JP4679890B2 - サポートプレートの貼り付け装置 - Google Patents

サポートプレートの貼り付け装置 Download PDF

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Publication number
JP4679890B2
JP4679890B2 JP2004344677A JP2004344677A JP4679890B2 JP 4679890 B2 JP4679890 B2 JP 4679890B2 JP 2004344677 A JP2004344677 A JP 2004344677A JP 2004344677 A JP2004344677 A JP 2004344677A JP 4679890 B2 JP4679890 B2 JP 4679890B2
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JP
Japan
Prior art keywords
support plate
plate
pressing plate
semiconductor wafer
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2004344677A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006156679A (ja
Inventor
淳 宮成
吉浩 稲尾
保 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
E.T.SYSTEM ENGINEERING CO., LTD.
Tokyo Ohka Kogyo Co Ltd
Original Assignee
E.T.SYSTEM ENGINEERING CO., LTD.
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by E.T.SYSTEM ENGINEERING CO., LTD., Tokyo Ohka Kogyo Co Ltd filed Critical E.T.SYSTEM ENGINEERING CO., LTD.
Priority to JP2004344677A priority Critical patent/JP4679890B2/ja
Priority to KR1020050114163A priority patent/KR101193308B1/ko
Priority to TW094141913A priority patent/TWI431679B/zh
Priority to CNB2005101285926A priority patent/CN100454481C/zh
Publication of JP2006156679A publication Critical patent/JP2006156679A/ja
Application granted granted Critical
Publication of JP4679890B2 publication Critical patent/JP4679890B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
JP2004344677A 2004-11-29 2004-11-29 サポートプレートの貼り付け装置 Active JP4679890B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004344677A JP4679890B2 (ja) 2004-11-29 2004-11-29 サポートプレートの貼り付け装置
KR1020050114163A KR101193308B1 (ko) 2004-11-29 2005-11-28 서포트플레이트의 첩부장치
TW094141913A TWI431679B (zh) 2004-11-29 2005-11-29 輔助板之貼合裝置
CNB2005101285926A CN100454481C (zh) 2004-11-29 2005-11-29 支承板的粘贴装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004344677A JP4679890B2 (ja) 2004-11-29 2004-11-29 サポートプレートの貼り付け装置

Publications (2)

Publication Number Publication Date
JP2006156679A JP2006156679A (ja) 2006-06-15
JP4679890B2 true JP4679890B2 (ja) 2011-05-11

Family

ID=36634580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004344677A Active JP4679890B2 (ja) 2004-11-29 2004-11-29 サポートプレートの貼り付け装置

Country Status (4)

Country Link
JP (1) JP4679890B2 (zh)
KR (1) KR101193308B1 (zh)
CN (1) CN100454481C (zh)
TW (1) TWI431679B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006000687B4 (de) 2006-01-03 2010-09-09 Thallner, Erich, Dipl.-Ing. Kombination aus einem Träger und einem Wafer, Vorrichtung zum Trennen der Kombination und Verfahren zur Handhabung eines Trägers und eines Wafers
KR100861109B1 (ko) 2006-12-27 2008-09-30 세메스 주식회사 기판 처리 장치 및 이를 이용한 기판 처리 방법
DE102007025380A1 (de) * 2007-05-30 2008-12-04 Robert Bürkle GmbH Mehretagen-Laminierpresse
DE502007004815D1 (de) * 2007-11-30 2010-09-30 Komax Holding Ag Heizplatte mit Hubelementen
JP5209947B2 (ja) * 2007-12-13 2013-06-12 東京応化工業株式会社 接着剤の処理方法
JP5145126B2 (ja) * 2008-06-11 2013-02-13 株式会社アルバック 接着装置及び接着方法
JP5515250B2 (ja) * 2008-07-31 2014-06-11 富士通株式会社 集塵機構および基板切断装置
JP5159566B2 (ja) * 2008-11-06 2013-03-06 リンテック株式会社 シート剥離装置および剥離方法
EP2660851B1 (de) 2009-03-18 2020-10-14 EV Group GmbH Vorrichtung und Verfahren zum Ablösen eines Wafers von einem Träger
EP2667407B1 (de) * 2009-09-01 2019-01-23 EV Group GmbH Verfahren zum Ablösen eines Produktsubstrats (z.B. eines Halbleiterwafers) von einem Trägersubstrat mittels eines Lösungsmittels und Schallwellen durch Verformung eines auf einem Filmrahmen montierten flexiblen Films
EP2523208B1 (de) 2010-04-23 2013-06-12 EV Group GmbH Lösungsmittelbehälter und Verfahren zum Lösen einer Verbindungsschicht
CN102034725B (zh) * 2010-09-30 2013-01-30 东莞宏威数码机械有限公司 基片自动对位上载装置
JP2012104518A (ja) * 2010-11-05 2012-05-31 Sumitomo Heavy Ind Ltd 封止装置の基板受け渡し機構及び封止装置の基板受け渡し方法
JP5149977B2 (ja) * 2011-04-15 2013-02-20 リンテック株式会社 半導体ウエハの処理方法
JP2014160743A (ja) * 2013-02-19 2014-09-04 Tokyo Ohka Kogyo Co Ltd 貼付装置及び貼付装置の洗浄方法
CN107331604B (zh) * 2016-04-29 2020-06-16 上海微电子装备（集团）股份有限公司 一种键合设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02123726A (ja) * 1988-11-02 1990-05-11 Mitsubishi Electric Corp ウエハ貼付装置
JPH0582493A (ja) * 1991-03-11 1993-04-02 Hitachi Ltd ウエハ接着装置およびその装置を用いたウエハの接着方法
JP2002229044A (ja) * 2000-11-30 2002-08-14 Fujitsu Ltd 貼合せ基板製造装置
JP2005109219A (ja) * 2003-09-30 2005-04-21 Shin Etsu Handotai Co Ltd 半導体貼り合わせ装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100357881B1 (ko) 1999-03-09 2002-10-25 앰코 테크놀로지 코리아 주식회사 반도체 장치의 제조장비 및 그 제어방법
JP3607143B2 (ja) * 1999-11-19 2005-01-05 株式会社タカトリ 半導体ウエハへの保護テープ貼り付け方法及び装置
JP2002192394A (ja) * 2000-12-28 2002-07-10 Mitsubishi Gas Chem Co Inc 無機基板のプレス加工法およびプレス装置
JP2003273049A (ja) * 2002-03-18 2003-09-26 Toshiba Ceramics Co Ltd ウエハの真空貼付装置
JP2004153159A (ja) * 2002-10-31 2004-05-27 Enzan Seisakusho:Kk 半導体ウェハの保護部材貼着方法及びその装置
CN100480805C (zh) * 2003-04-25 2009-04-22 富士通株式会社 贴合基板制造装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02123726A (ja) * 1988-11-02 1990-05-11 Mitsubishi Electric Corp ウエハ貼付装置
JPH0582493A (ja) * 1991-03-11 1993-04-02 Hitachi Ltd ウエハ接着装置およびその装置を用いたウエハの接着方法
JP2002229044A (ja) * 2000-11-30 2002-08-14 Fujitsu Ltd 貼合せ基板製造装置
JP2005109219A (ja) * 2003-09-30 2005-04-21 Shin Etsu Handotai Co Ltd 半導体貼り合わせ装置

Also Published As

Publication number Publication date
KR20060059825A (ko) 2006-06-02
CN1801457A (zh) 2006-07-12
CN100454481C (zh) 2009-01-21
TWI431679B (zh) 2014-03-21
TW200629395A (en) 2006-08-16
KR101193308B1 (ko) 2012-10-19
JP2006156679A (ja) 2006-06-15

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