TW200540026A - Conductive member for non-contact data carrier and manufacturing method and device thereof - Google Patents
Conductive member for non-contact data carrier and manufacturing method and device thereof Download PDFInfo
- Publication number
- TW200540026A TW200540026A TW094113409A TW94113409A TW200540026A TW 200540026 A TW200540026 A TW 200540026A TW 094113409 A TW094113409 A TW 094113409A TW 94113409 A TW94113409 A TW 94113409A TW 200540026 A TW200540026 A TW 200540026A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive layer
- substrate
- data carrier
- manufacturing
- layer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 173
- 239000010410 layer Substances 0.000 claims abstract description 353
- 238000004080 punching Methods 0.000 claims abstract description 153
- 239000012790 adhesive layer Substances 0.000 claims abstract description 145
- 238000000034 method Methods 0.000 claims abstract description 73
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 238000000926 separation method Methods 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims description 221
- 229920001169 thermoplastic Polymers 0.000 claims description 96
- 239000004416 thermosoftening plastic Substances 0.000 claims description 96
- 239000011888 foil Substances 0.000 claims description 86
- 239000000463 material Substances 0.000 claims description 77
- 239000000853 adhesive Substances 0.000 claims description 66
- 230000001070 adhesive effect Effects 0.000 claims description 66
- 238000012545 processing Methods 0.000 claims description 64
- 239000013589 supplement Substances 0.000 claims description 57
- 238000003825 pressing Methods 0.000 claims description 33
- 239000011241 protective layer Substances 0.000 claims description 27
- 238000007731 hot pressing Methods 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims 1
- 238000007639 printing Methods 0.000 abstract description 15
- 239000002994 raw material Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 82
- 239000002184 metal Substances 0.000 description 82
- 238000012546 transfer Methods 0.000 description 20
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000007599 discharging Methods 0.000 description 5
- 239000013013 elastic material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 208000027418 Wounds and injury Diseases 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229920006015 heat resistant resin Polymers 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 208000014674 injury Diseases 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 241000272168 Laridae Species 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1054—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing and simultaneously bonding [e.g., cut-seaming]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004134659 | 2004-04-28 | ||
| JP2005058239 | 2005-03-02 | ||
| JP2005106822A JP4752307B2 (ja) | 2004-04-28 | 2005-04-01 | 非接触型データキャリア用導電部材とその製造方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200540026A true TW200540026A (en) | 2005-12-16 |
| TWI351354B TWI351354B (https=) | 2011-11-01 |
Family
ID=35242084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094113409A TW200540026A (en) | 2004-04-28 | 2005-04-27 | Conductive member for non-contact data carrier and manufacturing method and device thereof |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7930822B2 (https=) |
| EP (1) | EP1744607A4 (https=) |
| JP (1) | JP4752307B2 (https=) |
| CN (1) | CN1985552B (https=) |
| TW (1) | TW200540026A (https=) |
| WO (1) | WO2005107347A1 (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4779556B2 (ja) * | 2005-10-07 | 2011-09-28 | 大日本印刷株式会社 | 非接触型データキャリア用導電部材の製造方法及び装置 |
| JP2008015969A (ja) * | 2006-07-10 | 2008-01-24 | Dainippon Printing Co Ltd | 非接触型データキャリア用導電部材の製造方法及び装置 |
| JP5169832B2 (ja) * | 2006-11-01 | 2013-03-27 | 大日本印刷株式会社 | 非接触ｉｃタグラベルとその製造方法 |
| JP5083091B2 (ja) * | 2008-07-24 | 2012-11-28 | 大日本印刷株式会社 | 非接触型データキャリア用導電部材の形成方法及び装置 |
| TWI439945B (zh) * | 2008-11-14 | 2014-06-01 | 凸版印刷股份有限公司 | 非接觸型ic標籤及物品 |
| TWI593322B (zh) | 2010-11-19 | 2017-07-21 | 帝斯曼知識產權資產管理有限公司 | 金屬箔圖案積層體、金屬箔之模切方法、電路基板及其製造方法、以及太陽能電池模組 |
| EP3300125B1 (en) * | 2011-06-06 | 2020-01-15 | DSM IP Assets B.V. | Metal foil, patterned-laminate and a solar cell module |
| EP2739464B1 (en) | 2011-08-03 | 2017-11-29 | Graphic Packaging International, Inc. | Systems and methods for forming laminates with patterned microwave energy interactive material |
| DE102012209328A1 (de) * | 2012-06-01 | 2013-12-05 | 3D-Micromac Ag | Verfahren und Anlage zum Herstellen eines Mehrschichtelements sowie Mehrschichtelement |
| US9380709B2 (en) * | 2013-03-15 | 2016-06-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of cutting conductive patterns |
| JP6290385B2 (ja) | 2013-09-26 | 2018-03-07 | グラフィック パッケージング インターナショナル インコーポレイテッドＧｒａｐｈｉｃ Ｐａｃｋａｇｉｎｇ Ｉｎｔｅｒｎａｔｉｏｎａｌ，Ｉｎｃ． | 積層体並びに積層を行うシステム及び方法 |
| JP6379667B2 (ja) * | 2014-05-21 | 2018-08-29 | Tdk株式会社 | アンテナ装置及びその製造方法 |
| JP2017535946A (ja) * | 2014-11-05 | 2017-11-30 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 製品基板をコーティングするための方法と装置 |
| MX384916B (es) | 2014-12-22 | 2025-03-14 | Graphic Packaging Int Llc | Sistemas y métodos para formar laminados. |
| EP4071668B1 (en) * | 2016-03-18 | 2024-04-03 | Sato Holdings Kabushiki Kaisha | Method for manufacturing rfid inlet |
| CN107482302A (zh) * | 2017-07-01 | 2017-12-15 | 华中科技大学 | 一种rfid天线制作方法 |
| CN108566732B (zh) * | 2018-05-14 | 2020-09-01 | 龙南骏亚柔性智能科技有限公司 | 一种柔性pcb电子器件褶皱制备结构 |
| WO2020141331A1 (en) * | 2019-01-04 | 2020-07-09 | Sherkin Technologies Uk Ltd | Improvements in or relating to flexible electronics |
| US10709022B1 (en) | 2019-04-19 | 2020-07-07 | Gentherm Incorporated | Milling of flex foil with two conductive layers from both sides |
| CN112589913A (zh) * | 2021-03-05 | 2021-04-02 | 赛柯赛斯新能源科技(苏州)有限公司 | 柔性电路板圆刀裁切工艺及其加工装置 |
| CN117048173A (zh) * | 2023-08-28 | 2023-11-14 | 晶科能源股份有限公司 | 层压机及层压机的层压方法 |
| CN118514411A (zh) * | 2024-04-19 | 2024-08-20 | 隆基绿能科技股份有限公司 | 一种光伏背板加工设备及方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3573126A (en) * | 1968-06-07 | 1971-03-30 | Gti Corp | Methods of manufacturing electrical circuits |
| US3713944A (en) * | 1970-05-28 | 1973-01-30 | Essex International Inc | A method of manufacture of printed circuits by die stamping |
| US4091125A (en) * | 1976-11-08 | 1978-05-23 | Delgadillo Joseph A | Circuit board and method for producing same |
| US4682415A (en) * | 1985-10-28 | 1987-07-28 | U.S. Product Development Company | Method of making printed circuits |
| US5645932A (en) * | 1993-12-30 | 1997-07-08 | Kabushiki Kaisha Miyake | Circuit-like metallic foil sheet and the like and process for producing them |
| JP3116209B2 (ja) | 1994-12-01 | 2000-12-11 | 株式会社三宅 | 共振タグ等の回路様金属箔シートの製造方法 |
| US5759422A (en) * | 1996-02-14 | 1998-06-02 | Fort James Corporation | Patterned metal foil laminate and method for making same |
| JPH10187922A (ja) * | 1996-10-23 | 1998-07-21 | Furukawa Electric Co Ltd:The | プリペイドカード |
| US6320556B1 (en) * | 2000-01-19 | 2001-11-20 | Moore North America, Inc. | RFID foil or film antennas |
| JP3536977B2 (ja) * | 2000-10-24 | 2004-06-14 | ローム株式会社 | 非接触型ｉｃカード及びその集合体及びその製造方法 |
| JP2002298109A (ja) * | 2001-03-30 | 2002-10-11 | Toppan Forms Co Ltd | 非接触型ｉｃメディアおよびその製造方法 |
| JP4770065B2 (ja) * | 2001-06-06 | 2011-09-07 | 大日本印刷株式会社 | 意匠性の高いｒｆｉｄタグ、およびその製造方法 |
| DE10145749A1 (de) * | 2001-09-17 | 2003-04-24 | Infineon Technologies Ag | Verfahren zur Herstellung einer strukturierten Metallschicht auf einem Trägerkörper und Trägerkörper mit einer strukturierten Metallschicht |
| JP3998975B2 (ja) * | 2001-12-28 | 2007-10-31 | 大日本印刷株式会社 | 電磁波遮蔽用シート |
| FR2841089B1 (fr) * | 2002-06-14 | 2004-07-30 | Sequoias | Procede de fabrication industrielle, en ligne, d'antennes pour transpondeurs rfid |
| JP4012019B2 (ja) * | 2002-08-30 | 2007-11-21 | 大日本印刷株式会社 | アンテナ配線パターンの形成方法 |
-
2005
- 2005-04-01 JP JP2005106822A patent/JP4752307B2/ja not_active Expired - Fee Related
- 2005-04-20 US US11/578,311 patent/US7930822B2/en active Active
- 2005-04-20 CN CN2005800186423A patent/CN1985552B/zh not_active Expired - Fee Related
- 2005-04-20 WO PCT/JP2005/007527 patent/WO2005107347A1/ja not_active Ceased
- 2005-04-20 EP EP05734388A patent/EP1744607A4/en not_active Withdrawn
- 2005-04-27 TW TW094113409A patent/TW200540026A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP4752307B2 (ja) | 2011-08-17 |
| EP1744607A1 (en) | 2007-01-17 |
| US20070214637A1 (en) | 2007-09-20 |
| CN1985552B (zh) | 2012-09-05 |
| CN1985552A (zh) | 2007-06-20 |
| WO2005107347A1 (ja) | 2005-11-10 |
| TWI351354B (https=) | 2011-11-01 |
| JP2006277700A (ja) | 2006-10-12 |
| US7930822B2 (en) | 2011-04-26 |
| EP1744607A4 (en) | 2010-10-27 |
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