CN100348773C - 用于向一种基片涂敷涂料的真空模块和模块系统 - Google Patents
用于向一种基片涂敷涂料的真空模块和模块系统 Download PDFInfo
- Publication number
- CN100348773C CN100348773C CNB018121780A CN01812178A CN100348773C CN 100348773 C CN100348773 C CN 100348773C CN B018121780 A CNB018121780 A CN B018121780A CN 01812178 A CN01812178 A CN 01812178A CN 100348773 C CN100348773 C CN 100348773C
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- China
- Prior art keywords
- substrate
- module
- opening
- vacuum chamber
- vacuum
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 238000007789 sealing Methods 0.000 claims abstract description 36
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 238000000151 deposition Methods 0.000 claims abstract description 27
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- 238000011282 treatment Methods 0.000 claims description 68
- 230000033001 locomotion Effects 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 20
- 238000004544 sputter deposition Methods 0.000 claims description 13
- 238000004140 cleaning Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000006200 vaporizer Substances 0.000 claims description 4
- 239000010409 thin film Substances 0.000 abstract description 5
- 238000001771 vacuum deposition Methods 0.000 abstract description 3
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- 239000011248 coating agent Substances 0.000 description 19
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- 238000009792 diffusion process Methods 0.000 description 11
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- 238000010168 coupling process Methods 0.000 description 8
- 238000005859 coupling reaction Methods 0.000 description 8
- 239000007888 film coating Substances 0.000 description 8
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- 239000002184 metal Substances 0.000 description 7
- 238000005086 pumping Methods 0.000 description 7
- 101100112085 Arabidopsis thaliana CRT3 gene Proteins 0.000 description 6
- 101100141330 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) RNR4 gene Proteins 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 5
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- 239000000203 mixture Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
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- VVTSZOCINPYFDP-UHFFFAOYSA-N [O].[Ar] Chemical compound [O].[Ar] VVTSZOCINPYFDP-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
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- 238000005520 cutting process Methods 0.000 description 2
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- 239000012535 impurity Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000069 prophylactic effect Effects 0.000 description 2
- IWZSHWBGHQBIML-ZGGLMWTQSA-N (3S,8S,10R,13S,14S,17S)-17-isoquinolin-7-yl-N,N,10,13-tetramethyl-2,3,4,7,8,9,11,12,14,15,16,17-dodecahydro-1H-cyclopenta[a]phenanthren-3-amine Chemical compound CN(C)[C@H]1CC[C@]2(C)C3CC[C@@]4(C)[C@@H](CC[C@@H]4c4ccc5ccncc5c4)[C@@H]3CC=C2C1 IWZSHWBGHQBIML-ZGGLMWTQSA-N 0.000 description 1
- 244000287680 Garcinia dulcis Species 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
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- 238000001816 cooling Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011221 initial treatment Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- 239000010453 quartz Substances 0.000 description 1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/46—Machines having sequentially arranged operating stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2209/00—Apparatus and processes for manufacture of discharge tubes
- H01J2209/01—Generalised techniques
- H01J2209/012—Coating
- H01J2209/015—Machines therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EA200000807 | 2000-07-05 | ||
| EA200000807A EA003148B1 (ru) | 2000-07-05 | 2000-07-05 | Вакуумный модуль (его варианты) и система модулей для нанесения покрытий на подложку |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1617947A CN1617947A (zh) | 2005-05-18 |
| CN100348773C true CN100348773C (zh) | 2007-11-14 |
Family
ID=8161557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB018121780A Expired - Fee Related CN100348773C (zh) | 2000-07-05 | 2001-05-22 | 用于向一种基片涂敷涂料的真空模块和模块系统 |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP4766821B2 (enExample) |
| KR (1) | KR100737035B1 (enExample) |
| CN (1) | CN100348773C (enExample) |
| AU (1) | AU6896001A (enExample) |
| EA (1) | EA003148B1 (enExample) |
| MY (1) | MY137307A (enExample) |
| WO (1) | WO2002008484A2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100914087B1 (ko) | 2003-05-13 | 2009-08-27 | 어플라이드 머티어리얼스, 인코포레이티드 | 처리 챔버의 개구를 밀봉하기 위한 방법 및 장치 |
| EA200501183A1 (ru) * | 2005-07-18 | 2006-12-29 | Владимир Яковлевич ШИРИПОВ | Вакуумный кластер для нанесения покрытий на подложку (варианты) |
| EA009303B1 (ru) * | 2006-05-15 | 2007-12-28 | Владимир Яковлевич ШИРИПОВ | Способ нанесения пленок нитрида кремния в вакууме (варианты) |
| EA034967B1 (ru) | 2018-05-04 | 2020-04-13 | Общество С Ограниченной Ответственностью "Изовак Технологии" | Технологическая линия для формирования тонкопленочных покрытий в вакууме (варианты) |
| CN110592550A (zh) * | 2019-10-28 | 2019-12-20 | 上海映晓电子科技有限公司 | 一种磁控溅射和电子束蒸镀双腔镀膜装置及其使用方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2008156A (en) * | 1977-11-19 | 1979-05-31 | Hunt C J L | Vacuum Metallising Hollow Bodies |
| US5489369A (en) * | 1993-10-25 | 1996-02-06 | Viratec Thin Films, Inc. | Method and apparatus for thin film coating an article |
| WO1997039160A1 (en) * | 1996-04-18 | 1997-10-23 | Kabushiki Kaisha Toshiba | Method of producing a cathode-ray tube and apparatus therefor |
-
2000
- 2000-07-05 EA EA200000807A patent/EA003148B1/ru not_active IP Right Cessation
-
2001
- 2001-05-22 KR KR1020037000087A patent/KR100737035B1/ko not_active Expired - Fee Related
- 2001-05-22 AU AU6896001A patent/AU6896001A/xx active Pending
- 2001-05-22 CN CNB018121780A patent/CN100348773C/zh not_active Expired - Fee Related
- 2001-05-22 JP JP2002513962A patent/JP4766821B2/ja not_active Expired - Fee Related
- 2001-05-22 WO PCT/EA2001/000002 patent/WO2002008484A2/en not_active Ceased
- 2001-07-03 MY MYPI20013177A patent/MY137307A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2008156A (en) * | 1977-11-19 | 1979-05-31 | Hunt C J L | Vacuum Metallising Hollow Bodies |
| US5489369A (en) * | 1993-10-25 | 1996-02-06 | Viratec Thin Films, Inc. | Method and apparatus for thin film coating an article |
| WO1997039160A1 (en) * | 1996-04-18 | 1997-10-23 | Kabushiki Kaisha Toshiba | Method of producing a cathode-ray tube and apparatus therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| EA003148B1 (ru) | 2003-02-27 |
| JP2004504495A (ja) | 2004-02-12 |
| WO2002008484A3 (en) | 2002-07-04 |
| KR20030024771A (ko) | 2003-03-26 |
| WO2002008484A2 (en) | 2002-01-31 |
| MY137307A (en) | 2009-01-30 |
| KR100737035B1 (ko) | 2007-07-09 |
| AU6896001A (en) | 2002-02-05 |
| JP4766821B2 (ja) | 2011-09-07 |
| EA200000807A1 (ru) | 2002-02-28 |
| CN1617947A (zh) | 2005-05-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071114 Termination date: 20160522 |