JP4708696B2 - 溶液の供給装置及び供給方法 - Google Patents

溶液の供給装置及び供給方法 Download PDF

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Publication number
JP4708696B2
JP4708696B2 JP2003374556A JP2003374556A JP4708696B2 JP 4708696 B2 JP4708696 B2 JP 4708696B2 JP 2003374556 A JP2003374556 A JP 2003374556A JP 2003374556 A JP2003374556 A JP 2003374556A JP 4708696 B2 JP4708696 B2 JP 4708696B2
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solution
substrate
head
data
nozzle
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JP2003374556A
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Japanese (ja)
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JP2005137971A (ja
JP2005137971A5 (enExample
Inventor
大輔 松嶋
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2003374556A priority Critical patent/JP4708696B2/ja
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Publication of JP2005137971A5 publication Critical patent/JP2005137971A5/ja
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  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Ink Jet (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2003374556A 2003-11-04 2003-11-04 溶液の供給装置及び供給方法 Expired - Lifetime JP4708696B2 (ja)

Priority Applications (1)

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JP2003374556A JP4708696B2 (ja) 2003-11-04 2003-11-04 溶液の供給装置及び供給方法

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Application Number Priority Date Filing Date Title
JP2003374556A JP4708696B2 (ja) 2003-11-04 2003-11-04 溶液の供給装置及び供給方法

Publications (3)

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JP2005137971A JP2005137971A (ja) 2005-06-02
JP2005137971A5 JP2005137971A5 (enExample) 2006-12-21
JP4708696B2 true JP4708696B2 (ja) 2011-06-22

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JP2003374556A Expired - Lifetime JP4708696B2 (ja) 2003-11-04 2003-11-04 溶液の供給装置及び供給方法

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007136257A (ja) * 2005-11-14 2007-06-07 Seiko Epson Corp 液滴吐出装置
US8001924B2 (en) 2006-03-31 2011-08-23 Asml Netherlands B.V. Imprint lithography
KR100673298B1 (ko) * 2006-05-25 2007-01-24 주식회사 탑 엔지니어링 페이스트 도포기를 위한 도포 패턴 데이터 생성 장치 및방법
JP2009224653A (ja) * 2008-03-18 2009-10-01 Sat:Kk フォトレジスト塗布装置
JP2014202456A (ja) * 2013-04-09 2014-10-27 パナソニック株式会社 乾燥方法および乾燥装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51114445A (en) * 1975-03-31 1976-10-08 Omron Tateisi Electronics Co An apparatus for controlling a coating process
JP2595098B2 (ja) * 1989-07-05 1997-03-26 キヤノン株式会社 記録装置および記録ヘッド
JPH04371252A (ja) * 1991-06-19 1992-12-24 Tokico Ltd 塗装機システム
JP3159824B2 (ja) * 1992-02-26 2001-04-23 キヤノン株式会社 画像形成装置とインクジェット記録物の製法
JPH10223138A (ja) * 1996-12-04 1998-08-21 Dainippon Printing Co Ltd 蛍光体充填装置
JP3607567B2 (ja) * 1997-08-29 2005-01-05 ニチハ株式会社 建築板、その塗装方法及び塗装装置
JP2000237666A (ja) * 1999-02-18 2000-09-05 Dainippon Printing Co Ltd 粘性液体の面状塗布装置及び面状塗布方法
JP3658297B2 (ja) * 1999-08-24 2005-06-08 キヤノン株式会社 記録ヘッド及び記録ヘッドを用いた記録装置
JP4277428B2 (ja) * 2000-07-18 2009-06-10 パナソニック株式会社 ボンディングペーストの塗布装置および塗布方法
JP3884924B2 (ja) * 2001-06-05 2007-02-21 キヤノン株式会社 プリントヘッドのヒータボード
JP2003039001A (ja) * 2001-07-27 2003-02-12 Hitachi Industries Co Ltd ペースト塗布機とパターン塗布方法
JP2003103207A (ja) * 2001-09-28 2003-04-08 Shibaura Mechatronics Corp 塗布装置及び塗布方法
JP2003188073A (ja) * 2001-12-18 2003-07-04 Seiko Epson Corp レジスト塗布装置、レジスト塗布方法、半導体装置の製造方法
JP3793727B2 (ja) * 2002-02-04 2006-07-05 株式会社 日立インダストリイズ ペースト塗布機
JP2003341063A (ja) * 2002-05-28 2003-12-03 Canon Inc 記録装置
JP2004337704A (ja) * 2003-05-14 2004-12-02 Seiko Epson Corp 液滴吐出装置

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JP2005137971A (ja) 2005-06-02

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