JP2006156679A - サポートプレートの貼り付け装置 - Google Patents
サポートプレートの貼り付け装置 Download PDFInfo
- Publication number
- JP2006156679A JP2006156679A JP2004344677A JP2004344677A JP2006156679A JP 2006156679 A JP2006156679 A JP 2006156679A JP 2004344677 A JP2004344677 A JP 2004344677A JP 2004344677 A JP2004344677 A JP 2004344677A JP 2006156679 A JP2006156679 A JP 2006156679A
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- plate
- semiconductor wafer
- pressing plate
- shutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
【解決手段】 減圧チャンバー50は配管51を介して真空引き装置につながり、また一側面には搬入・搬出用の開口52が形成され、この開口52をシャッター53で開閉する。このシャッター53はシリンダユニット54にて昇降動せしめられ、上昇した位置で側方からプッシャー55にて押圧することで、シャッター53の内側面に設けたシールが開口52の周囲に密に当接し、チャンバー50内を気密に維持する。またプッシャー55を後退させシャッター53を下降させることで、開口52が開となり、この状態で搬送装置を用いてウェーハWとサポートプレート2との積層体を出し入れする。そして、チャンバー50内には前記積層体を圧着する保持台56と押圧板57が配置されている。
【選択図】 図5
Description
そして、厚さが均等でない積層体を研削すると、研削された半導体ウェーハの厚さが不均一になる。
先ず押圧板57の平行度の調整を行う。平行度を出すには、ボールジョイント72のボルトを緩めボールジョイント72をフリーの状態にする。そして、この状態のまま押圧板57を自重で下降せしめ、押圧板57の下面を保持台56の上面に当接させる。この時点で保持台56と押圧板57とは平行になる。次いで、ボルトを締め付けボールジョイント72を固定した後、押圧板57を上昇せしめる。
Claims (4)
- 半導体ウェーハ等の基板の回路形成面をサポートプレートに貼り付ける装置であって、この貼り付け装置は、真空源につながるとともに気密に閉塞可能なチャンバーを有し、このチャンバー内には、基板とサポートプレートとの積層体を載置する保持台と、この保持台に対し相対的に昇降動可能な押圧板とが配置され、この押圧板は昇降動可能な軸に取り付けられ、この軸はジョイントを介して角度調整可能に昇降体に支持されていることを特徴とするサポートプレートの貼り付け装置。
- 請求項1に記載の貼り合わせ装置において、前記押圧板はトルク(圧力)制御および位置制御されることを特徴とするサポートプレートの貼り付け装置。
- 請求項1に記載の貼り合わせ装置において、前記押圧板及び保持台の少なくとも一方にヒータが設けられていることを特徴とする貼り付け装置。
- 請求項1に記載の貼り合わせ装置において、前記押圧板及び保持台の材質をセラミックスとしたことを特徴とするサポートプレートの貼り付け装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004344677A JP4679890B2 (ja) | 2004-11-29 | 2004-11-29 | サポートプレートの貼り付け装置 |
KR1020050114163A KR101193308B1 (ko) | 2004-11-29 | 2005-11-28 | 서포트플레이트의 첩부장치 |
CNB2005101285926A CN100454481C (zh) | 2004-11-29 | 2005-11-29 | 支承板的粘贴装置 |
TW094141913A TWI431679B (zh) | 2004-11-29 | 2005-11-29 | 輔助板之貼合裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004344677A JP4679890B2 (ja) | 2004-11-29 | 2004-11-29 | サポートプレートの貼り付け装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006156679A true JP2006156679A (ja) | 2006-06-15 |
JP4679890B2 JP4679890B2 (ja) | 2011-05-11 |
Family
ID=36634580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004344677A Active JP4679890B2 (ja) | 2004-11-29 | 2004-11-29 | サポートプレートの貼り付け装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4679890B2 (ja) |
KR (1) | KR101193308B1 (ja) |
CN (1) | CN100454481C (ja) |
TW (1) | TWI431679B (ja) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100861109B1 (ko) | 2006-12-27 | 2008-09-30 | 세메스 주식회사 | 기판 처리 장치 및 이를 이용한 기판 처리 방법 |
JP2009144048A (ja) * | 2007-12-13 | 2009-07-02 | Tokyo Ohka Kogyo Co Ltd | 接着剤の処理方法 |
JP2009302178A (ja) * | 2008-06-11 | 2009-12-24 | Ulvac Japan Ltd | 接着装置及び接着方法 |
JP2010036263A (ja) * | 2008-07-31 | 2010-02-18 | Fujitsu Ltd | 集塵機構および基板切断装置 |
JP2010114244A (ja) * | 2008-11-06 | 2010-05-20 | Lintec Corp | シート剥離装置および剥離方法 |
EP2290679A1 (de) * | 2009-09-01 | 2011-03-02 | EV Group GmbH | Vorrichtung und Verfahren zum Ablösen eines Halbleiterwafers von einem Trägersubstrat |
CN102034725A (zh) * | 2010-09-30 | 2011-04-27 | 东莞宏威数码机械有限公司 | 基片自动对位上载装置 |
JP2011181941A (ja) * | 2011-04-15 | 2011-09-15 | Lintec Corp | 半導体ウエハの処理方法 |
US8443864B2 (en) | 2009-03-18 | 2013-05-21 | Ev Group Gmbh | Device for stripping a wafer from a carrier |
US8536020B2 (en) | 2006-01-03 | 2013-09-17 | Erich Thallner | Combination of a substrate and a wafer |
JP2014160743A (ja) * | 2013-02-19 | 2014-09-04 | Tokyo Ohka Kogyo Co Ltd | 貼付装置及び貼付装置の洗浄方法 |
US9272501B2 (en) | 2010-04-23 | 2016-03-01 | Ev Group Gmbh | Device for detaching a product substrate off a carrier substrate |
KR20190002626A (ko) * | 2016-04-29 | 2019-01-08 | 상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드 | 본딩 장치 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007025380A1 (de) * | 2007-05-30 | 2008-12-04 | Robert Bürkle GmbH | Mehretagen-Laminierpresse |
ES2351107T3 (es) | 2007-11-30 | 2011-01-31 | Komax Holding Ag | Placa calefactora con elementos de elevación. |
JP2012104518A (ja) * | 2010-11-05 | 2012-05-31 | Sumitomo Heavy Ind Ltd | 封止装置の基板受け渡し機構及び封止装置の基板受け渡し方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02123726A (ja) * | 1988-11-02 | 1990-05-11 | Mitsubishi Electric Corp | ウエハ貼付装置 |
JPH0582493A (ja) * | 1991-03-11 | 1993-04-02 | Hitachi Ltd | ウエハ接着装置およびその装置を用いたウエハの接着方法 |
JP2002229044A (ja) * | 2000-11-30 | 2002-08-14 | Fujitsu Ltd | 貼合せ基板製造装置 |
JP2005109219A (ja) * | 2003-09-30 | 2005-04-21 | Shin Etsu Handotai Co Ltd | 半導体貼り合わせ装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100357881B1 (ko) | 1999-03-09 | 2002-10-25 | 앰코 테크놀로지 코리아 주식회사 | 반도체 장치의 제조장비 및 그 제어방법 |
JP3607143B2 (ja) * | 1999-11-19 | 2005-01-05 | 株式会社タカトリ | 半導体ウエハへの保護テープ貼り付け方法及び装置 |
JP2002192394A (ja) * | 2000-12-28 | 2002-07-10 | Mitsubishi Gas Chem Co Inc | 無機基板のプレス加工法およびプレス装置 |
JP2003273049A (ja) * | 2002-03-18 | 2003-09-26 | Toshiba Ceramics Co Ltd | ウエハの真空貼付装置 |
JP2004153159A (ja) * | 2002-10-31 | 2004-05-27 | Enzan Seisakusho:Kk | 半導体ウェハの保護部材貼着方法及びその装置 |
JP4087385B2 (ja) * | 2003-04-25 | 2008-05-21 | 富士通株式会社 | 貼合せ基板製造装置 |
-
2004
- 2004-11-29 JP JP2004344677A patent/JP4679890B2/ja active Active
-
2005
- 2005-11-28 KR KR1020050114163A patent/KR101193308B1/ko active IP Right Grant
- 2005-11-29 CN CNB2005101285926A patent/CN100454481C/zh active Active
- 2005-11-29 TW TW094141913A patent/TWI431679B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02123726A (ja) * | 1988-11-02 | 1990-05-11 | Mitsubishi Electric Corp | ウエハ貼付装置 |
JPH0582493A (ja) * | 1991-03-11 | 1993-04-02 | Hitachi Ltd | ウエハ接着装置およびその装置を用いたウエハの接着方法 |
JP2002229044A (ja) * | 2000-11-30 | 2002-08-14 | Fujitsu Ltd | 貼合せ基板製造装置 |
JP2005109219A (ja) * | 2003-09-30 | 2005-04-21 | Shin Etsu Handotai Co Ltd | 半導体貼り合わせ装置 |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8536020B2 (en) | 2006-01-03 | 2013-09-17 | Erich Thallner | Combination of a substrate and a wafer |
US8802542B2 (en) | 2006-01-03 | 2014-08-12 | Erich Thallner | Combination of a substrate and a wafer |
US8664082B2 (en) | 2006-01-03 | 2014-03-04 | Erich Thallner | Combination of a substrate and a wafer |
KR100861109B1 (ko) | 2006-12-27 | 2008-09-30 | 세메스 주식회사 | 기판 처리 장치 및 이를 이용한 기판 처리 방법 |
JP2009144048A (ja) * | 2007-12-13 | 2009-07-02 | Tokyo Ohka Kogyo Co Ltd | 接着剤の処理方法 |
JP2009302178A (ja) * | 2008-06-11 | 2009-12-24 | Ulvac Japan Ltd | 接着装置及び接着方法 |
JP2010036263A (ja) * | 2008-07-31 | 2010-02-18 | Fujitsu Ltd | 集塵機構および基板切断装置 |
JP2010114244A (ja) * | 2008-11-06 | 2010-05-20 | Lintec Corp | シート剥離装置および剥離方法 |
US8905111B2 (en) | 2009-03-18 | 2014-12-09 | Ev Group Gmbh | Device for releasing an interconnect layer that provides connection between a carrier and a wafer |
US8603294B2 (en) | 2009-03-18 | 2013-12-10 | Ev Group Gmbh | Method for stripping a wafer from a carrier |
US8443864B2 (en) | 2009-03-18 | 2013-05-21 | Ev Group Gmbh | Device for stripping a wafer from a carrier |
WO2011026570A1 (de) * | 2009-09-01 | 2011-03-10 | Ev Group Gmbh | Vorrichtung und verfahren zum ablösen eines halbleiterwafers von einem trägersubstrat |
US9381732B2 (en) | 2009-09-01 | 2016-07-05 | Ev Group Gmbh | Device for stripping a product substrate from a carrier substrate |
JP2013504178A (ja) * | 2009-09-01 | 2013-02-04 | エーファウ・グループ・ゲーエムベーハー | 製品基板をキャリア基板から剥離するための装置及び方法 |
US9186877B2 (en) | 2009-09-01 | 2015-11-17 | Ev Group Gmbh | Method for stripping a product substrate from a carrier substrate |
US8986496B2 (en) | 2009-09-01 | 2015-03-24 | Ev Group Gmbh | Device and method for stripping a product substrate from a carrier substrate |
US8894807B2 (en) | 2009-09-01 | 2014-11-25 | Ev Group Gmbh | Device and method for detaching a semiconductor wafer from a substrate |
EP2290679A1 (de) * | 2009-09-01 | 2011-03-02 | EV Group GmbH | Vorrichtung und Verfahren zum Ablösen eines Halbleiterwafers von einem Trägersubstrat |
US9272501B2 (en) | 2010-04-23 | 2016-03-01 | Ev Group Gmbh | Device for detaching a product substrate off a carrier substrate |
US9381729B2 (en) | 2010-04-23 | 2016-07-05 | Ev Group Gmbh | Device for detaching a product substrate off a carrier substrate |
US9457552B2 (en) | 2010-04-23 | 2016-10-04 | Ev Group Gmbh | Method for detaching a product substrate off a carrier substrate |
CN102034725A (zh) * | 2010-09-30 | 2011-04-27 | 东莞宏威数码机械有限公司 | 基片自动对位上载装置 |
JP2011181941A (ja) * | 2011-04-15 | 2011-09-15 | Lintec Corp | 半導体ウエハの処理方法 |
JP2014160743A (ja) * | 2013-02-19 | 2014-09-04 | Tokyo Ohka Kogyo Co Ltd | 貼付装置及び貼付装置の洗浄方法 |
KR20190002626A (ko) * | 2016-04-29 | 2019-01-08 | 상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드 | 본딩 장치 |
US10780684B2 (en) | 2016-04-29 | 2020-09-22 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Bonding device |
KR102177305B1 (ko) * | 2016-04-29 | 2020-11-10 | 상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드 | 본딩 장치 |
Also Published As
Publication number | Publication date |
---|---|
CN100454481C (zh) | 2009-01-21 |
KR101193308B1 (ko) | 2012-10-19 |
TWI431679B (zh) | 2014-03-21 |
JP4679890B2 (ja) | 2011-05-11 |
CN1801457A (zh) | 2006-07-12 |
TW200629395A (en) | 2006-08-16 |
KR20060059825A (ko) | 2006-06-02 |
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