JP4686120B2 - 被覆導電粒子、異方性導電材料及び導電接続構造体 - Google Patents

被覆導電粒子、異方性導電材料及び導電接続構造体 Download PDF

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JP4686120B2
JP4686120B2 JP2003381658A JP2003381658A JP4686120B2 JP 4686120 B2 JP4686120 B2 JP 4686120B2 JP 2003381658 A JP2003381658 A JP 2003381658A JP 2003381658 A JP2003381658 A JP 2003381658A JP 4686120 B2 JP4686120 B2 JP 4686120B2
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particles
core
particle
shell
coated
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JP2005149764A (ja
JP2005149764A5 (enExample
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茂雄 真原
武司 脇屋
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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JP2003381658A 2003-11-11 2003-11-11 被覆導電粒子、異方性導電材料及び導電接続構造体 Expired - Fee Related JP4686120B2 (ja)

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JP2003381658A JP4686120B2 (ja) 2003-11-11 2003-11-11 被覆導電粒子、異方性導電材料及び導電接続構造体

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JP2003381658A JP4686120B2 (ja) 2003-11-11 2003-11-11 被覆導電粒子、異方性導電材料及び導電接続構造体

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JP2005149764A5 JP2005149764A5 (enExample) 2006-09-21
JP4686120B2 true JP4686120B2 (ja) 2011-05-18

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103030728A (zh) * 2011-09-06 2013-04-10 日立化成工业株式会社 绝缘包覆用粒子、绝缘包覆导电粒子、各向异性导电材料及连接结构体
JP2014017213A (ja) * 2012-07-11 2014-01-30 Hitachi Chemical Co Ltd 絶縁被覆導電粒子及びそれを用いた異方導電性接着剤

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100722493B1 (ko) * 2005-09-02 2007-05-28 제일모직주식회사 절연 전도성 미립자 및 이를 이용한 이방 전도성 접착필름
WO2007145657A2 (en) * 2005-11-01 2007-12-21 Massachusetts Institute Of Technology Initiated chemical vapor deposition of vinyl polymers for the encapsulation of particles
TW200729236A (en) * 2005-12-22 2007-08-01 Sekisui Chemical Co Ltd Conductive fine particle and anisotropic conductive material
US20100065311A1 (en) * 2006-07-03 2010-03-18 Hitachi Chemical Company, Ltd. Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member
KR100752533B1 (ko) * 2006-11-06 2007-08-29 한국과학기술연구원 고분자 미세 캡슐-도전성 입자 복합체 및 이의 제조 방법
KR100871759B1 (ko) 2007-04-13 2008-12-05 엘에스엠트론 주식회사 이방 도전성 접착용 도전볼
JP5368760B2 (ja) * 2008-09-29 2013-12-18 積水化学工業株式会社 絶縁被覆導電性粒子、異方性導電材料及び接続構造体
JP5548053B2 (ja) * 2010-07-02 2014-07-16 積水化学工業株式会社 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体
JP5672022B2 (ja) * 2011-01-25 2015-02-18 日立化成株式会社 絶縁被覆導電粒子、異方導電性材料及び接続構造体
JP2011181525A (ja) * 2011-06-09 2011-09-15 Sony Chemical & Information Device Corp 異方性導電材料
JP5803393B2 (ja) * 2011-08-02 2015-11-04 日立化成株式会社 絶縁被覆導電粒子及び異方導電性接着フィルム
JP6044195B2 (ja) * 2011-09-06 2016-12-14 日立化成株式会社 絶縁被覆用粒子、絶縁被覆導電粒子、異方導電材料及び接続構造体
JP5750342B2 (ja) * 2011-09-12 2015-07-22 株式会社日本触媒 絶縁性微粒子、絶縁性微粒子被覆導電性微粒子、異方性導電接着剤組成物、および異方性導電成形体
JP5952553B2 (ja) * 2011-12-14 2016-07-13 株式会社日本触媒 導電性微粒子及びこれを含む異方性導電材料
WO2018207628A1 (ja) * 2017-05-08 2018-11-15 日本化学工業株式会社 被覆粒子及びその製造方法
WO2018207627A1 (ja) * 2017-05-08 2018-11-15 日本化学工業株式会社 被覆粒子及びその製造方法
SG11202005226VA (en) * 2019-03-26 2020-11-27 Furukawa Electric Co Ltd Method for producing anisotropic conductive sheet
CN110176588B (zh) * 2019-05-28 2022-01-28 中国科学院重庆绿色智能技术研究院 电极材料的制备方法
KR20230056664A (ko) 2020-08-24 2023-04-27 니폰 가가쿠 고교 가부시키가이샤 피복 입자 및 그 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2895872B2 (ja) * 1989-09-26 1999-05-24 触媒化成工業株式会社 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板
JP5060692B2 (ja) * 2001-07-13 2012-10-31 株式会社日本触媒 異方導電性材料
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
KR100589799B1 (ko) * 2003-05-06 2006-06-14 한화석유화학 주식회사 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103030728A (zh) * 2011-09-06 2013-04-10 日立化成工业株式会社 绝缘包覆用粒子、绝缘包覆导电粒子、各向异性导电材料及连接结构体
JP2014017213A (ja) * 2012-07-11 2014-01-30 Hitachi Chemical Co Ltd 絶縁被覆導電粒子及びそれを用いた異方導電性接着剤

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