JP4752307B2 - 非接触型データキャリア用導電部材とその製造方法及び装置 - Google Patents

非接触型データキャリア用導電部材とその製造方法及び装置 Download PDF

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Publication number
JP4752307B2
JP4752307B2 JP2005106822A JP2005106822A JP4752307B2 JP 4752307 B2 JP4752307 B2 JP 4752307B2 JP 2005106822 A JP2005106822 A JP 2005106822A JP 2005106822 A JP2005106822 A JP 2005106822A JP 4752307 B2 JP4752307 B2 JP 4752307B2
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JP
Japan
Prior art keywords
punching
conductive layer
data carrier
substrate
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005106822A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006277700A (ja
Inventor
祐幾 中西
英人 坂田
昭彦 五十嵐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2005106822A priority Critical patent/JP4752307B2/ja
Priority to PCT/JP2005/007527 priority patent/WO2005107347A1/ja
Priority to US11/578,311 priority patent/US7930822B2/en
Priority to EP05734388A priority patent/EP1744607A4/en
Priority to CN2005800186423A priority patent/CN1985552B/zh
Priority to TW094113409A priority patent/TW200540026A/zh
Publication of JP2006277700A publication Critical patent/JP2006277700A/ja
Application granted granted Critical
Publication of JP4752307B2 publication Critical patent/JP4752307B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1054—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing and simultaneously bonding [e.g., cut-seaming]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
JP2005106822A 2004-04-28 2005-04-01 非接触型データキャリア用導電部材とその製造方法及び装置 Expired - Fee Related JP4752307B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005106822A JP4752307B2 (ja) 2004-04-28 2005-04-01 非接触型データキャリア用導電部材とその製造方法及び装置
PCT/JP2005/007527 WO2005107347A1 (ja) 2004-04-28 2005-04-20 非接触型データキャリア用導電部材とその製造方法及び装置
US11/578,311 US7930822B2 (en) 2004-04-28 2005-04-20 Method and device for manufacturing a conductive member for non-contact type data carrier
EP05734388A EP1744607A4 (en) 2004-04-28 2005-04-20 CONDUCTIVE MEMBER FOR NON-CONTACT DATA CARRIER AND METHOD AND DEVICE FOR MANUFACTURING THE SAME
CN2005800186423A CN1985552B (zh) 2004-04-28 2005-04-20 用于非接触型数据载体的导电元件及其制造方法和装置
TW094113409A TW200540026A (en) 2004-04-28 2005-04-27 Conductive member for non-contact data carrier and manufacturing method and device thereof

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004134659 2004-04-28
JP2004134659 2004-04-28
JP2005058239 2005-03-02
JP2005058239 2005-03-02
JP2005106822A JP4752307B2 (ja) 2004-04-28 2005-04-01 非接触型データキャリア用導電部材とその製造方法及び装置

Publications (2)

Publication Number Publication Date
JP2006277700A JP2006277700A (ja) 2006-10-12
JP4752307B2 true JP4752307B2 (ja) 2011-08-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005106822A Expired - Fee Related JP4752307B2 (ja) 2004-04-28 2005-04-01 非接触型データキャリア用導電部材とその製造方法及び装置

Country Status (6)

Country Link
US (1) US7930822B2 (https=)
EP (1) EP1744607A4 (https=)
JP (1) JP4752307B2 (https=)
CN (1) CN1985552B (https=)
TW (1) TW200540026A (https=)
WO (1) WO2005107347A1 (https=)

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JP4779556B2 (ja) * 2005-10-07 2011-09-28 大日本印刷株式会社 非接触型データキャリア用導電部材の製造方法及び装置
JP2008015969A (ja) * 2006-07-10 2008-01-24 Dainippon Printing Co Ltd 非接触型データキャリア用導電部材の製造方法及び装置
JP5169832B2 (ja) * 2006-11-01 2013-03-27 大日本印刷株式会社 非接触ｉｃタグラベルとその製造方法
JP5083091B2 (ja) * 2008-07-24 2012-11-28 大日本印刷株式会社 非接触型データキャリア用導電部材の形成方法及び装置
TWI439945B (zh) * 2008-11-14 2014-06-01 凸版印刷股份有限公司 非接觸型ic標籤及物品
TWI593322B (zh) 2010-11-19 2017-07-21 帝斯曼知識產權資產管理有限公司 金屬箔圖案積層體、金屬箔之模切方法、電路基板及其製造方法、以及太陽能電池模組
EP3300125B1 (en) * 2011-06-06 2020-01-15 DSM IP Assets B.V. Metal foil, patterned-laminate and a solar cell module
EP2739464B1 (en) 2011-08-03 2017-11-29 Graphic Packaging International, Inc. Systems and methods for forming laminates with patterned microwave energy interactive material
DE102012209328A1 (de) * 2012-06-01 2013-12-05 3D-Micromac Ag Verfahren und Anlage zum Herstellen eines Mehrschichtelements sowie Mehrschichtelement
US9380709B2 (en) * 2013-03-15 2016-06-28 Taiwan Semiconductor Manufacturing Co., Ltd. Method of cutting conductive patterns
JP6290385B2 (ja) 2013-09-26 2018-03-07 グラフィック パッケージング インターナショナル インコーポレイテッドＧｒａｐｈｉｃ Ｐａｃｋａｇｉｎｇ Ｉｎｔｅｒｎａｔｉｏｎａｌ，Ｉｎｃ． 積層体並びに積層を行うシステム及び方法
JP6379667B2 (ja) * 2014-05-21 2018-08-29 Tdk株式会社 アンテナ装置及びその製造方法
JP2017535946A (ja) * 2014-11-05 2017-11-30 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 製品基板をコーティングするための方法と装置
MX384916B (es) 2014-12-22 2025-03-14 Graphic Packaging Int Llc Sistemas y métodos para formar laminados.
EP4071668B1 (en) * 2016-03-18 2024-04-03 Sato Holdings Kabushiki Kaisha Method for manufacturing rfid inlet
CN107482302A (zh) * 2017-07-01 2017-12-15 华中科技大学 一种rfid天线制作方法
CN108566732B (zh) * 2018-05-14 2020-09-01 龙南骏亚柔性智能科技有限公司 一种柔性pcb电子器件褶皱制备结构
WO2020141331A1 (en) * 2019-01-04 2020-07-09 Sherkin Technologies Uk Ltd Improvements in or relating to flexible electronics
US10709022B1 (en) 2019-04-19 2020-07-07 Gentherm Incorporated Milling of flex foil with two conductive layers from both sides
CN112589913A (zh) * 2021-03-05 2021-04-02 赛柯赛斯新能源科技(苏州)有限公司 柔性电路板圆刀裁切工艺及其加工装置
CN117048173A (zh) * 2023-08-28 2023-11-14 晶科能源股份有限公司 层压机及层压机的层压方法
CN118514411A (zh) * 2024-04-19 2024-08-20 隆基绿能科技股份有限公司 一种光伏背板加工设备及方法

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Also Published As

Publication number Publication date
EP1744607A1 (en) 2007-01-17
US20070214637A1 (en) 2007-09-20
CN1985552B (zh) 2012-09-05
CN1985552A (zh) 2007-06-20
WO2005107347A1 (ja) 2005-11-10
TWI351354B (https=) 2011-11-01
JP2006277700A (ja) 2006-10-12
TW200540026A (en) 2005-12-16
US7930822B2 (en) 2011-04-26
EP1744607A4 (en) 2010-10-27

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