KR102517747B1 - Rotating Thermal Evaporation Diffusion Deposition System for PCB - Google Patents

Abstract

The present invention relates to a rotating thermal evaporation diffusion deposition system for a PCB substrate. More specifically, a door (20) rotates in the front of a chamber body (10), and an inner vacuum chamber is closed. A jig on which a PCB substrate is mounted is axially installed at an equiangular position on the circumference of a rotating body of a substrate mounting unit installed on the inner side of the door. So, when the door is closed, the rotating body rotates by a rotating unit (40). Also, each jig of the rotating body revolves. A heat evaporation and diffusion unit (50) vertically installed at the center of the substrate mounting unit evaporates and diffuses a membrane material by thermal energy transmitted to the membrane material to uniformly deposit a membrane on the PCB substrate mounted on the jig. Accordingly, the rotating thermal evaporation diffusion deposition system for a PCB substrate can largely improve workability, productivity, and deposition quality.

Description

Rotating Thermal Evaporation Diffusion Deposition System for PCB}

The present invention relates to a rotary thermal evaporation diffusion deposition apparatus for a PCB substrate, and more particularly, deposits a film by thermal evaporation and diffusion of a film formation material while rotating and rotating a plurality of jigs equipped with a PCB substrate in a vacuum chamber inside a chamber. However, it relates to a rotary thermal evaporation diffusion deposition apparatus dedicated to a PCB substrate to deposit a uniform film on a plurality of PCB substrates.

In general, various methods are known for thin film manufacturing, which can be largely divided into physical vapor deposition (hereinafter referred to as PVD) and chemical vapor deposition.

Representative deposition methods of the physical method include a PLD deposition method (Pulsed Laser Deposition), a sputtering deposition method, and an evaporation deposition method.

The PLD deposition method is a deposition method in which a high-energy laser is incident on a target to form instantaneous plasma and particles are emitted and deposited on a substrate, and the sputtering deposition method is a deposition method in which atoms of an inert gas are ionized and accelerated by an electric field, It is a deposition method in which the material of the target is detached by collision and momentum exchange and then incident on the substrate for deposition. The evaporation deposition method generates vapor from a liquid or solid by applying heat and deposits the generated vapor on the substrate. am.

Among the above deposition methods, a sputtering deposition method or an evaporation deposition method in which a copper foil is coated on a substrate by a dry method is widely applied to manufacturing a PCB substrate. These are mainly tailless methods for completing the electrolytic finish process of additionally coating metal on a copper foil circuit or pad without a seed layer or lead line.

Although the deposition rate per unit area is small, the sputtering deposition method is advantageous for industrialization because it can cover a large area. Since a large number of facilities must be equipped in the manufacturing environment, there was a disadvantage in that the initial investment cost was high.

For this reason, there is an increasing number of studies to use the evaporation method for mass production of PCB substrates in the above PCB manufacturing environment, but there is no dedicated facility for PCB substrates, so the development of evaporation facilities for excellent use exclusively for PCB substrates is urgently needed. is in demand.

Registered Patent No. 10-1440911 (September 5, 2014) Registered Patent No. 10-1128739 (March 14, 2012) Registered Patent No. 10-0579866 (May 8, 2006)

The present invention was invented to solve the various problems of the prior art, and deposits a film by thermal evaporation and diffusion of a film formation material while rotating and rotating a plurality of jigs equipped with a PCB substrate in a vacuum chamber inside the chamber. Its purpose is to provide excellent workability, productivity improvement and deposition quality by depositing a uniform film on the PCB substrate.

The purpose of the present invention is to further maximize workability and productivity by enabling deposition work while continuously supplying a jig in which a PCB substrate is mounted to a vacuum chamber inside the chamber, as well as enabling simple mounting and separation of a PCB substrate on the jig. there is.

The present invention relates to a chamber body forming a vacuum chamber therein, a door connected to the front of the chamber body by hinges to close the chamber body by rotation, and a shaft installed vertically inside the door to center the vacuum chamber when the door is closed. A substrate mounting means for mounting a PCB board on the jig by installing a plurality of jigs rotatable by the upper and lower shafts in a circumferential equiangular position between the upper and lower plates of the rotating body rotatably supported on the center bar, and , Rotation driving means for driving the rotation of the rotating body and rotation of the jig, and thermal evaporation and diffusion means installed vertically at the center of the rotating body to deposit a film on the PCB substrate by thermal evaporation and diffusion of the film forming material. It has a characteristic.

According to the present invention, the door is composed of a plurality of left and right doors, and the left and right doors are connected to the left and right front sides of the chamber body by hinges to face each other, so that the left and right doors are alternately opened and closed to the chamber body.

According to the present invention, the substrate mounting means installs at least three or more jigs in a circumferential equiangular position between the upper plate and the lower plate of the rotating body, and each jig is in the form of a plate and adheres the PCB board to the front and rear surfaces to clamp. Its feature is that it is configured to be fixed by

According to the present invention, the rotation driving means is installed so that the ring gear forming gears on the inner and outer periphery of the lower part of the substrate mounting means and the driving gear driven by the driving motor to one side of the lower part of the chamber body are engaged and interlocked when the door is closed. However, the ring gear and the revolving gear coupled to the lower plate of the rotating body are meshed with the upper and lower interlocking gears to revolve the rotating body, and the rotating gear coupled to the lower part of the jig along the outer circumference of the revolving gear is meshed with each jig Its feature is that it is configured to rotate.

According to the present invention, the rotation gear forms a polygonal shaft hole in the upper center, and the lower end of the lower shaft of the jig is formed as a polygonal shaft corresponding to the polygonal shaft hole, and the polygonal shaft of the lower shaft is inserted into the polygonal shaft hole of the rotation gear. Its feature is that it is assembled and configured so that the jig and the rotation gear interlock.

According to the present invention, the thermal evaporation diffusion means includes at least one pair of electrode bars vertically installed at a through hole in the center of the rotating body, left and right connection ports connected by clamps along the longitudinal direction of the electrode bars, and the electrode bars. It is composed of a heating port connecting the left and right connection ports of each other, and a film formation material installed in the heating port, so that when the door is closed, power is applied to the heating port so that the film formation material is thermally evaporated and diffused while heat energy is applied to the heating port. there is.

According to the present invention, the heating port is formed in the form of a coil, and the film formation material is inserted into the coil, and the straight portions at both ends of the heating port are pressurized and fixed by fastening bolts while being inserted into the insertion holes of the left and right connection ports. Its composition has its own characteristics.

The present invention closes the internal vacuum chamber by rotating the door in front of the chamber body, and rotates when the door is closed by installing a jig on which the PCB substrate is mounted on the circumference of the rotating body of the substrate mounting means installed inside the door in an equiangular position. Each jig of the rotating body is rotated while the rotating body is revolved by the driving means, and the film-forming material is formed by thermal energy transmitted to the film-forming material from the thermal evaporation diffusion means installed vertically at the center of the substrate mounting means. By evaporating and diffusing, the film is uniformly deposited on the PCB substrate mounted on the jig, so it has the effect of significantly improving the deposition quality as well as improving workability and productivity.

In particular, a plurality of left and right doors are provided in front of the chamber body, and while the left and right doors are alternately closed to the chamber body, substrate mounting means installed inside the left and right doors are continuously supplied to continuously perform the deposition of the PCB substrate, as well as the above. Since the PCB board is simply mounted and separated from the jig of the board mounting means, workability and productivity are further greatly improved.

In addition, the present invention requires a small installation area and provides simple maintenance by operating a single vacuum chamber, and the size of the jig or the number of jig installations can be changed according to the size of the vacuum chamber or the size of the PCB board. Efficiency is also to have an excellent effect.

1 is a plan configuration diagram showing a deposition apparatus of the present invention.
2 is a plan configuration diagram showing a door closed state of FIG. 1;
Figure 3 is a front view showing a substrate mounting means of the present invention.
Figure 4 is a plan view of the main part of Figure 3;
Figure 5 is a perspective view showing the jig of the present invention.
Figure 6 is a perspective view showing the main part of the thermal evaporation diffusion means of the present invention.
Figure 7 is a perspective view showing the main part of the rotary driving means of the present invention.
Fig. 8 is a plan configuration diagram of Fig. 7;
9 is a plan view of main parts showing the orbital and rotational operation states of the substrate mounting means of the present invention.

Hereinafter, a preferred embodiment of the present invention described above will be described in detail with reference to the accompanying drawings.

As shown in FIGS. 1 to 8, the rotational thermal evaporation diffusion deposition apparatus for exclusive use of a PCB substrate according to the present invention includes a chamber body 10, a door 20, a substrate mounting means 30, a rotation driving means 40, and a heat It is composed of an evaporation diffusion means 50 to uniformly deposit a film on a plurality of PCB substrates 2 by thermal evaporation diffusion deposition using a film formation material.

The chamber body 10 forms a vacuum chamber 12 inside in the form of a furnace, and forms a front side open.

The door 20 is connected to the front of the chamber body 10 by a hinge and is configured to seal the vacuum chamber 12 inside the chamber body while closing the chamber body 10 by rotation.

At this time, the door 20 is composed of a plurality of left and right doors 20A and 20B, and the left and right doors 20A and 20B are connected to the left and right sides of the chamber body 10 to face each other with hinges, so that the left and right doors ( 20A) and (20B) are used to alternately close to the chamber body 10 while performing the deposition operation.

The substrate mounting means 30 is vertically installed on the inside of the door 20 so as to be positioned at the center of the vacuum chamber of the chamber body when the door is closed. At this time, in the case where the left and right doors 20A and 20B are configured as a plurality of doors, the board mounting means 30 are respectively installed inside the left and right doors.

The substrate mounting means 30 is configured by installing a rotation body 31 so as to be rotatably supported by a bearing on the center bar 33, and the rotation body 31 vertically connects the upper plate 31a and the lower plate 31b Connected by a connecting bar (not shown), and between the upper plate 31a and the lower plate 31b, a plurality of jigs 35 are rotatably rotatable by the upper and lower shaft portions 34 and 34' in a circumferential equiangular position. Configure the axis to be installed.

At this time, insertion holes into which the upper and lower shaft portions 34 and 34' of the jig are inserted are formed in the upper and lower plates 31a and 31b of the rotating body, respectively.

And the jigs 35 can be installed in at least 3 or more, that is, 4, 5, 6 or more numbers in an equal angular position on the same circumference of the rotating body 31, each jig 35 It is configured to be fixed by a clamp such as a clip by attaching the PCB board 2 to the front or front and rear surfaces in the form of a plate. In addition, one or two or more PCB boards 2 are installed vertically on the front or front and rear surfaces, but as shown in the drawing, six jigs 35 are installed on one board mounting means 30, and the front of the jig , In the case of installing the PCB board 2 vertically on the rear side, each jig can be equipped with 4 pieces, so that a total of 24 PCB boards 2 can be mounted at once.

The number of installation jigs or size of the jig 35 can be applied differently according to the increase or decrease in the size of the vacuum chamber or the increase or decrease in the size of the PCB substrate.

The rotation driving means 40 is driven by a ring gear 41 forming gears on the inner and outer periphery of the lower part of the substrate mounting means 30 and a drive gear 45 driven by a driving motor M to one side of the lower part of the chamber body. ) is configured to be engaged and interlocked when the door is closed, and the upper and lower interlocking gears 43 in which the inner circumferential gear of the ring gear 41 and the revolving gear 42 coupled to the lower part of the lower plate of the rotating body are connected on the same axis (43') to make the rotating body 31 revolve, and along the outer circumference of the revolving gear 42, the rotating gear 44 to which the lower part of the jig is coupled is meshed, so that each jig axially coupled to the rotating gear configure to rotate

At this time, the rotation gear 44 forms a polygonal shaft hole 44a in the upper center, and the lower end of the lower shaft portion 34' of the jig is formed as a polygonal shaft 34'a corresponding to the polygonal shaft hole, so that the lower shaft portion By inserting the polygonal shaft into the polygonal shaft hole 44a of the rotation gear, the jig is assembled so as to interlock with the rotation gear.

In addition, the ring gear 41 is rotatably supported and installed on the upper part of the lower pedestal 49, and the rotation gear 44 is rotatably installed on the upper part of the ring gear by a bearing and revolving together with the ring gear. It is configured to rotate by being geared to.

The thermal evaporation diffusion means 50 is installed vertically in the through hole 32 in the center of the rotating body to deposit a film on the PCB substrate 2 by thermal evaporation and diffusion of the film forming material.

The thermal evaporation diffusion means 50 is an electrode bar installed vertically facing at least one set of two at least one through hole 32 formed at the center of the upper plate 31a and lower plate 31b of the rotating body, two left and right sets in the drawing. (51) (51'), the left and right connection ports (53) (53') connected at regular intervals to the clamp (52) along the longitudinal direction of the electrode bar (51) (51'), and the electrode bar ( 51) It is composed of a heating port 54 connecting the left and right connection ports 53 and 53' of 51' to each other, and a film forming material 55 installed in the heating port.

At this time, the heating port 54 is formed in a coil shape or other shape using a tungsten wire having excellent thermal conductivity, and a film forming material is inserted into the coil or other shape. In addition, the straight parts 54a at both ends of the heating port are installed to be pressurized and fixed by fastening bolts 58 in a state of being inserted into the insertion holes 53a of the left and right connection ports 53 and 53'.

The heating port 54 is configured to thermally evaporate and diffuse the film forming material while applying thermal energy by applying power when the door is closed.

The film forming material 55 is made of copper (Cu), titanium (Ti), aluminum (Al), etc. It is to deposit a metal film of.

As an unexplained numeral, 31b indicates a horizontal connecting bar connecting and supporting the top plate of the rotating body.

Next, we will look at the operation and operation of the present invention configured as described above.

First, a plurality of PCB substrates 2 are prepared by mounting them on the substrate mounting means 30 inside the door 20 .

That is, the PCB board 2 is mounted on the jig 35 installed in an equiangular position on the circumference between the upper board 31a and the lower board 31b in the rotating body 31 of the board mounting means.

To explain this in more detail, when six jigs 35 are installed at equiangular positions on the circumference of the rotating body as shown in FIGS. It is to attach the two PCB boards 2 in close contact and fix the jig and the PCB board by clamps 39 such as clips at both ends to simply mount them.

In this way, a total of 24 PCB boards 2 are simultaneously mounted on one board mounting means 30 while mounting 4 PCB boards 2 on each jig 35 of the rotating body and a total of 6 jigs 35. let it do

In this way, after a total of 24 PCB substrates 2 are mounted on the substrate mounting means 30 and prepared, the door 20 is rotated by a hinge to close the chamber body 10, so that the vacuum chamber 5 inside is make it sealed

At this time, the substrate mounting means 30 inside the door 20 is located in the center of the vacuum chamber 5 .

In addition, the ring gear 41 under the substrate mounting means 30 is engaged with the drive gear 45 installed on one side of the lower side of the chamber body 10 .

In this prepared state, the thermal diffusion deposition operation begins.

First, the rotating body 31 of the substrate mounting means 30 is driven to revolve, and each jig 35 of the rotating body is driven to rotate.

As shown in FIGS. 7 and 8 , the driving gear 45 rotationally driven by the driving motor M is meshed with the ring gear 41 to rotate and drive the ring gear 41 .

Further, the rotational body 31 rotates around the thermal evaporation diffusion means 50 while rotating and driving the revolving gear 42 meshed with the upper and lower interlocking gears 43 and 43' to the ring gear 41. so that it is idling.

In this way, while the rotating body 31 revolves, the rotating gear 44 coupled to the lower end of the jig installed in the circumferential equiangular position between the upper plate 31a and the lower plate 31b of the rotating body is a revolving gear ( 42), each jig 2 rotates because the rotating gear 44 rotates.

At this time, the jig 35 inserts the upper and lower shaft portions 34 and 34' into the holes formed in the upper and lower plates 31a and 31b of the rotating body, and the polygonal shaft formed at the lower end of the lower shaft portion 34' ( 34'a) is inserted into the polygonal shaft hole 44a formed in correspondence with the upper center of the rotation gear 44, so that each jig 35 is rotated by the rotation of the rotation gear 44 as well as simple coupling use. .

In this way, while the rotation body 31 revolves around the thermal evaporation diffusion unit 50, the thermal evaporation diffusion unit 50 It is to perform the deposition operation of the PCB substrate by the thermal evaporation diffusion of the film formation material by the.

That is, when power is applied to the thermal evaporation diffusion means 50, the electrode bars 51, 51' and the electrode bars 51, 51' installed vertically are at least one set of at least two pairs through a power transformer. Through the left and right connection ports 53 and 53' connected to the clamp 52 along the length direction, thermal energy is applied to the heating port 54 connecting the left and right connection ports 53 and 53' of the adjacent electrode bar to each other. is transmitted, and for this reason, the film formation material 55 inserted into the heating port 54, that is, the heating port 54 formed in the form of a coil as shown in the drawing, is heated, and the film formation material is instantly vaporized and diffused, , which is diffused in all directions from the center of the rotating body (see FIG. 9).

In this way, the film forming material 55 is thermally evaporated and diffused from the center to all directions to uniformly deposit metal films of various materials such as copper (Cu), titanium (Ti), and aluminum (Al) on the surface of the PCB substrate 2. will be.

In particular, since the rotation of the rotating body 31 and the six jigs 30 installed in equiangular positions on the circumference of the rotating body rotate, the film-forming material that is thermally evaporated and diffused in all directions from the center of the rotating body The film can be uniformly deposited on a total of 24 PCB substrates 2 mounted on the jig.

In this way, when the film deposition of the PCB substrate is completed, the door 20 is rotated and opened in the chamber body 10 to separate the coated PCB substrate 2 from the substrate mounting means in the reverse order of the above-described mounting process. will be.

On the other hand, in the present invention, although the door 20 may be configured alone in the front of the chamber body 10, as shown in FIGS. 1 and 2, a plurality of left and right doors 20A and 20B are formed on both sides of the front to form the left and right doors ( While using 20A) (20B) to alternately close the chamber body 10, it is possible to continuously perform film deposition on the PCB substrate mounted on the substrate mounting means 30 installed inside the left and right doors, respectively.

At this time, during the process of depositing the PCB substrate mounted on the substrate mounting unit 30 inside the one door 20A, the left and right doors are alternately mounted while the PCB substrate is mounted on the substrate mounting unit 30 inside the other door 20B. It is to continuously perform the film deposition work on the PCB substrate by using it as a

In addition, in the present invention, the thermal evaporation diffusion means 50 forms the heating port 54 in a coil shape and simply inserts and mounts the film forming material 55, and the heating port is connected to the left and right connecting ports 53 and 53' ) is simply connected to, installed and used. The straight parts 54a at both ends of the heating port are inserted into the insertion holes 53a of the left and right connection ports 53 and 53', and fastened and fixed by fastening bolts 58. So, it is easy to install and use.

Therefore, the present invention closes the vacuum chamber 12 inside by rotating the door 20 in front of the chamber body 10, but the rotating body of the substrate mounting means installed inside the door 20 to be located in the center of the vacuum chamber. (31) Install the jig 35 on which the PCB board is mounted on the circumference at an equiangular position so that the rotational body is revolved by the rotation drive means 40 and each jig of the rotational body is rotated, In the thermal evaporation diffusion means 50 installed vertically in the center of the substrate mounting means, the film formation material is evaporated and diffused by the thermal energy transmitted to the film formation material, so that the film is uniformly deposited on the plurality of PCB substrates mounted on the jig.

On the other hand, the thermal evaporation diffusion deposition apparatus of the present invention has been described mainly in technology of depositing a film on the surface of a PCB substrate by thermal evaporation and diffusion of a film formation material, but film formation on a flat plate of various materials that can be mounted on a jig similar to a PCB substrate in addition to the PCB substrate. It should be noted that not only can it be used to deposit a film by thermal evaporation diffusion of the material, but also the degree of change in such a simple use is within the scope of the present invention.

10: chamber body 12: vacuum chamber
20: door 20A, 20B: left and right doors
30: substrate mounting means 31: rotating body
31a: upper plate 31b: lower plate
32: through hole 33: center bar
34,34': upper and lower shaft portion 34'a: polygonal shaft
35: jig 40: rotation drive means
41: ring gear 42: idle gear
43: interlocking gear 44: rotating gear
44a: polygonal shaft hole 50: thermal evaporation diffusion means
51,51': electrode bar 53,53': left and right connection ports
54: heating port 55: film formation material

Claims (7)

A chamber body 10 forming a vacuum chamber 12 therein, a door 20 connected to and installed in front of the chamber body by hinges to close the chamber body by rotation, and a door 20 installed vertically on the inside of the door When it is closed, it is located in the center of the vacuum chamber, but the upper and lower shafts 34 and 34 are placed in an equiangular position on the circumference between the upper plate 31a and the lower plate 31b of the rotating body 31 rotatably supported by the center bar 33. A substrate mounting means 30 for mounting a PCB substrate 2 on the jig 35 by installing a plurality of jigs 35 rotatable by '), and the revolution of the rotating body 31 and the jig ( 35) is composed of a rotation driving means 40 for driving the rotation, and a thermal evaporation diffusion means 50 installed vertically at the center of the rotating body to deposit a film on the PCB substrate 2 by thermal evaporation and diffusion of film formation materials. do,
The rotation driving means 40 is driven by a ring gear 41 forming gears on the inner and outer periphery of the lower part of the substrate mounting means 30 and a drive gear 45 driven by a driving motor M to one side of the lower part of the chamber body. ) is configured to be engaged and interlocked when the door is closed, but the ring gear 41 and the revolving gear 42 coupled to the lower plate of the rotating body mesh with the upper and lower interlocking gears 43 and 43' to rotate the body Rotating type thermal evaporation diffusion deposition apparatus for a PCB substrate, characterized in that each jig is configured to rotate by revolving the revolving gear 42 and engaging the rotating gear 44 to which the lower portion of the jig is coupled along the outer circumference of the revolving gear 42 .
According to claim 1,
The door 20 is composed of a plurality of left and right doors 20A and 20B, and the left and right doors 20A and 20B are connected to the left and right sides of the chamber body 10 oppositely by hinges to form a left and right door 20A. Rotating thermal evaporation diffusion deposition apparatus for a PCB substrate, characterized in that (20B) is configured to alternately open and close the chamber body (10).
According to claim 1 or 2,
The substrate mounting means 30 installs at least three or more jigs 35 between the upper plate 31a and the lower plate 31b of the rotating body in an equiangular position on a circumference, and each jig 35 rotates in a plate shape. , Rotational thermal evaporation diffusion deposition apparatus for a PCB substrate, characterized in that the PCB substrate (2) is closely attached to the rear surface and configured to be fixed by a clamp.
According to claim 1,
The rotation gear 44 forms a polygonal shaft hole 44a at the upper center, and the lower end of the lower shaft portion 34' of the jig forms a polygonal shaft 34'a corresponding to the polygonal shaft hole to form a polygonal shaft of the lower shaft portion. A rotational thermal evaporation diffusion deposition apparatus for a PCB substrate, characterized in that it is assembled so that the jig and the rotation gear interlock by being inserted into the polygonal shaft hole (44a) of the rotation gear.
A chamber body 10 forming a vacuum chamber 12 therein, a door 20 connected to and installed in front of the chamber body by hinges to close the chamber body by rotation, and a door 20 installed vertically on the inside of the door When it is closed, it is located in the center of the vacuum chamber, but the upper and lower shafts 34 and 34 are placed in an equiangular position on the circumference between the upper plate 31a and the lower plate 31b of the rotating body 31 rotatably supported by the center bar 33. A substrate mounting means 30 for mounting a PCB substrate 2 on the jig 35 by installing a plurality of jigs 35 rotatable by '), and the revolution of the rotating body 31 and the jig ( 35) is composed of a rotation driving means 40 for driving the rotation, and a thermal evaporation diffusion means 50 installed vertically at the center of the rotating body to deposit a film on the PCB substrate 2 by thermal evaporation and diffusion of film formation materials. do,
The thermal evaporation diffusion means 50 includes at least one pair of electrode bars 51 and 51' installed vertically at the through hole 32 in the center of the rotating body 31, and the electrode bars 51 and 51 The left and right connection ports 53 and 53' connected to the clamp 52 along the length direction of ') and the left and right connection ports 53 and 53' of the electrode bars 51 and 51' are connected to each other. It is composed of a heating port 54 and a film formation material 55 installed in the heating port, so that when the door is closed, thermal energy is applied to the heating port by applying power to evaporate and diffuse the film formation material. Rotational thermal evaporation diffusion deposition equipment for PCB substrates.
According to claim 5,
The heating port 54 is formed in a coil shape, and the film forming material 55 is inserted into the coil, and the straight portions 54a at both ends of the heating port are insertion holes of the left and right connection ports 53 and 53'. It is configured to be pressurized and fixed by fastening the bolt 58 in the state inserted in (53a),
The rotation driving means 40 is driven by a ring gear 41 forming gears on the inner and outer periphery of the lower part of the substrate mounting means 30 and a drive gear 45 driven by a driving motor M to one side of the lower part of the chamber body. ) is configured to be engaged and interlocked when the door is closed, but the ring gear 41 and the revolving gear 42 coupled to the lower plate of the rotating body mesh with the upper and lower interlocking gears 43 and 43' to rotate the body Rotating type thermal evaporation diffusion deposition apparatus for a PCB substrate, characterized in that each jig is configured to rotate by revolving the revolving gear 42 and engaging the rotating gear 44 to which the lower portion of the jig is coupled along the outer circumference of the revolving gear 42 .
According to claim 5,
The door 20 is composed of a plurality of left and right doors 20A and 20B, and the left and right doors 20A and 20B are connected to the left and right sides of the chamber body 10 oppositely by hinges to form a left and right door 20A. Rotating thermal evaporation diffusion deposition apparatus for a PCB substrate, characterized in that (20B) is configured to alternately open and close the chamber body (10).

Images