JP4695925B2 - シールド集積回路プローブ - Google Patents

シールド集積回路プローブ Download PDF

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Publication number
JP4695925B2
JP4695925B2 JP2005174467A JP2005174467A JP4695925B2 JP 4695925 B2 JP4695925 B2 JP 4695925B2 JP 2005174467 A JP2005174467 A JP 2005174467A JP 2005174467 A JP2005174467 A JP 2005174467A JP 4695925 B2 JP4695925 B2 JP 4695925B2
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JP
Japan
Prior art keywords
housing
connector assembly
contact
spring
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005174467A
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English (en)
Japanese (ja)
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JP2006004932A (ja
JP2006004932A5 (https=
Inventor
ウィリアム．ワイ．シンクレア
Original Assignee
アリエス．エレクトロニクス．インコーポレイテッド
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Publication of JP2006004932A publication Critical patent/JP2006004932A/ja
Publication of JP2006004932A5 publication Critical patent/JP2006004932A5/ja
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Publication of JP4695925B2 publication Critical patent/JP4695925B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connecting Device With Holders (AREA)
JP2005174467A 2004-06-17 2005-06-15 シールド集積回路プローブ Expired - Fee Related JP4695925B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/870,108 US6937045B2 (en) 2002-07-18 2004-06-17 Shielded integrated circuit probe
US10/870,108 2004-06-17

Publications (3)

Publication Number Publication Date
JP2006004932A JP2006004932A (ja) 2006-01-05
JP2006004932A5 JP2006004932A5 (https=) 2010-07-29
JP4695925B2 true JP4695925B2 (ja) 2011-06-08

Family

ID=34937506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005174467A Expired - Fee Related JP4695925B2 (ja) 2004-06-17 2005-06-15 シールド集積回路プローブ

Country Status (4)

Country Link
US (1) US6937045B2 (https=)
EP (1) EP1607749B1 (https=)
JP (1) JP4695925B2 (https=)
DE (1) DE602005006667D1 (https=)

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US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
EP1509776A4 (en) 2002-05-23 2010-08-18 Cascade Microtech Inc PROBE TO TEST ANY TESTING EQUIPMENT
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
CN2682641Y (zh) * 2003-11-20 2005-03-02 上海莫仕连接器有限公司 压接式导电端子
WO2005065258A2 (en) 2003-12-24 2005-07-21 Cascade Microtech, Inc. Active wafer probe
KR101157449B1 (ko) 2004-07-07 2012-06-22 캐스케이드 마이크로테크 인코포레이티드 멤브레인 서스펜디드 프로브를 구비한 프로브 헤드
KR20070058522A (ko) 2004-09-13 2007-06-08 캐스케이드 마이크로테크 인코포레이티드 양측 프루빙 구조
WO2006062911A1 (en) * 2004-12-08 2006-06-15 K & S Interconnect, Inc. Test socket and method for making
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
JP4304189B2 (ja) * 2005-04-20 2009-07-29 エスペック株式会社 Ｉｃソケット
JP4757531B2 (ja) * 2005-04-28 2011-08-24 日本発條株式会社 導電性接触子ホルダおよび導電性接触子ユニット
FR2887034A1 (fr) * 2005-06-08 2006-12-15 Wan Chuan Chou Sonde integree et procede de transmission d'un signal au travers
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
EP1932003A2 (en) 2005-06-13 2008-06-18 Cascade Microtech, Inc. Wideband active-passive differential signal probe
US7154286B1 (en) * 2005-06-30 2006-12-26 Interconnect Devices, Inc. Dual tapered spring probe
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US7609077B2 (en) 2006-06-09 2009-10-27 Cascade Microtech, Inc. Differential signal probe with integral balun
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US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7362118B2 (en) * 2006-08-25 2008-04-22 Interconnect Devices, Inc. Probe with contact ring
KR100769891B1 (ko) * 2007-01-25 2007-10-24 리노공업주식회사 검사용 탐침 장치 및 이를 이용한 검사용 소켓
US7479794B2 (en) * 2007-02-28 2009-01-20 Sv Probe Pte Ltd Spring loaded probe pin assembly
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
JP5008582B2 (ja) * 2008-02-04 2012-08-22 株式会社ヨコオ コンタクトプローブ
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
JP4900843B2 (ja) 2008-12-26 2012-03-21 山一電機株式会社 半導体装置用電気接続装置及びそれに使用されるコンタクト
US7874880B2 (en) * 2009-02-26 2011-01-25 Ironwood Electronics, Inc. Adapter apparatus with sleeve spring contacts
JP5197754B2 (ja) * 2009-11-13 2013-05-15 テスト ツーリング ソリューションズ グループ ピイ ティ イー リミテッド プローブピン
JP5162621B2 (ja) 2010-05-07 2013-03-13 日本発條株式会社 温度調節装置、冷却装置、及び温度調節装置の製造方法
TWI416134B (zh) * 2010-08-11 2013-11-21 Chipsip Technology Co Ltd 測試裝置
DE202011001670U1 (de) * 2011-01-18 2011-03-31 Ingun Prüfmittelbau Gmbh Hochfrequenz-Prüfstift Vorrichtung
CN102608429A (zh) * 2011-01-19 2012-07-25 昆山万正电路板有限公司 平面变压器电感测试模具
TW201231977A (en) * 2011-01-20 2012-08-01 Pleader Yamaichi Co Ltd Structure of high-frequency vertical spring plate probe card
US9373900B2 (en) 2011-07-19 2016-06-21 Nhk Spring Co., Ltd. Contact structure unit
EP2765427B1 (en) * 2011-10-07 2016-12-07 NHK Spring Co., Ltd. Probe unit
TWI449918B (zh) * 2012-03-16 2014-08-21 Choice Sun Technology Co Ltd 測試用探針裝置
KR101439342B1 (ko) 2013-04-18 2014-09-16 주식회사 아이에스시 포고핀용 탐침부재
KR101439343B1 (ko) * 2013-04-18 2014-09-16 주식회사 아이에스시 포고핀용 탐침부재
TWI510788B (zh) * 2014-01-13 2015-12-01 Taiwan Elite Nano Technology Corp 探針結構及其製造方法
KR200473045Y1 (ko) * 2014-01-17 2014-06-27 (주)에스피에스 이중접점스위치 및 이중접점스위치를 갖는 마그네틱 커넥터
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TWI579568B (zh) * 2016-04-12 2017-04-21 致茂電子股份有限公司 具下壓頭與承載座基板卡固機構之電子元件檢測設備
KR101954086B1 (ko) * 2017-11-07 2019-03-06 리노공업주식회사 검사 프로브 조립체 및 검사 소켓
DE102018123995A1 (de) * 2018-09-28 2020-04-02 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Kontaktiereinrichtung zum elektrischen Kontaktieren einer Leiterplatte mit einem Spulenkörper für ein Magnetventil für eine Bremseinrichtung für ein Fahrzeug, Magnetventil mit einer Kontaktiereinrichtung und Verfahren zum Herstellen einer Kontaktiereinrichtung
KR102202295B1 (ko) * 2019-08-29 2021-01-13 주식회사 피에스개발 테스트 소켓용 이형 스프링 어셈블리 및 이를 갖는 테스트 소켓
US11121511B1 (en) * 2020-03-16 2021-09-14 TE Connectivity Services Gmbh Electrical connector with shielding gasket
JP7602112B2 (ja) * 2020-11-17 2024-12-18 山一電機株式会社 検査用ソケット
CN113447679B (zh) * 2021-08-30 2021-12-07 杭州长川科技股份有限公司 用于电子元件的测试装置及测试系统
CN115882286A (zh) * 2021-09-27 2023-03-31 史密斯互连美洲公司 用于同轴测试插座和印刷电路板接口的系统和方法
TWI806575B (zh) * 2022-04-27 2023-06-21 中華精測科技股份有限公司 探針插座結構的製作方法
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Also Published As

Publication number Publication date
EP1607749A2 (en) 2005-12-21
US6937045B2 (en) 2005-08-30
JP2006004932A (ja) 2006-01-05
EP1607749A3 (en) 2006-05-31
EP1607749B1 (en) 2008-05-14
US20040232934A1 (en) 2004-11-25
DE602005006667D1 (de) 2008-06-26

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