JP2006004932A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006004932A5 JP2006004932A5 JP2005174467A JP2005174467A JP2006004932A5 JP 2006004932 A5 JP2006004932 A5 JP 2006004932A5 JP 2005174467 A JP2005174467 A JP 2005174467A JP 2005174467 A JP2005174467 A JP 2005174467A JP 2006004932 A5 JP2006004932 A5 JP 2006004932A5
- Authority
- JP
- Japan
- Prior art keywords
- housing
- connector assembly
- contact surface
- disposed
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 28
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 230000000452 restraining effect Effects 0.000 claims 1
- 238000012360 testing method Methods 0.000 description 22
- 239000004033 plastic Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 12
- 230000001154 acute effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000013011 mating Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/870,108 US6937045B2 (en) | 2002-07-18 | 2004-06-17 | Shielded integrated circuit probe |
| US10/870,108 | 2004-06-17 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006004932A JP2006004932A (ja) | 2006-01-05 |
| JP2006004932A5 true JP2006004932A5 (https=) | 2010-07-29 |
| JP4695925B2 JP4695925B2 (ja) | 2011-06-08 |
Family
ID=34937506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005174467A Expired - Fee Related JP4695925B2 (ja) | 2004-06-17 | 2005-06-15 | シールド集積回路プローブ |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6937045B2 (https=) |
| EP (1) | EP1607749B1 (https=) |
| JP (1) | JP4695925B2 (https=) |
| DE (1) | DE602005006667D1 (https=) |
Families Citing this family (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6232789B1 (en) | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
| US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
| US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
| US6578264B1 (en) | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
| US6838890B2 (en) | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
| DE10143173A1 (de) | 2000-12-04 | 2002-06-06 | Cascade Microtech Inc | Wafersonde |
| US7355420B2 (en) | 2001-08-21 | 2008-04-08 | Cascade Microtech, Inc. | Membrane probing system |
| EP1509776A4 (en) | 2002-05-23 | 2010-08-18 | Cascade Microtech Inc | PROBE TO TEST ANY TESTING EQUIPMENT |
| US6724205B1 (en) | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
| US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
| CN2682641Y (zh) * | 2003-11-20 | 2005-03-02 | 上海莫仕连接器有限公司 | 压接式导电端子 |
| WO2005065258A2 (en) | 2003-12-24 | 2005-07-21 | Cascade Microtech, Inc. | Active wafer probe |
| KR101157449B1 (ko) | 2004-07-07 | 2012-06-22 | 캐스케이드 마이크로테크 인코포레이티드 | 멤브레인 서스펜디드 프로브를 구비한 프로브 헤드 |
| KR20070058522A (ko) | 2004-09-13 | 2007-06-08 | 캐스케이드 마이크로테크 인코포레이티드 | 양측 프루빙 구조 |
| WO2006062911A1 (en) * | 2004-12-08 | 2006-06-15 | K & S Interconnect, Inc. | Test socket and method for making |
| US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
| US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
| JP4304189B2 (ja) * | 2005-04-20 | 2009-07-29 | エスペック株式会社 | Ｉｃソケット |
| JP4757531B2 (ja) * | 2005-04-28 | 2011-08-24 | 日本発條株式会社 | 導電性接触子ホルダおよび導電性接触子ユニット |
| FR2887034A1 (fr) * | 2005-06-08 | 2006-12-15 | Wan Chuan Chou | Sonde integree et procede de transmission d'un signal au travers |
| US7449899B2 (en) | 2005-06-08 | 2008-11-11 | Cascade Microtech, Inc. | Probe for high frequency signals |
| EP1932003A2 (en) | 2005-06-13 | 2008-06-18 | Cascade Microtech, Inc. | Wideband active-passive differential signal probe |
| US7154286B1 (en) * | 2005-06-30 | 2006-12-26 | Interconnect Devices, Inc. | Dual tapered spring probe |
| TWM289241U (en) * | 2005-10-07 | 2006-04-01 | Lotes Co Ltd | Electric connector |
| TWI280372B (en) * | 2006-02-08 | 2007-05-01 | Wistron Corp | Test apparatus for holding signal terminals |
| US7609077B2 (en) | 2006-06-09 | 2009-10-27 | Cascade Microtech, Inc. | Differential signal probe with integral balun |
| US7443186B2 (en) | 2006-06-12 | 2008-10-28 | Cascade Microtech, Inc. | On-wafer test structures for differential signals |
| US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
| US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
| US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
| US7362118B2 (en) * | 2006-08-25 | 2008-04-22 | Interconnect Devices, Inc. | Probe with contact ring |
| KR100769891B1 (ko) * | 2007-01-25 | 2007-10-24 | 리노공업주식회사 | 검사용 탐침 장치 및 이를 이용한 검사용 소켓 |
| US7479794B2 (en) * | 2007-02-28 | 2009-01-20 | Sv Probe Pte Ltd | Spring loaded probe pin assembly |
| US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
| JP5008582B2 (ja) * | 2008-02-04 | 2012-08-22 | 株式会社ヨコオ | コンタクトプローブ |
| US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
| US8410806B2 (en) | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
| JP4900843B2 (ja) | 2008-12-26 | 2012-03-21 | 山一電機株式会社 | 半導体装置用電気接続装置及びそれに使用されるコンタクト |
| US7874880B2 (en) * | 2009-02-26 | 2011-01-25 | Ironwood Electronics, Inc. | Adapter apparatus with sleeve spring contacts |
| JP5197754B2 (ja) * | 2009-11-13 | 2013-05-15 | テスト ツーリング ソリューションズ グループ ピイ ティ イー リミテッド | プローブピン |
| JP5162621B2 (ja) | 2010-05-07 | 2013-03-13 | 日本発條株式会社 | 温度調節装置、冷却装置、及び温度調節装置の製造方法 |
| TWI416134B (zh) * | 2010-08-11 | 2013-11-21 | Chipsip Technology Co Ltd | 測試裝置 |
| DE202011001670U1 (de) * | 2011-01-18 | 2011-03-31 | Ingun Prüfmittelbau Gmbh | Hochfrequenz-Prüfstift Vorrichtung |
| CN102608429A (zh) * | 2011-01-19 | 2012-07-25 | 昆山万正电路板有限公司 | 平面变压器电感测试模具 |
| TW201231977A (en) * | 2011-01-20 | 2012-08-01 | Pleader Yamaichi Co Ltd | Structure of high-frequency vertical spring plate probe card |
| US9373900B2 (en) | 2011-07-19 | 2016-06-21 | Nhk Spring Co., Ltd. | Contact structure unit |
| EP2765427B1 (en) * | 2011-10-07 | 2016-12-07 | NHK Spring Co., Ltd. | Probe unit |
| TWI449918B (zh) * | 2012-03-16 | 2014-08-21 | Choice Sun Technology Co Ltd | 測試用探針裝置 |
| KR101439342B1 (ko) | 2013-04-18 | 2014-09-16 | 주식회사 아이에스시 | 포고핀용 탐침부재 |
| KR101439343B1 (ko) * | 2013-04-18 | 2014-09-16 | 주식회사 아이에스시 | 포고핀용 탐침부재 |
| TWI510788B (zh) * | 2014-01-13 | 2015-12-01 | Taiwan Elite Nano Technology Corp | 探針結構及其製造方法 |
| KR200473045Y1 (ko) * | 2014-01-17 | 2014-06-27 | (주)에스피에스 | 이중접점스위치 및 이중접점스위치를 갖는 마그네틱 커넥터 |
| US10274515B1 (en) * | 2015-08-07 | 2019-04-30 | Johnstech International Corporation | Waveguide integrated testing |
| US20170146568A1 (en) * | 2015-11-19 | 2017-05-25 | WinWay Tech. Co., Ltd. | Electronic test equipment |
| TWI579568B (zh) * | 2016-04-12 | 2017-04-21 | 致茂電子股份有限公司 | 具下壓頭與承載座基板卡固機構之電子元件檢測設備 |
| KR101954086B1 (ko) * | 2017-11-07 | 2019-03-06 | 리노공업주식회사 | 검사 프로브 조립체 및 검사 소켓 |
| DE102018123995A1 (de) * | 2018-09-28 | 2020-04-02 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Kontaktiereinrichtung zum elektrischen Kontaktieren einer Leiterplatte mit einem Spulenkörper für ein Magnetventil für eine Bremseinrichtung für ein Fahrzeug, Magnetventil mit einer Kontaktiereinrichtung und Verfahren zum Herstellen einer Kontaktiereinrichtung |
| KR102202295B1 (ko) * | 2019-08-29 | 2021-01-13 | 주식회사 피에스개발 | 테스트 소켓용 이형 스프링 어셈블리 및 이를 갖는 테스트 소켓 |
| US11121511B1 (en) * | 2020-03-16 | 2021-09-14 | TE Connectivity Services Gmbh | Electrical connector with shielding gasket |
| JP7602112B2 (ja) * | 2020-11-17 | 2024-12-18 | 山一電機株式会社 | 検査用ソケット |
| CN113447679B (zh) * | 2021-08-30 | 2021-12-07 | 杭州长川科技股份有限公司 | 用于电子元件的测试装置及测试系统 |
| CN115882286A (zh) * | 2021-09-27 | 2023-03-31 | 史密斯互连美洲公司 | 用于同轴测试插座和印刷电路板接口的系统和方法 |
| TWI806575B (zh) * | 2022-04-27 | 2023-06-21 | 中華精測科技股份有限公司 | 探針插座結構的製作方法 |
| US12476227B2 (en) | 2022-08-19 | 2025-11-18 | Google Llc | Socket to support high performance multi-die ASICs |
| CN117750742A (zh) * | 2022-09-13 | 2024-03-22 | 锐捷网络股份有限公司 | 屏蔽式连接结构及散热器 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH627282A5 (en) * | 1978-05-02 | 1981-12-31 | Feinmetall Gmbh | Spring-loaded contact module for measuring and test purposes |
| DE3340431C2 (de) * | 1983-11-09 | 1985-12-19 | Feinmetall Gmbh, 7033 Herrenberg | Gefederter Kontaktstift für Prüfzwecke |
| JPS6427170A (en) * | 1987-07-22 | 1989-01-30 | Nippon Denshi Zairyo Kk | Electromagnetically shielded socket for probe card |
| JPS6430458A (en) * | 1987-07-22 | 1989-02-01 | Mitsubishi Electric Corp | Three-phase ac phase controller |
| DE3832410C2 (de) * | 1987-10-09 | 1994-07-28 | Feinmetall Gmbh | Kontaktvorrichtung |
| JPH09260000A (ja) * | 1996-03-22 | 1997-10-03 | Toudai Musen Kk | コンタクトプローブおよびコンタクトプローブ取付用ソケット |
| JP3243201B2 (ja) * | 1997-05-09 | 2002-01-07 | 株式会社ヨコオ | スプリングコネクタおよび該スプリングコネクタを用いた装置 |
| JP4124520B2 (ja) * | 1998-07-30 | 2008-07-23 | 日本発条株式会社 | 導電性接触子のホルダ及びその製造方法 |
| JP3742742B2 (ja) * | 2000-03-15 | 2006-02-08 | 株式会社エンプラス | 電気部品用ソケット |
| JP2001326048A (ja) * | 2000-05-19 | 2001-11-22 | S Ii R:Kk | Ｉｃ用ソケット |
| JP2002107408A (ja) * | 2000-09-28 | 2002-04-10 | Toshiba Corp | Ｂｇａ用高周波ソケット |
| US6844749B2 (en) * | 2002-07-18 | 2005-01-18 | Aries Electronics, Inc. | Integrated circuit test probe |
-
2004
- 2004-06-17 US US10/870,108 patent/US6937045B2/en not_active Expired - Fee Related
-
2005
- 2005-06-15 JP JP2005174467A patent/JP4695925B2/ja not_active Expired - Fee Related
- 2005-06-16 DE DE602005006667T patent/DE602005006667D1/de not_active Expired - Lifetime
- 2005-06-16 EP EP05013012A patent/EP1607749B1/en not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4695925B2 (ja) | シールド集積回路プローブ | |
| JP2006004932A5 (https=) | ||
| JP4328145B2 (ja) | 集積回路テストプローブ | |
| US5562462A (en) | Reduced crosstalk and shielded adapter for mounting an integrated chip package on a circuit board like member | |
| JP3653131B2 (ja) | 導電性接触子 | |
| US7393214B2 (en) | High performance electrical connector | |
| JP3885866B2 (ja) | コネクタ組立体 | |
| KR100854267B1 (ko) | 포고핀의 제조방법과, 이를 이용한 테스트 소켓 | |
| US20090124100A1 (en) | Shielded electrical interconnect | |
| US20060116004A1 (en) | Normally closed zero insertion force connector | |
| KR100932459B1 (ko) | 콘택터 및 콘택터를 사용한 시험 방법 | |
| US8969734B2 (en) | Terminal assembly with regions of differing solderability | |
| US7140884B2 (en) | Contact assembly and method of making thereof | |
| TWI907846B (zh) | 用於積體電路之具傳導性壓縮接觸件之測試插座 | |
| JP3309099B2 (ja) | 回路基板と表面実装型ｌｓｉとの接続方法 | |
| US6328577B1 (en) | High density electric connector set | |
| JP2002270320A (ja) | 半導体パッケージ用ソケット | |
| US20090203235A1 (en) | Electrical connector having terminals with improved wiping capability | |
| US20040127085A1 (en) | Connector for a pin grid array integrated circuit device | |
| US7014476B2 (en) | Electrical connector | |
| KR20080018520A (ko) | 포고핀 및 이를 이용한 테스트 소켓 | |
| US20060051989A1 (en) | Multiple piece shroud | |
| JPH07287048A (ja) | Ｉｃソケット及びその電気コンタクト | |
| KR20000055990A (ko) | 접촉식 검사 소켓 어셈블리 |