of the plastic product is etched or activated to enhance physical adhesion, as well as partially In consideration of the fact that chemical adhesion is also possible due to conversion into a peroxidation structure, in the present invention, for inexpensive and safe plasma treatment, a three-phase low-temperature plasma is used to have a distinct adhesion, and the evaporation angle in all directions (360°) It characterized in that it provides a coating apparatus using a columnar magnetron sputtering source having a.

The main purpose is to improve the quality of the coated product by enabling uniform coating over the entire area regardless of the structure of the plastic product to be coated using the coating device.

The present invention as described above provides a low-cost high-quality coating device capable of vacuum depositing a shield thin film using a magnet reciprocating and magnet rotation type cylindrical magnetron source after activating the surface of a plastic product using a three-phase low-temperature plasma electrode. It is an invention that contributes significantly to industrial development, such as improving productivity and improving quality by providing coating with a uniform thickness regardless of the structure of the product.

1 is a block diagram showing a plastic vacuum evaporation coating apparatus capable of coating with a uniform thickness to which the technology of the present invention is applied.
2 is an electrical configuration diagram of a three-phase low-temperature plasma electrode used in a plastic vacuum deposition coating apparatus capable of coating with a uniform thickness of the present invention.
3 is a configuration diagram of a columnar magnetron sputtering source applied to the present inventors a plastic vacuum deposition coating apparatus capable of coating with a uniform thickness.
Figure 4 is another configuration diagram of a columnar magnetron sputtering source applied to the present inventors a plastic vacuum evaporation coating apparatus that can be coated with a uniform thickness.
5 is a block diagram showing a vacuum exhaust relationship applied to the present inventors a plastic vacuum evaporation coating apparatus capable of coating with a uniform thickness.

Hereinafter, a preferred configuration and operation of the present invention for achieving the above object will be described with reference to the accompanying drawings.

1 is a configuration diagram showing a plastic vacuum evaporation coating apparatus capable of coating with a uniform thickness to which the technology of the present invention is applied, and FIG. 2 is a three-phase low-temperature plasma electrode used in a plastic vacuum evaporation coating apparatus capable of coating with a uniform thickness according to the present invention 3 is a schematic diagram of a cylindrical magnetron sputtering source applied to a plastic vacuum deposition coating apparatus capable of coating with a uniform thickness according to the present invention, and FIG. 4 is a plastic vacuum deposition coating apparatus capable of coating with a uniform thickness according to the present invention. Another configuration diagram of the applied columnar magnetron sputtering source, FIG. 5 will be described together as a configuration diagram showing a vacuum exhaust relationship applied to the inventive plastic vacuum evaporation coating apparatus capable of coating with a uniform thickness.

The coating sheet 100 to which the technology of the present invention is applied has a mass flow gauge (MFC) 31 having a pressure gauge 30 to inject argon (Ar) gas or oxygen used as a discharge medium at one side. The other side is provided with a cylindrical vacuum chamber 33 having an exhaust port 32 for evacuating the vacuum.

In the inside of the vacuum chamber 33, a moving carriage 36 having wheels 35 is installed so as to be slidable on a rail 34 provided at a predetermined interval in the axial direction of the vacuum chamber 33.

Above the guide rollers 38 maintained by supporters 37 on both sides of the mobile cart 36, a tubular type external jig 39 with both sides open is provided, and inside the external jig 39 An inner jig 40 is installed at a constant interval to be maintained by a support 41 erected in the center of the moving cart 36.

It will be natural to mount the plastic product P to be coated on the inner side of the outer jig 39 and the outer side of the inner jig 40.

The external jig 39 is rotated by a driving means 42 comprising a motor and a reducer installed outside the vacuum chamber 33 and a guide roller 38 connected by a detachable means such as a coupler.

The inner jig 40 is an intermediate and driven chain gear 44 installed on the upper and lower sides of the motive chain gear 43 installed together with the guide roller 38 and the support 41 holding the inner jig 40, 45) and chain 46 to drive.

In the vacuum chamber 33 located in the coating space S formed between the outer jig 39 and the inner jig 40, a plurality of water-cooled plasma electrodes 50 for plasma generation and a plastic product (P) by sputtering operation ), a plurality of magnetron sputtering sources 60 for coating are installed, and a vacuum exhaust system 80 is connected to the exhaust port 32.

Of course, a heater 47 is installed in the coating space S to improve the coating quality by preheating the plastic product P to promote the release of latent gas, and the heating temperature of the heater 47 and the vacuum chamber ( 33) Install a temperature sensor 48 to detect the internal temperature in an appropriate position.

The plasma electrode 50 inputs a required voltage from a three-phase external power source (380v) through the SRC voltage controller 51 and the step-up transformer 52 to the waveform changer 53, and the waveform changer 53 Make sure to receive power through it.

The plasma electrode 50 forms a low-temperature plasma by glow discharge ionization of the discharge gas in the vacuum chamber 33 to form a hydrophilic surface by etching or activating the plastic product P and converting it into a partial peroxidation structure.

The magnetron sputtering source 60 has a negative electrode sputtering target 61 formed in a columnar shape of a non-magnetic metal such as copper, aluminum, titanium, and stainless steel, and is provided in the sputtering target 61 A magnet 64 for generating a magnetic field is arranged on the axis 62 to be configured.

The magnetron sputtering source 60 assembles each magnet 64 on the shaft 62 in the order of NS and SN, as shown in FIG. 3, and the sputtering target 61 at an intermediate position of the intermediate magnet in which the power line and the magnetic field line are perpendicular to each other ), the sputtering 63 is generated in the 360° direction from the outer surface of ), and the magnet 64 is reciprocated in the axial direction so that the sputtering target 61 can be evaporated uniformly over the entire outer surface. .

As another example of the magnetron sputtering source 60, four or more magnets 64 are assembled in an even number of four or more magnets 64 on the shaft 62 provided inside the sputtering target 61, as shown in FIG. When arranged in NS or SN, a straight sputtering 63 evaporates from the outer surface of the sputtering target 61 at the center of NS or SN in the longitudinal direction of the sputtering target 61, and the magnet 64 is By rotating the sputtering target 61, the sputtering target 61 may be configured as a magnet rotation type that enables uniform evaporation.

The magnetron sputtering source 60 as described above can be arranged singly or in combination, and when the sputtering target 61 is arranged in combination with different materials, it is preferable to arrange it in a position where there is no mutual interference.

The vacuum exhaust system 80 is connected to an exhaust pipe 82 having an exhaust port 32 and a control shield 81 of the vacuum chamber 33, and the exhaust pipe 82 includes a high vacuum main valve 83 and an oil cooling trap. A diffusion pump 85 having 84 is connected.

The diffusion pump 85 is connected to the high vacuum valve 93, and then the high vacuum valve 93 → the booster pump 88 → the rotary pump 86 line and the high vacuum valve 93 → the valve 94 → the rotary pump ( 86) is a route, and the high vacuum main valve 83 is configured by connecting with a boost pump 88 having a low vacuum valve 87 in an intermediate position.

A high vacuum parallel valve 90 is further provided between the exhaust pipe 82 and the oil cooling trap 84 to prevent oil backflow of the diffusion pump 85 and maintain a normal exhaust speed during vacuum coating, and the high vacuum main valve ( A low vacuum parallel valve 91 and a flow control valve 92 are further installed between the 83) and the boost pump 88 at a constant pressure in the vacuum chamber 33 during plasma processing.

The present invention as described above,

After installing the plastic product (P) that has undergone an external cleaning process on the inner side of the outer jig 39 and the outer side of the inner jig 40 provided in the moving cart 36, the vacuum chamber 33 is opened and the vacuum chamber ( After making the wheel 35 of the moving cart 36 seated on the rail 34 provided in 33), it is pushed in.

In this state, the inside of the vacuum chamber 33 is maintained in a vacuum state by using the vacuum exhaust system 80, and then the heater 47 is operated to perform preheating, and an appropriate (preset) temperature is performed by the temperature sensor 48. When the temperature is maintained, the gas remaining in the plastic product (P) is exhausted.

After exhausting the gas remaining in the plastic product P by preheating, oxygen or external air, which is a discharge medium, is injected to reach the set pressure, and then three-phase power is supplied to the plasma electrode 50 to perform plasma treatment. .

At this time, the outer jig 39 is rotated by the guide roller 38 rotated by the driving means 42, and the inner jig 40 is a motive chain gear 43 and a chain installed on the roller 38 as a guide. It is rotated by the intermediate and driven gears 44 and 45 connected by (46), and the rotation direction may proceed regardless of the same or reverse direction.

As described above, by rotating the plastic product (P) in the plasma surface treatment process by the plasma electrode (50) supplied with three-phase power, the entire part is etched or the surface molecules are etched regardless of the complex structure of the plastic product (P). It is partially converted to a peroxidation structure, enabling chemical attachment to be activated, and to strengthen physical attachment.

After plasma treatment of the plastic product (P) is completed by the above operation, the vacuum chamber 33 is evacuated to a high vacuum state by using the vacuum exhaust system 80 again to cleanly remove residual air (oxygen). (Process) It is possible to prevent oxidation and nitriding that may occur in the coating process.

After the exhaust as described above is finished, argon (Ar) gas is injected as discharge gas through a pressure gauge 30 or a mass flow gauge (MFC) 31, while the sputtering target 61 is used as the cathode and a magnetic field is applied to the surface of the cathode. As a zoom, ring-shaped (circular) sputtering 63 occurs at the surface position of the sputtering target 61 so that atomic molecules are evaporated and deposited on the surface of the activated plastic product (P).

When the magnetron sputtering source 60 is a magnet reciprocating type, the magnets 64 assembled on the shaft 62 provided inside the sputtering target 61 are reciprocated in the axial direction of the sputtering target 61 to each magnet ( It does not evaporate only on the sputtering target 61 where 64) is located, but uniformly evaporates over the entire outer surface of the sputtering target 61.

And, in the case of the magnet rotation type, the evaporation action on the outer surface of the corresponding sputtering target 61 at an intermediate position between the pole and pole of each magnet 64 provided on the inner shaft 62 of the sputtering target 61 Therefore, by rotating the magnet 64, the sputtering target 61 is uniformly evaporated over the entire outer surface of the sputtering target 61 so that the expensive sputtering target 61 can be uniformly consumed.

In particular, the sputtering target 61 evaporates in all directions, and the outer jig 39 and the inner jig 40 on which the plastic parts P are mounted are in a rotating state, regardless of the complexity of the parts structure. It becomes possible to deposit evenly in every corner.

In the case of the vacuum exhaust system 80, a high vacuum parallel valve 90 between the exhaust pipe 82 and the oil cooling trap 84 to prevent oil backflow of the diffusion pump 85 and maintain the normal exhaust speed during vacuum coating. ), and a low vacuum parallel valve 91 and a flow control valve 92 capable of maintaining a constant pressure inside the vacuum chamber 33 during the plasma treatment, between the high vacuum main valve 83 and the booster pump 88 By installing more on it, it is possible to maintain an efficient exhaust relationship.

33; Vacuum chamber
39; External jig
40; Internal jig
50; Plasma electrode
60; Magnetron Sputtering Source
80; Vacuum exhaust system

Claims (8)

In constructing a plastic vacuum evaporation coating apparatus capable of coating with a uniform thickness;
The coating device 100,
A vacuum chamber 33 having a mass flow gauge (MFC) 31 having a pressure gauge 30 to inject argon (Ar) gas or oxygen used as a discharge medium and an exhaust port 32 for discharging exhaust gas. )Wow;
A moving cart 36 installed with a wheel 35 to be slidable on a rail 34 provided in the vacuum chamber 33;
An external jig (39) provided above the guide roller (38) maintained by supporters (37) on both upper sides of the mobile cart (36);
An inner jig 40 maintained on the inner side of the outer jig 39 by a support 41 erected at the center of the moving cart 36 by maintaining a predetermined interval;
A plurality of water-cooled plasma electrodes 50 for generating plasma in the coating space S formed between the outer jig 39 and the inner jig 40;
A plurality of magnetron sputtering sources 60 for coating the plastic product P by sputtering operation;
An exhaust pipe 82 connected to the exhaust port 32 with a control shield 81;
A diffusion pump 85 connected with a high vacuum main valve 83 and an oil cooling trap 84 to the exhaust pipe 82;
A booster pump 88 and a rotary pump 86 connected to the diffusion pump 85;
A plastic vacuum deposition coating apparatus capable of coating with a uniform thickness, characterized in that it comprises a vacuum exhaust system (80) having a boost pump (88) connected with a low vacuum valve (87) to the high vacuum main valve (83). The method of claim 1;
The plasma electrode 50 includes an SRC voltage controller 51 receiving a three-phase external power supply (380v) and a waveform changer 53 receiving a required voltage through a boosting transformer 52;
Plastic vacuum deposition coating apparatus capable of coating with a uniform thickness, characterized in that receiving power through the waveform changer (53). The method of claim 1;
The magnetron sputtering source 60 may include a sputtering target 61 formed by forming a columnar shape of a non-magnetic metal;
A plastic vacuum deposition coating apparatus capable of coating with a uniform thickness, characterized in that comprising a magnet 64 provided to generate a magnetic field on the shaft 62 inside the sputtering target 61. The method of claim 1;
A high vacuum parallel valve 90 is further provided between the exhaust pipe 82 of the vacuum exhaust system 80 and the oil cooling trap 84 to prevent oil backflow of the diffusion pump 85 and maintain a normal exhaust speed during vacuum coating. Equipped;
A low vacuum parallel valve 91 and a flow control valve 92 are further installed between the high vacuum main valve 83 and the boost pump 88 to maintain the inside of the vacuum chamber 33 at a constant pressure during plasma treatment. Plastic vacuum evaporation coating device capable of coating with uniform thickness. The method of claim 1;
The external jig 39 is rotated by a driving means 42 installed outside the vacuum chamber 33 and a guide roller 38 connected by a detachable means;
The inner jig 40 includes a motive chain gear 43 installed together with a guide roller 38;
It characterized in that it is driven by a chain 46 connecting the intermediate chain gear 44 and driven chain gears 44 and 45 installed on the upper and lower sides of the support 41 holding the inner jig 40 Plastic vacuum evaporation coating device capable of coating with uniform thickness. The method of claim 1;
In the coating space (S) provided in the vacuum chamber 33 located between the outer jig 39 and the inner jig 40, the plastic product P is preheated to promote the release of latent gas to improve the coating quality. A heater 47;
A plastic vacuum deposition coating apparatus capable of coating with a uniform thickness, characterized in that a temperature sensor (48) for sensing the heating temperature of the heater (47) and the temperature inside the vacuum chamber (33) is installed. The method according to claim 1 or 3;
The magnet 64 constituting the magnetron sputtering source 60 assembles each magnet 64 on the shaft 62 in the order of NS and SN, so that the power line and the magnetic line of force correspond to the intermediate position of the intermediate magnets perpendicular to each other. Sputtering 63 is generated in the circumferential direction on the outer surface of the sputtering target 61 so as to have an evaporation angle in the 360° direction;
A plastic vacuum evaporation coating apparatus capable of coating with a uniform thickness, characterized in that it is of a magnet reciprocating type that uniformly evaporates over the entire outer surface of the sputtering target 61 by reciprocating the magnet 64 in the axial direction. The method according to claim 1 or 3;
The magnets 64 constituting the magnetron sputtering source 60 have four or more even numbers of each magnet 64 provided on the inner shaft 62 of the sputtering target 61 to be a different pole from the adjacent poles. Arranged radially;
It is configured so that evaporation occurs in the longitudinal direction of the outer surface of the sputtering target 61 between the magnet 64 and the other electrode (NS or SN);
A plastic vacuum deposition coating apparatus capable of coating with a uniform thickness, characterized in that it is configured to evaporate uniformly over the entire outer surface of the sputtering target 61 by rotating the magnet 64.

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