JP4746852B2 - 伝送ケーブルの製造方法 - Google Patents
伝送ケーブルの製造方法 Download PDFInfo
- Publication number
- JP4746852B2 JP4746852B2 JP2004194981A JP2004194981A JP4746852B2 JP 4746852 B2 JP4746852 B2 JP 4746852B2 JP 2004194981 A JP2004194981 A JP 2004194981A JP 2004194981 A JP2004194981 A JP 2004194981A JP 4746852 B2 JP4746852 B2 JP 4746852B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- transmission cable
- bump
- etching
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
- H01B11/02—Cables with twisted pairs or quads
- H01B11/06—Cables with twisted pairs or quads with means for reducing effects of electromagnetic or electrostatic disturbances, e.g. screens
- H01B11/08—Screens specially adapted for reducing cross-talk
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Conductors (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
Claims (3)
- 銅箔上にエッチングバリア層及びバンプ形成用銅箔を積層したクラッド材の前記バンプ形成用銅箔をエッチングして金属バンプを形成する工程と、
前記金属バンプの先端面が配線形成用銅箔と接するように絶縁層を介してクラッド材上に配線形成用銅箔を重ね合わせる工程と、
前記重ね合わせた配線形成用銅箔上に所定のパターンを有するレジスト層を形成する工程と、
前記レジスト層をマスクとして前記配線形成用銅箔をエッチングし、信号線及びグランド線をパターニング形成する工程と、
を有することを特徴とする伝送ケーブルの製造方法。 - さらに、前記グランド線上に金属バンプの先端面が接するようにクラッド材を絶縁層を介して重ね合わせる工程を有することを特徴とする請求項1記載の伝送ケーブルの製造方法。
- 前記エッチングバリア層は、Niを含有する層であることを特徴とする請求項1又は2記載の伝送ケーブルの製造方法。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004194981A JP4746852B2 (ja) | 2004-06-30 | 2004-06-30 | 伝送ケーブルの製造方法 |
PCT/JP2005/000145 WO2006003732A1 (ja) | 2004-06-30 | 2005-01-07 | 伝送ケーブル及びその製造方法 |
CN2005800223051A CN1981349B (zh) | 2004-06-30 | 2005-01-07 | 传输电缆的制造方法 |
EP05709233A EP1775737A4 (en) | 2004-06-30 | 2005-01-07 | TRANSFER CABLE AND PROCESS FOR ITS MANUFACTURE |
KR1020067027783A KR20070036086A (ko) | 2004-06-30 | 2005-01-07 | 전송 케이블 및 그 제조 방법 |
TW094101228A TW200601958A (en) | 2004-06-30 | 2005-01-14 | Cable and manufacturing method thereof |
US11/619,039 US7429702B2 (en) | 2004-06-30 | 2007-01-02 | Transmission cable and method for manufacturing the same |
US12/111,317 US7745731B2 (en) | 2004-06-30 | 2008-04-29 | Transmission cable |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004194981A JP4746852B2 (ja) | 2004-06-30 | 2004-06-30 | 伝送ケーブルの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006019108A JP2006019108A (ja) | 2006-01-19 |
JP4746852B2 true JP4746852B2 (ja) | 2011-08-10 |
Family
ID=35782547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004194981A Expired - Fee Related JP4746852B2 (ja) | 2004-06-30 | 2004-06-30 | 伝送ケーブルの製造方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US7429702B2 (ja) |
EP (1) | EP1775737A4 (ja) |
JP (1) | JP4746852B2 (ja) |
KR (1) | KR20070036086A (ja) |
CN (1) | CN1981349B (ja) |
TW (1) | TW200601958A (ja) |
WO (1) | WO2006003732A1 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110036615A1 (en) * | 2004-12-01 | 2011-02-17 | Molex Incorporated | Flexible flat circuitry |
JP2007193999A (ja) * | 2006-01-17 | 2007-08-02 | Sony Chemical & Information Device Corp | 伝送ケーブル |
JP2011018873A (ja) * | 2009-05-22 | 2011-01-27 | Sony Ericsson Mobilecommunications Japan Inc | 電磁シールド方法および電磁シールド用フィルム |
EP2339894A1 (de) * | 2009-12-22 | 2011-06-29 | Saint-Gobain Glass France | Scheibe mit elektrischem Anschlusselement |
TWM395240U (en) * | 2010-05-28 | 2010-12-21 | Tennrich Internat Crop | Flexible flat cable |
JP5610953B2 (ja) | 2010-09-24 | 2014-10-22 | キヤノン株式会社 | プリント配線板及びプリント回路板 |
CN102098868A (zh) * | 2010-12-24 | 2011-06-15 | 鸿富锦精密工业(深圳)有限公司 | 电路板 |
US10485095B2 (en) | 2011-03-10 | 2019-11-19 | Mediatek, Inc. | Printed circuit board design for high speed application |
US9949360B2 (en) | 2011-03-10 | 2018-04-17 | Mediatek Inc. | Printed circuit board design for high speed application |
CN103974564B (zh) * | 2013-01-24 | 2018-11-06 | 北大方正集团有限公司 | Pcb同轴电缆的制作方法及pcb同轴电缆 |
CN104103392A (zh) * | 2013-04-10 | 2014-10-15 | 珠海扬智电子科技有限公司 | 排阻器 |
ES2538426A1 (es) * | 2013-11-29 | 2015-06-19 | Texas Controls Sl | Sistema de comprobación para uniones atornilladas en el sector eólico |
US9992859B2 (en) | 2015-09-25 | 2018-06-05 | Intel Corporation | Low loss and low cross talk transmission lines using shaped vias |
TWI576019B (zh) * | 2015-11-27 | 2017-03-21 | 中原大學 | 印刷電路板 |
KR102552614B1 (ko) * | 2016-02-26 | 2023-07-06 | 주식회사 기가레인 | 연성회로기판 |
US10734696B2 (en) * | 2017-05-16 | 2020-08-04 | Rigetti & Co, Inc. | Connecting electrical circuitry in a quantum computing system |
TWM555550U (zh) * | 2017-09-29 | 2018-02-11 | Bellwether Electronic Corp | 長直高頻傳輸電纜 |
KR102039225B1 (ko) | 2017-11-16 | 2019-10-31 | 서울과학기술대학교 산학협력단 | 노트북 컴퓨터 냉각 받침대 |
KR102147336B1 (ko) * | 2018-01-23 | 2020-08-24 | 동우 화인켐 주식회사 | 필름 안테나-회로 연결 구조체 및 이를 포함하는 디스플레이 장치 |
CN110859022A (zh) * | 2018-08-24 | 2020-03-03 | 三赢科技(深圳)有限公司 | 电路板及应用该电路板的电子装置 |
WO2020092334A2 (en) * | 2018-10-29 | 2020-05-07 | Cellink Corporation | Flexible hybrid interconnect circuits |
US10779402B1 (en) * | 2019-05-03 | 2020-09-15 | Intel Corporation | Noise sensitive trace 3D ground-shielding crosstalk mitigation |
CN111653384A (zh) * | 2020-06-22 | 2020-09-11 | 东莞市晟合科技有限公司 | 一种高速传输ffc |
CN114822962A (zh) * | 2021-04-21 | 2022-07-29 | 凡甲科技股份有限公司 | 数据传输线缆 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4845311A (en) * | 1988-07-21 | 1989-07-04 | Hughes Aircraft Company | Flexible coaxial cable apparatus and method |
JPH0799397A (ja) * | 1993-09-29 | 1995-04-11 | Toshiba Corp | プリント板構造 |
JP3687041B2 (ja) * | 1997-04-16 | 2005-08-24 | 大日本印刷株式会社 | 配線基板、配線基板の製造方法、および半導体パッケージ |
JP3522513B2 (ja) * | 1997-11-26 | 2004-04-26 | 山一電機株式会社 | フラット型ケーブルおよびその製造方法 |
JP2002525855A (ja) * | 1998-09-10 | 2002-08-13 | シーメンス アクチエンゲゼルシヤフト | 多極のプラグコネクタを有しているプリント配線板装置 |
JP3760731B2 (ja) * | 2000-07-11 | 2006-03-29 | ソニーケミカル株式会社 | バンプ付き配線回路基板及びその製造方法 |
JP3564053B2 (ja) * | 2000-10-06 | 2004-09-08 | キヤノン株式会社 | フレキシブルケーブル |
US6459041B1 (en) * | 2000-11-01 | 2002-10-01 | Visteon Global Technologies, Inc. | Etched tri-layer metal bonding layer |
US6943447B2 (en) * | 2002-01-10 | 2005-09-13 | Fujitsu Limited | Thin film multi-layer wiring substrate having a coaxial wiring structure in at least one layer |
-
2004
- 2004-06-30 JP JP2004194981A patent/JP4746852B2/ja not_active Expired - Fee Related
-
2005
- 2005-01-07 KR KR1020067027783A patent/KR20070036086A/ko not_active Application Discontinuation
- 2005-01-07 EP EP05709233A patent/EP1775737A4/en not_active Withdrawn
- 2005-01-07 CN CN2005800223051A patent/CN1981349B/zh not_active Expired - Fee Related
- 2005-01-07 WO PCT/JP2005/000145 patent/WO2006003732A1/ja not_active Application Discontinuation
- 2005-01-14 TW TW094101228A patent/TW200601958A/zh not_active IP Right Cessation
-
2007
- 2007-01-02 US US11/619,039 patent/US7429702B2/en not_active Expired - Fee Related
-
2008
- 2008-04-29 US US12/111,317 patent/US7745731B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1981349A (zh) | 2007-06-13 |
US20080230254A1 (en) | 2008-09-25 |
TW200601958A (en) | 2006-01-01 |
US20070120231A1 (en) | 2007-05-31 |
US7429702B2 (en) | 2008-09-30 |
KR20070036086A (ko) | 2007-04-02 |
CN1981349B (zh) | 2011-03-16 |
EP1775737A4 (en) | 2008-08-13 |
US7745731B2 (en) | 2010-06-29 |
EP1775737A1 (en) | 2007-04-18 |
WO2006003732A1 (ja) | 2006-01-12 |
JP2006019108A (ja) | 2006-01-19 |
TWI340013B (ja) | 2011-04-01 |
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