JP4748323B2 - 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法 - Google Patents

感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法 Download PDF

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JP4748323B2
JP4748323B2 JP2007051870A JP2007051870A JP4748323B2 JP 4748323 B2 JP4748323 B2 JP 4748323B2 JP 2007051870 A JP2007051870 A JP 2007051870A JP 2007051870 A JP2007051870 A JP 2007051870A JP 4748323 B2 JP4748323 B2 JP 4748323B2
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naphthoquinonediazide
sulfonic acid
acid ester
radiation
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JP2007051870A
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Japanese (ja)
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JP2008216491A (ja
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謙一 濱田
政暁 花村
孝浩 飯島
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JSR Corp
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JSR Corp
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Priority to JP2007051870A priority Critical patent/JP4748323B2/ja
Priority to TW097107118A priority patent/TWI430026B/zh
Priority to KR1020080018915A priority patent/KR101355223B1/ko
Priority to CN2008100821455A priority patent/CN101256360B/zh
Publication of JP2008216491A publication Critical patent/JP2008216491A/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09D201/06—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C09D201/08—Carboxyl groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2007051870A 2007-03-01 2007-03-01 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法 Active JP4748323B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007051870A JP4748323B2 (ja) 2007-03-01 2007-03-01 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法
TW097107118A TWI430026B (zh) 2007-03-01 2008-02-29 Sensitive linear resin composition, interlayer insulating film and microlens, and the like
KR1020080018915A KR101355223B1 (ko) 2007-03-01 2008-02-29 감방사선성 수지 조성물, 층간 절연막 및 마이크로렌즈, 및이들의 제조 방법
CN2008100821455A CN101256360B (zh) 2007-03-01 2008-03-03 放射线敏感性树脂组合物、层间绝缘膜和微透镜、以及它们的制备方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007051870A JP4748323B2 (ja) 2007-03-01 2007-03-01 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法

Publications (2)

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JP2008216491A JP2008216491A (ja) 2008-09-18
JP4748323B2 true JP4748323B2 (ja) 2011-08-17

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Country Link
JP (1) JP4748323B2 (zh)
KR (1) KR101355223B1 (zh)
CN (1) CN101256360B (zh)
TW (1) TWI430026B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101872123B (zh) * 2009-04-27 2013-07-24 Jsr株式会社 放射线敏感性树脂组合物、液晶显示用隔片或保护膜及其形成方法
KR101229960B1 (ko) * 2011-01-28 2013-02-06 한양대학교 산학협력단 광산발생제를 포함하는 테트라 폴리머 레지스트 및 이의 제조 방법
EP2865715B1 (en) * 2012-06-01 2020-02-19 LG Chem, Ltd. Resin composition, optical film formed using same, and polarizer and liquid crystal display device comprising same
CN111801821B (zh) * 2018-03-23 2024-04-02 日本瑞翁株式会社 非水系二次电池电极用粘结剂组合物、导电材料糊组合物、浆料组合物、电极和电池
CN109467079B (zh) * 2018-11-19 2020-11-24 华南理工大学 一种有机功能化石墨烯材料及其制备方法和应用
TWI724765B (zh) 2020-01-21 2021-04-11 達興材料股份有限公司 可雷射離型的組成物、其積層體和雷射離型方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06172676A (ja) * 1992-12-03 1994-06-21 Nippon Oil & Fats Co Ltd 紫外線硬化型防曇剤組成物
JPH07261391A (ja) * 1994-03-22 1995-10-13 Nippon Oil & Fats Co Ltd 光硬化性樹脂組成物
JP3543286B2 (ja) * 1996-03-08 2004-07-14 日本化薬株式会社 樹脂組成物、レジストインキ樹脂組成物及びこれらの硬化物
WO2000040632A1 (fr) * 1998-12-28 2000-07-13 Daicel Chemical Industries, Ltd. Composition de resine durcissable, copolymere modifie et composition de resine, et pate de verre photodurcissable pour developpement de type alcalin
JP2003043685A (ja) * 2001-08-03 2003-02-13 Showa Denko Kk 着色組成物及びカラーフィルター用感光性着色組成物
KR20040030534A (ko) * 2001-05-15 2004-04-09 쇼와 덴코 가부시키가이샤 감광성 착색 조성물, 이 조성물을 사용한 컬러필터 및 그제조방법
TWI300795B (en) * 2001-08-21 2008-09-11 Mitsubishi Chem Corp Curable resin composition for die coating and process for producing color filter
JP4492393B2 (ja) * 2005-03-08 2010-06-30 チッソ株式会社 感光性組成物およびそれを用いた表示素子

Also Published As

Publication number Publication date
CN101256360B (zh) 2012-06-20
CN101256360A (zh) 2008-09-03
TWI430026B (zh) 2014-03-11
KR101355223B1 (ko) 2014-01-24
JP2008216491A (ja) 2008-09-18
TW200900857A (en) 2009-01-01
KR20080080453A (ko) 2008-09-04

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