TWI399448B - Aparatus and method of sputtering deposition - Google Patents

Aparatus and method of sputtering deposition Download PDF

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Publication number
TWI399448B
TWI399448B TW96135468A TW96135468A TWI399448B TW I399448 B TWI399448 B TW I399448B TW 96135468 A TW96135468 A TW 96135468A TW 96135468 A TW96135468 A TW 96135468A TW I399448 B TWI399448 B TW I399448B
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chamber
coating apparatus
sputter coating
workpiece
target
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TW96135468A
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TW200914636A (en
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Shih Chieh Yen
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Hon Hai Prec Ind Co Ltd
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Description

濺鍍式鍍膜裝置及鍍膜方法 Sputter coating device and coating method

本發明涉及一種鍍膜裝置及鍍膜方法,尤其涉及一種濺鍍式鍍膜裝置及採用該濺鍍式鍍膜裝置之鍍膜方法。 The invention relates to a coating device and a coating method, in particular to a sputtering coating device and a coating method using the sputtering coating device.

濺鍍是利用電漿產生之離子去撞擊陰極靶材,將靶材內之原子撞出而沉積於基材表面上堆積成膜層。由於濺鍍可達成較佳之沉積效率、精確控制成分以及較低之製造成本,是故於工業上被廣泛應用。 Sputtering is the use of ions generated by plasma to strike the cathode target, and the atoms in the target are knocked out and deposited on the surface of the substrate to form a film layer. Since sputtering can achieve better deposition efficiency, precise control composition, and lower manufacturing cost, it is widely used in industry.

當前手機數碼相機鏡頭之應用已日漸普及,是故有必要提升其關鍵零部件之製造技術,以有效地降低其製造成本及提升其良率。作為相機鏡頭關鍵零部件之一之鏡頭模組通常包括鏡座、鏡筒以及收容於鏡筒內之鏡片、墊片(Spacer)、光圈、紅外截止濾光片(IR-cut Filter)等元件。鏡片之設計方法請參閱Chao等人於2000年IEEE系統、超聲波會議(2000 IEEE Ultrasonics Symposium)上發表之論文Aspheric lens design。 The application of current mobile digital camera lenses has become increasingly popular, so it is necessary to improve the manufacturing technology of its key components to effectively reduce its manufacturing costs and increase its yield. The lens module, which is one of the key components of the camera lens, usually includes a lens holder, a lens barrel, and a lens, a spacer, an aperture, an IR-cut filter, and the like housed in the lens barrel. For the design method of the lens, please refer to the paper Aspheric lens design published by Chao et al. in the 2000 IEEE Ultrasonics Symposium.

於鏡頭模組組裝過程中,通常需將該鏡片、墊片、光圈、紅外截止濾光片等元件通過一定順序裝入鏡筒,再將鏡筒旋入鏡座以組裝成一完整之鏡頭模組。如圖1所示,為了降低該鏡頭模組受電磁干擾程度,於組裝該鏡頭模組之前,一般需於鏡座2a之外圓周面20a上濺鍍一層防電磁干擾(Electromagnetic Interference,EMI)膜層,以提升組裝後鏡頭模組抗電磁干擾之能力。鍍膜後之產品需要做多項環境測試,比如高溫高壓測試、熱衝擊測試、腐蝕測試等,如果鍍上之膜層不均勻,其容易脫落,且 膜層較薄區域電阻值較高,防電磁干擾(EMI)之效果不佳,是故,膜層厚度之均勻性非常重要。 During the assembly of the lens module, components such as a lens, a spacer, an aperture, an infrared cut filter, and the like are usually loaded into the lens barrel in a certain order, and then the lens barrel is screwed into the lens holder to assemble a complete lens module. . As shown in FIG. 1 , in order to reduce the degree of electromagnetic interference of the lens module, an electromagnetic interference (EMI) film is generally sputtered on the outer circumferential surface 20a of the lens holder 2a before assembling the lens module. Layer to improve the ability of the assembled lens module to resist electromagnetic interference. After coating, the product needs to do a lot of environmental tests, such as high temperature and high pressure test, thermal shock test, corrosion test, etc. If the coated film is not uniform, it is easy to fall off, and The thinner region of the film has a higher resistance value, and the effect of preventing electromagnetic interference (EMI) is not good. Therefore, the uniformity of the film thickness is very important.

先前技術以濺鍍法來製備該鏡座2a外圓周面20a之膜層時,該鏡座2a於靶材下方保持一定速度沿靶材下方延伸方向行進,於行進過程中,對於鏡座2a外圓周面來講,不同部位20b、20c相對於靶材之幾何位置不一致,且鍍於其上之靶束1b、1c射程也不一致,是故,容易造成鍍膜時膜層厚度不均勻,為了提高該膜層厚度均勻度,一般靶材要比鏡座大很多,且靶材射束分散,是故,靶材消耗較多,且一定程度上鍍膜均勻度不理想。 In the prior art, when the film layer of the outer circumferential surface 20a of the lens holder 2a is prepared by sputtering, the lens holder 2a maintains a certain speed below the target to travel in the direction in which the target extends downward, and during the traveling, outside the lens holder 2a. In terms of the circumferential surface, the geometrical positions of the different portions 20b, 20c with respect to the target are inconsistent, and the ranges of the target beams 1b, 1c plated thereon are also inconsistent, which is likely to cause uneven thickness of the film during coating, in order to improve the The thickness uniformity of the film layer is generally much larger than that of the lens holder, and the target beam is dispersed. Therefore, the target material is consumed more, and the uniformity of the coating film is not ideal to some extent.

有鑒於此,有必要提供一種相較於先前技術,能進一步提高膜層均勻度,且能夠提高靶材利用率之濺鍍式鍍膜裝置及鍍膜方法。 In view of the above, it is necessary to provide a sputtering type coating apparatus and a coating method which can further improve the uniformity of a film layer and improve the utilization ratio of a target compared with the prior art.

下面將以實施例說明一種提高膜層均勻度,且能夠提高靶材利用率之濺鍍式鍍膜裝置及鍍膜方法。 Hereinafter, a sputtering type plating apparatus and a coating method which can improve the uniformity of a film layer and can improve the utilization ratio of a target will be described by way of examples.

本發明提供一種濺鍍式鍍膜裝置,其包括一鍍膜工作室;至少一靶材,其設置於該鍍膜工作室內,用於對該工件進行鍍膜;一運載裝置,其可沿該鍍膜工作室之底部之延伸方向做線性運動,該運載裝置包括一固定架及至少一承載軸,該固定架用於固定該至少一承載軸,該至少一承載軸,用於承載工件,且帶動該工件繞該至少一承載軸旋轉。該濺鍍式鍍膜裝置,還可進一步包括一獨立控制之輔助裝置,該輔助裝置可相對於傳輸方向移動,從而協助該至少一承載軸繞其中心軸旋轉。 The present invention provides a sputter coating apparatus comprising a coating working chamber; at least one target disposed in the coating working chamber for coating the workpiece; and a carrier device along the coating working chamber The extending direction of the bottom portion is linearly moved. The carrying device comprises a fixing frame and at least one bearing shaft for fixing the at least one bearing shaft, the at least one bearing shaft for carrying the workpiece and driving the workpiece around the At least one load bearing shaft rotates. The sputter coating apparatus may further comprise an independently controlled auxiliary device movable relative to the transport direction to assist in rotation of the at least one load bearing shaft about its central axis.

以及,一種採用上述濺鍍式鍍膜裝置之濺鍍式鍍膜方法,其包括以下步驟:(1)提供一種如所述濺鍍式鍍膜裝置;(2)該至少一承載軸沿接近於該至少 一靶材之方向作線性運動;另,該輔助單元協助該至少一承載軸繞其中心軸旋轉;(3)該工件隨該至少一承載軸一起,沿接近於該至少一靶材之方向作線性運動,並另繞該至少一承載軸旋轉;(4)該至少一靶材對該工件進行鍍膜。 And a sputtering coating method using the above-described sputtering coating apparatus, comprising the steps of: (1) providing a sputtering coating apparatus as described; (2) the at least one bearing shaft is close to the at least The direction of a target is linearly moved; in addition, the auxiliary unit assists the at least one load bearing shaft to rotate about its central axis; and (3) the workpiece along with the at least one load bearing shaft is disposed in a direction close to the at least one target Linearly moving and rotating about the at least one load bearing shaft; (4) the at least one target coating the workpiece.

相對於先前技術,該濺鍍式鍍膜裝置及鍍膜方法經由設置一可沿鍍膜工作室作線性運動之運載裝置,並將該運載裝置之至少一承載軸設置為可繞其中心軸旋轉,一方面,可經由該運載裝置帶動至少一承載軸上承載之工件依次進行鍍膜,從而可實現鍍膜之連續作業;另一方面,至少一承載軸帶動工件一起繞其軸旋轉,提高膜層厚度之均勻度,進而提高良率。 In contrast to the prior art, the sputter coating apparatus and the coating method provide a carrier that can move linearly along the coating working chamber, and set at least one carrying shaft of the carrying device to be rotatable about a central axis thereof. The workpiece carried by the at least one bearing shaft can be sequentially coated by the carrying device, so that the continuous operation of the coating can be realized; on the other hand, at least one bearing shaft drives the workpiece to rotate around the axis thereof to improve the uniformity of the thickness of the coating layer. And thus improve the yield.

20‧‧‧濺鍍式鍍膜裝置 20‧‧‧Sputter coating device

2a‧‧‧鏡座 2a‧‧ ‧Mirror holder

21、61‧‧‧鍍膜工作室 21, 61‧‧‧ coating studio

20a‧‧‧外圓周面 20a‧‧‧ outer circumferential surface

22‧‧‧運載裝置 22‧‧‧ Carrier

20b、20c‧‧‧外圓周面之部位 20b, 20c‧‧‧ the outer circumferential surface

23‧‧‧靶材 23‧‧‧ Targets

1b、1c‧‧‧靶束 1b, 1c‧‧‧ target beam

30‧‧‧鏡座 30‧‧‧Mirror seat

24‧‧‧抽真空裝置 24‧‧‧ Vacuuming device

30a‧‧‧底座 30a‧‧‧Base

60‧‧‧濺鍍式鍍膜裝置 60‧‧‧Sputter coating device

30b‧‧‧圓筒形結構 30b‧‧‧Cylindrical structure

62‧‧‧裝載室 62‧‧‧Loading room

300b‧‧‧外圓周面 300b‧‧‧ outer circumferential surface

63‧‧‧卸載室 63‧‧‧ Unloading room

221‧‧‧傳輸裝置 221‧‧‧Transportation device

64‧‧‧加熱室 64‧‧‧heating room

222‧‧‧固定架 222‧‧‧ fixed frame

65‧‧‧清洗室 65‧‧‧cleaning room

223‧‧‧承載軸 223‧‧‧bearing shaft

210‧‧‧底部 210‧‧‧ bottom

224‧‧‧輔助單元 224‧‧‧Auxiliary unit

230‧‧‧靶電極 230‧‧‧ target electrode

40‧‧‧第一位置 40‧‧‧First position

224a、224b‧‧‧板條 224a, 224b‧‧‧ slats

41‧‧‧第二位置 41‧‧‧second position

223a、223b‧‧‧齒狀部分 223a, 223b‧‧‧ toothed parts

222a、222b‧‧‧固定環 222a, 222b‧‧‧ fixed ring

圖1係現有採用濺渡法對鏡座進行鍍膜之示意圖。 Fig. 1 is a schematic view showing the coating of a lens holder by a sputtering method.

圖2係本發明第一實施例提供之濺鍍式鍍膜裝置之示意圖。 2 is a schematic view of a sputter coating apparatus according to a first embodiment of the present invention.

圖3係鏡座之結構示意圖。 Figure 3 is a schematic view of the structure of the lens holder.

圖4係圖2所示濺鍍式鍍膜裝置之運載裝置立體放大示意圖。 4 is a perspective enlarged view of the carrier of the sputter coating device shown in FIG. 2.

圖5係圖2所示之濺鍍式鍍膜裝置對鏡座之外圓周面進行鍍膜之示意圖。 Fig. 5 is a schematic view showing the sputtering of the outer circumferential surface of the lens holder by the sputtering type plating apparatus shown in Fig. 2.

圖6係本發明第二實施例所示之濺鍍式鍍膜裝置之示意圖。 Fig. 6 is a schematic view showing a sputtering type plating apparatus shown in a second embodiment of the present invention.

下面將結合圖式對本發明作進一步之詳細說明。 The invention will now be further described in detail in conjunction with the drawings.

請參閱圖2,本發明第一實施例提供之一種濺鍍式鍍膜裝置20,該濺鍍式鍍膜裝置20包括一鍍膜工作室21,一運載裝置22以及一靶材23。 Referring to FIG. 2 , a sputter coating apparatus 20 is provided in a first embodiment of the present invention. The sputter coating apparatus 20 includes a coating working chamber 21 , a carrier 22 and a target 23 .

該鍍膜工作室21用以提供一真空濺鍍環境。通常,該鍍膜工作室21包括一與該鍍膜工作室21相連通之氣體入口(圖未示)及一氣體出口(未標示)。其 中,氣體入口用於向鍍膜工作室21內導入放電氣體,例如氬氣、氮氣等,氣體出口用於使鍍膜工作室21於工作時保持一定之真空度。該氣體出口通常與一抽真空裝置24相連,該抽真空裝置24可為分子泵、洛茨真空泵或幹式機械真空泵等。 The coating working chamber 21 is used to provide a vacuum sputtering environment. Typically, the coating working chamber 21 includes a gas inlet (not shown) in communication with the coating working chamber 21 and a gas outlet (not shown). its The gas inlet is used to introduce a discharge gas such as argon gas, nitrogen gas or the like into the coating working chamber 21, and the gas outlet is used to maintain a certain degree of vacuum during the working of the coating working chamber 21. The gas outlet is typically connected to a vacuuming device 24, which may be a molecular pump, a Lotz vacuum pump or a dry mechanical vacuum pump.

該靶材23設置於該鍍膜工作室21內,本實施例中,該靶材23為銅靶材,其數目可設置為三個,且該三個靶材沿圖2中直線箭頭方向分佈。另外,該三個靶材23分別可裝載於三個靶電極230,且該三個靶電極230可為板狀電極,其於濺鍍過程通常充當陰極且其開關狀態可分別獨立控制。通過轟擊靶材23可對如圖3所示之鏡座30之待鍍膜表面300b進行鍍膜。該鏡座30通常包括一底座30a及從該底座30a上延伸出來之一圓筒形結構30b,該防電磁幹擾膜層形成於該圓筒形結構30b之外圓周面300b上。 The target 23 is disposed in the coating working chamber 21. In the embodiment, the target 23 is a copper target, and the number thereof can be set to three, and the three targets are distributed along the direction of the straight arrow in FIG. In addition, the three targets 23 can be respectively loaded on the three target electrodes 230, and the three target electrodes 230 can be plate electrodes, which generally serve as cathodes during the sputtering process and their switching states can be independently controlled. The surface to be coated 300b of the mirror holder 30 shown in Fig. 3 can be coated by bombarding the target 23. The lens holder 30 generally includes a base 30a and a cylindrical structure 30b extending from the base 30a. The electromagnetic interference preventing film layer is formed on the outer circumferential surface 300b of the cylindrical structure 30b.

請參閱圖4,該運載裝置22包括一傳輸裝置221、一固定架222、至少一承載軸223,以及一獨立控制之輔助單元224。該傳輸裝置221設置於該鍍膜工作室21之底部並可沿該底部之延伸方向(如圖2中箭頭所示方向)做線性運動。優選地,該傳輸裝置221可為一傳輸帶。該固定架222設置於該傳輸裝置221上,由傳輸裝置221帶動其移動,該至少一承載軸223設置於該固定架221上並可繞其中心軸旋轉。 Referring to FIG. 4, the carrier 22 includes a transport device 221, a mounting bracket 222, at least one load bearing shaft 223, and an independently controlled auxiliary unit 224. The transporting device 221 is disposed at the bottom of the coating working chamber 21 and is linearly movable in the extending direction of the bottom (in the direction indicated by the arrow in FIG. 2). Preferably, the transmission device 221 can be a transmission belt. The mounting bracket 222 is disposed on the transporting device 221 and is driven by the transporting device 221. The at least one carrying axle 223 is disposed on the mounting bracket 221 and rotatable about a central axis thereof.

具體地,該至少一承載軸223兩端套設於該固定架222之兩個固定環222a、221b內,該至少一承載軸223隨固定架222一起由傳輸裝置221帶動運動。該至少一承載軸223於隨固定架222運動另,可繞其中心軸旋轉。具體地,該至少一承載軸223可通過一輔助單元224帶動旋轉,優選地,該輔助單元224包括兩件板條224a、224b,其中板條224a、224b分別具有一齒狀接觸面,該板條224a、224b之一齒狀接觸面分別與該至少一承載軸之兩端齒狀部分223a、223b機械嚙合,該輔助單元224可相對於傳輸裝置221移動,帶 動該至少一承載軸223繞其中心軸旋轉,具體地,該板條224a、224b由第一位置40向第二位置41移動,帶動該至少一承載軸223繞其中心軸旋轉。當然該輔助單元224也可只包括一件板條,如設置於該承載軸223一端之板條224a,其相對於傳輸裝置221移動,也可帶動223繞其中心軸旋轉。 Specifically, the two ends of the at least one bearing shaft 223 are sleeved in the two fixing rings 222a and 221b of the fixing frame 222, and the at least one bearing shaft 223 is driven by the transmission device 221 along with the fixing frame 222. The at least one carrier shaft 223 is movable along the fixed frame 222 and rotatable about its central axis. Specifically, the at least one bearing shaft 223 can be rotated by an auxiliary unit 224. Preferably, the auxiliary unit 224 includes two strips 224a, 224b, wherein the strips 224a, 224b respectively have a tooth-shaped contact surface, the board One of the toothed contact faces of the strips 224a, 224b is mechanically engaged with the toothed portions 223a, 223b of the at least one load bearing shaft, respectively, and the auxiliary unit 224 is movable relative to the transport device 221 The at least one load bearing shaft 223 is rotated about its central axis. Specifically, the slats 224a, 224b are moved from the first position 40 to the second position 41 to drive the at least one load bearing shaft 223 to rotate about its central axis. Of course, the auxiliary unit 224 may also include only one slat, such as a slat 224a disposed at one end of the carrier shaft 223, which is movable relative to the transport device 221 and can also rotate 223 about its central axis.

該至少一承載軸223用於承載鏡座30,其兩端穿過設置於該固定架222上之兩個固定環222a、222b,隨固定架222如該向接近於靶材之方向做線性運動,具體地,該至少一承載軸223可由導電材料,如鐵、鋁等金屬製成,其於濺鍍過程中充當陽極。 The at least one bearing shaft 223 is configured to carry the lens holder 30, and the two ends thereof pass through two fixing rings 222a and 222b disposed on the fixing frame 222, and linearly move along the direction of the fixing frame 222 toward the target. Specifically, the at least one carrier shaft 223 may be made of a conductive material such as metal such as iron or aluminum, which serves as an anode during the sputtering process.

請進一步參閱圖2、圖4與圖5,下面將簡要描述一種利用本發明第一實施例所提供之濺鍍式鍍膜裝置20於鏡座30之外圓周面300b上製作具有防電磁幹擾膜層之濺鍍式鍍膜方法,其包括以下步驟: Referring to FIG. 2, FIG. 4 and FIG. 5, a method for forming an anti-electromagnetic interference film on the outer circumferential surface 300b of the lens holder 30 by using the sputter coating device 20 provided by the first embodiment of the present invention will be briefly described below. A sputter coating method comprising the following steps:

(1)將待鍍膜工件30裝載於該至少一承載軸223上。 (1) The workpiece 30 to be coated is loaded on the at least one carrier shaft 223.

如圖4所示,將該鏡座30固定於該至少一承載軸223上,且與該至少一承載軸共軸,並能夠被至少一承載軸223帶動繞自身中心軸旋轉。 As shown in FIG. 4, the lens holder 30 is fixed to the at least one bearing shaft 223, and is coaxial with the at least one bearing shaft, and is capable of being rotated by the at least one bearing shaft 223 about its own central axis.

(2)該至少一承載軸223沿接近於該至少一靶材23之方向作線性運動,並另繞其中心軸旋轉。 (2) The at least one carrier shaft 223 linearly moves in a direction close to the at least one target 23 and rotates about its central axis.

該至少一承載軸223兩端套於固定架222之固定環222上,且可隨意繞其中心軸轉動,其將與固定架222一起,隨傳輸裝置221沿該傳輸裝置221之運動方向(如圖5中水準箭頭所示方向)運動並接近該靶材23。另,該輔助單元224帶動該至少一承載軸223繞其中心軸旋轉,使得套於該至少一承載軸223上之工件30也繞自身中心軸旋轉。具體地,該輔助單元224之兩塊板條224a、224b,可相對於傳輸裝置221移動,其中,板條224a、224b分別具有一齒狀接觸面,該板條224a、224b之一齒狀接觸面分別與至少一承載軸 223兩端齒狀部分223a、223b機械嚙合,該輔助單元224如該相對於傳輸裝置221移動,帶動至少一承載軸223旋轉。 The two ends of the at least one carrying shaft 223 are sleeved on the fixing ring 222 of the fixing frame 222 and can be rotated around the central axis thereof, and will be along with the fixing frame 222 along the moving direction of the transmission device 221 along the transmission device 221 (eg The direction shown by the horizontal arrow in Fig. 5 moves and approaches the target 23. In addition, the auxiliary unit 224 drives the at least one bearing shaft 223 to rotate about its central axis, so that the workpiece 30 sleeved on the at least one bearing shaft 223 also rotates about its central axis. Specifically, the two slats 224a, 224b of the auxiliary unit 224 are movable relative to the transport device 221, wherein the slats 224a, 224b respectively have a tooth-shaped contact surface, and one of the slats 224a, 224b is in tooth contact. Face and at least one bearing shaft The two end tooth portions 223a, 223b are mechanically engaged, and the auxiliary unit 224 moves relative to the transport device 221 to drive at least one load bearing shaft 223 to rotate.

可理解之是,當該固定架222於該傳輸裝置221之帶動下進入該鍍膜工作室21時,可經由與鍍膜工作室21相連通之抽真空裝置24對鍍膜工作室21抽真空至預定壓力之真空狀態,並經由與鍍膜工作室21相連通之氣體入口向鍍膜工作室21通入放電氣體,如氬氣等。 It can be understood that when the fixing frame 222 enters the coating working chamber 21 by the conveying device 221, the coating working chamber 21 can be evacuated to a predetermined pressure via the vacuuming device 24 communicating with the coating working chamber 21. In a vacuum state, a discharge gas such as argon gas or the like is supplied to the coating working chamber 21 via a gas inlet communicating with the coating working chamber 21.

(3)該至少一靶材23對該工件30進行鍍膜。 (3) The at least one target 23 coats the workpiece 30.

該至少一靶材23可根據需要設置,例如,一般鍍防電磁輻射膜,所需要之靶材分為兩區,第一區為銅靶,第二區為不銹鋼靶,每一區可由3個靶材組成,控制靶材數量可鍍不同之厚度,如,先鍍一層銅(銅膜層厚度約2μm以內),鍍完後再將該鏡座30送入第二區,進一步於該鏡座30之外圓周面300b之銅膜層上濺鍍上一層不銹鋼膜層(不銹鋼膜層厚度約0.5μm以內)。 The at least one target 23 can be disposed as needed, for example, generally coated with an electromagnetic radiation prevention film, and the required target is divided into two regions, the first region is a copper target, the second region is a stainless steel target, and each region can be composed of three. The target composition, the number of control targets can be plated with different thicknesses, for example, a layer of copper is first coated (the thickness of the copper film layer is less than 2 μm), and after the plating is completed, the lens holder 30 is sent to the second region, further to the lens holder. A copper film layer of 30 outer circumferential surface 300b is sputtered with a stainless steel film layer (the thickness of the stainless steel film layer is within about 0.5 μm).

如圖5所示,當該鏡座30運動至至少一靶材23正下方時,可由外部電源(圖未示)向該靶電極230施加負電壓,另至少一承載軸223接地(圖未示),使得該銅靶材23表面上之放電氣體電離並產生等離子,通過該等離子之離子於銅靶材23上撞擊出原子或原子團,並將該原子團沉積於該待鍍膜之外圓周面300b,可於該外圓周面300b上形成一膜層。 As shown in FIG. 5, when the lens holder 30 is moved directly under the at least one target 23, a negative voltage can be applied to the target electrode 230 by an external power source (not shown), and at least one of the carrier shafts 223 is grounded (not shown). , causing the discharge gas on the surface of the copper target 23 to ionize and generate a plasma, and the ions or ions are struck on the copper target 23 by the ions of the plasma, and the atomic group is deposited on the outer circumferential surface 300b of the film to be coated, A film layer may be formed on the outer circumferential surface 300b.

可理解之是,當該鏡座30運動至與該銅靶材23相對時,鏡座30繞自身中心軸旋轉,鏡座30之外圓周面300b上任意部位相對於銅靶材23幾何位置一致,是故於該外圓周面300b上形成之膜層厚度均勻。控制旋轉速度可獲得適當之膜厚。而且,對於本發明之濺鍍式鍍膜裝置,由於不需要設置較大之靶材,且靶束不需要分散,是故,可提高靶材利用率,達到降低成本之功效。 It can be understood that when the lens holder 30 is moved to oppose the copper target 23, the lens holder 30 rotates about its own central axis, and the geometrical position of any portion on the outer circumferential surface 300b of the lens holder 30 is consistent with respect to the copper target 23. Therefore, the thickness of the film layer formed on the outer circumferential surface 300b is uniform. A suitable film thickness can be obtained by controlling the rotational speed. Further, in the sputtering type plating apparatus of the present invention, since it is not necessary to provide a large target and the target beam does not need to be dispersed, the utilization ratio of the target can be improved, and the cost reduction effect can be achieved.

請參閱圖6,本發明第二實施例提供之一種濺鍍式鍍膜裝置60,其與本發明第一實施例提供之濺鍍式鍍膜裝置20結構基本相同,其區別在於:該濺鍍式鍍膜裝置60還進一步包括一裝載室62、一卸載室63、一加熱室64及一清洗室65,該傳輸裝置221分別設置於該裝載室62、加熱室64、清洗室65、鍍膜工作室61及卸載室63之底部210,該抽真空裝置24分別通過一抽氣管與該裝載室62、加熱室64、清洗室65及卸載室63相連通。 Referring to FIG. 6, a sputtering type coating apparatus 60 according to a second embodiment of the present invention is basically the same as the sputtering type coating apparatus 20 provided by the first embodiment of the present invention, and the difference is that the sputtering type coating is provided. The device 60 further includes a loading chamber 62, an unloading chamber 63, a heating chamber 64, and a cleaning chamber 65. The transmission device 221 is disposed in the loading chamber 62, the heating chamber 64, the cleaning chamber 65, the coating working chamber 61, and The bottom portion 210 of the unloading chamber 63 is communicated with the loading chamber 62, the heating chamber 64, the cleaning chamber 65, and the unloading chamber 63 through an exhaust pipe, respectively.

具體地,該裝載室62、加熱室64、清洗室65、鍍膜工作室61及卸載室63依次相鄰設置。其中,該裝載室62用於收容待鍍膜之鏡座30,該卸載室63用於收容已鍍膜之鏡座30。 Specifically, the loading chamber 62, the heating chamber 64, the cleaning chamber 65, the coating working chamber 61, and the unloading chamber 63 are sequentially disposed adjacent to each other. The loading chamber 62 is configured to receive a mirror holder 30 to be coated, and the unloading chamber 63 is configured to receive the mirrored lens holder 30.

該加熱室64用在於將該待鍍膜之鏡座30送入該清洗室65進行等離子清洗前,收容並加熱該鏡座30,以對該鏡座30進行乾燥,並提升該鏡座30於該鍍膜工作室61進行鍍膜時之鍍膜品質。 The heating chamber 64 is configured to receive and heat the lens holder 30 before the plasma holder 30 to be coated into the cleaning chamber 65 for plasma cleaning, to dry the lens holder 30, and lift the lens holder 30. The coating working chamber 61 performs the coating quality at the time of coating.

該清洗室65用在於將該鏡座30送入鍍膜工作室2161進行鍍膜前,對該鏡座30之待鍍膜外圓周面300b進行電漿清洗(plasma cleaning),以使該鏡座30之待鍍膜外圓周面300b保持潔淨,從而於該鍍膜工作室61內獲得較佳之鍍膜效果。 The cleaning chamber 65 is used for plasma cleaning of the outer circumferential surface 300b of the mirror holder 30 before the mirror holder 30 is sent to the coating working chamber 2161 for coating, so that the mirror holder 30 is to be treated. The outer circumferential surface 300b of the coating is kept clean, so that a preferable coating effect is obtained in the coating working chamber 61.

該傳輸裝置221設置於該裝載室62、加熱室64、清洗室65、鍍膜工作室61及卸載室63之底部,從而可帶動該鏡座30於依次分別於該裝載室62、加熱室64、清洗室65、鍍膜工作室61及卸載室63作線性運動。 The transport device 221 is disposed at the bottom of the loading chamber 62, the heating chamber 64, the cleaning chamber 65, the coating working chamber 61, and the unloading chamber 63, so that the mirror holder 30 can be driven in the loading chamber 62 and the heating chamber 64, respectively. The cleaning chamber 65, the coating working chamber 61, and the unloading chamber 63 perform linear motion.

另外,該抽真空裝置24可分別獨立地對該裝載室62、加熱室64、清洗室65、鍍膜工作室61及卸載室63抽真空,使該裝載室62、加熱室64、清洗室65、鍍膜工作室2161及卸載室63之真空度可根據作業需要進行調整。 In addition, the vacuuming device 24 can independently vacuum the loading chamber 62, the heating chamber 64, the cleaning chamber 65, the coating working chamber 61 and the unloading chamber 63, and the loading chamber 62, the heating chamber 64, the cleaning chamber 65, The degree of vacuum of the coating working chamber 2161 and the unloading chamber 63 can be adjusted according to the operation needs.

本發明第一實施例及第二實施例分別所提供之濺鍍式鍍膜裝置20、60,其 經由設置一可沿鍍膜工作室21、61作線性運動之運載裝置22、並將該運載裝置22之至少一承載軸223設置為可繞其中心軸旋轉,可經由該運載裝置22帶動該至少一承載軸223及其上承載之鏡座30依次進行鍍膜,從而可實現鍍膜之連續作業;並另經由一獨立控制之輔助單元帶動該至少一承載軸223及其上承載之鏡座30繞其中心軸旋轉,從而實現鏡座30需鍍膜之外圓周面300b獲得均勻膜層。 Sputter coating apparatus 20, 60 provided by the first embodiment and the second embodiment of the present invention, respectively By providing a carrier 22 that can move linearly along the coating working chambers 21, 61 and arranging at least one carrier shaft 223 of the carrier 22 to be rotatable about its central axis, the carrier 22 can be used to drive the at least one The bearing shaft 223 and the mirror holder 30 carried thereon are sequentially coated, so that the continuous operation of the coating can be realized; and the at least one bearing shaft 223 and the mirror holder 30 carried thereon are driven around the center thereof through an independently controlled auxiliary unit. The shaft is rotated, thereby achieving a uniform film layer on the outer circumferential surface 300b of the mirror holder 30 to be coated.

綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

20‧‧‧濺鍍式鍍膜裝置 20‧‧‧Sputter coating device

21‧‧‧鍍膜工作室 21‧‧‧ Coating Studio

22‧‧‧運載裝置 22‧‧‧ Carrier

23‧‧‧靶材 23‧‧‧ Targets

221‧‧‧傳輸裝置 221‧‧‧Transportation device

Claims (10)

一種濺鍍式鍍膜裝置,其包括:一鍍膜工作室;一運載裝置,所述之運載裝置包括一傳輸裝置、一固定架及至少一承載軸,該傳輸裝置設置於該工作室之底部,並可沿該工作室之底部之延伸方向做線性運動,該固定架設置於該傳輸裝置上,並由該傳輸裝置帶動沿該鍍膜工作室之底部之延伸方向做線性運動,該至少一承載軸設置於該固定架之上,且用於承載工件,且帶動該工件繞其旋轉;以及至少一靶材,其設置於所述之鍍膜工作室內,用於對該工件進行鍍膜。 A sputter coating apparatus comprising: a coating working chamber; a carrying device, the carrying device comprising a conveying device, a fixing frame and at least one carrying shaft, the conveying device is disposed at the bottom of the working chamber, and The linear movement can be performed along the extending direction of the bottom of the working chamber. The fixing frame is disposed on the conveying device, and the transmission device drives the linear movement along the extending direction of the bottom of the coating working chamber. The at least one bearing shaft is disposed. On the mounting frame, and for carrying the workpiece, and driving the workpiece to rotate around; and at least one target disposed in the coating working chamber for coating the workpiece. 如申請專利範圍第1項所述之濺鍍式鍍膜裝置,其中,該運載裝置進一步包括一輔助單元,該輔助裝置耦接該至少一承載軸,使該至少一承載軸繞其中心軸旋轉。 The sputter coating apparatus of claim 1, wherein the carrier further comprises an auxiliary unit coupled to the at least one carrying shaft to rotate the at least one carrying shaft about its central axis. 如申請專利範圍第2項所述之濺鍍式鍍膜裝置,其中,該至少一承載軸一端具有一齒輪,該一輔助單元包含至少一板件,其具有一鋸齒面,該鋸齒面與該至少一承載軸一端之齒輪機械嚙合,當該至少一板件相對於該固定架移動,使該至少一承載軸可繞其中心軸旋轉。 The sputter coating apparatus of claim 2, wherein the at least one load bearing shaft has a gear at one end, the auxiliary unit comprises at least one plate member having a sawtooth surface, the at least one tooth surface and the at least one sawtooth surface A gear at one end of the load bearing shaft mechanically engages, and when the at least one plate member moves relative to the fixed frame, the at least one load bearing shaft is rotatable about its central axis. 如申請專利範圍第1項所述之濺鍍式鍍膜裝置,其中,該傳輸裝置為傳輸帶。 The sputter coating apparatus according to claim 1, wherein the transport device is a transport belt. 如申請專利範圍第1項所述之濺鍍式鍍膜裝置,其中,該濺鍍式鍍膜裝置進一步包括一清洗室,該清洗室與該鍍膜工作室相鄰設置,用於收容並清洗該工件。 The sputter coating apparatus according to claim 1, wherein the sputter coating apparatus further comprises a cleaning chamber disposed adjacent to the coating working chamber for accommodating and cleaning the workpiece. 如申請專利範圍第5項所述之濺鍍式鍍膜裝置,其中,該濺鍍式鍍膜裝置進一步包括一加熱室,該加熱室與該清洗室相鄰設置,用於收容並對該 工件進行乾燥。 The sputter coating apparatus of claim 5, wherein the sputter coating apparatus further comprises a heating chamber disposed adjacent to the cleaning chamber for receiving and The workpiece is dried. 如申請專利範圍第6項所述之濺鍍式鍍膜裝置,其中,該濺鍍式鍍膜裝置進一步包括一裝載室及一卸載室,該裝載室與該加熱室相鄰設置,該卸載室與該鍍膜工作室相鄰設置,該裝載室用於收容待鍍膜之工件,該卸載室用於收容已鍍膜之工件。 The sputter coating apparatus of claim 6, wherein the sputter coating apparatus further comprises a loading chamber and an unloading chamber, the loading chamber being disposed adjacent to the heating chamber, the unloading chamber and the The coating chambers are disposed adjacent to each other, and the loading chamber is for receiving a workpiece to be coated, and the unloading chamber is for accommodating the coated workpiece. 如申請專利範圍第7項所述之濺鍍式鍍膜裝置,其中,該濺鍍式鍍膜裝置進一步包括一抽真空裝置,該抽真空裝置通過一抽氣管分別與該裝載室、該加熱室、該清洗室、該鍍膜工作室及該卸載室相連通,以分別獨立地對該裝載室、加熱室、清洗室、鍍膜工作室及卸載室抽真空。 The sputter coating apparatus of claim 7, wherein the sputter coating apparatus further comprises a vacuuming device, the vacuuming device is respectively connected to the loading chamber, the heating chamber, and the The cleaning chamber, the coating working chamber, and the unloading chamber are in communication to independently evacuate the loading chamber, the heating chamber, the cleaning chamber, the coating working chamber, and the unloading chamber. 如申請專利範圍第1項所述之濺鍍式鍍膜裝置,其中,該濺鍍式鍍膜裝置進一步包括設置於該工作室內之至少一靶電極,該每一靶電極分別對應裝載每一靶材。 The sputter coating apparatus according to claim 1, wherein the sputter coating apparatus further comprises at least one target electrode disposed in the working chamber, wherein each of the target electrodes respectively loads each target. 一種濺鍍式鍍膜方法,其包括以下步驟:(1)提供一種如申請專利範圍第1項所述之濺鍍式鍍膜裝置;(2)所述之至少一承載軸上套設至少一工件,該傳輸裝置帶動該至少一承載軸沿接近於該至少一靶材之方向作線性運動,且該至少一承載軸繞其中心軸旋轉;(3)轟擊所述之至少一靶材對該至少一工件進行鍍膜。 A sputter coating method comprising the steps of: (1) providing a sputter coating apparatus according to claim 1; (2) at least one workpiece on the at least one load bearing shaft; The transport device drives the at least one load bearing shaft to move linearly in a direction close to the at least one target, and the at least one load bearing shaft rotates about the central axis thereof; and (3) bombard the at least one target material to the at least one The workpiece is coated.
TW96135468A 2007-09-21 2007-09-21 Aparatus and method of sputtering deposition TWI399448B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05230652A (en) * 1991-01-30 1993-09-07 Shibaura Eng Works Co Ltd Sputtering device
TW524872B (en) * 1999-06-01 2003-03-21 Anelva Corp Sputtering film formation device and process of sputtering film formation
TW200637926A (en) * 2005-04-22 2006-11-01 Hon Hai Prec Ind Co Ltd An optics deposition apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05230652A (en) * 1991-01-30 1993-09-07 Shibaura Eng Works Co Ltd Sputtering device
TW524872B (en) * 1999-06-01 2003-03-21 Anelva Corp Sputtering film formation device and process of sputtering film formation
TW200637926A (en) * 2005-04-22 2006-11-01 Hon Hai Prec Ind Co Ltd An optics deposition apparatus

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