CN100454481C - 支承板的粘贴装置 - Google Patents
支承板的粘贴装置 Download PDFInfo
- Publication number
- CN100454481C CN100454481C CNB2005101285926A CN200510128592A CN100454481C CN 100454481 C CN100454481 C CN 100454481C CN B2005101285926 A CNB2005101285926 A CN B2005101285926A CN 200510128592 A CN200510128592 A CN 200510128592A CN 100454481 C CN100454481 C CN 100454481C
- Authority
- CN
- China
- Prior art keywords
- support plate
- pressing plate
- chamber
- semiconductor wafer
- sticker
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
Abstract
Description
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004344677 | 2004-11-29 | ||
JP2004344677A JP4679890B2 (ja) | 2004-11-29 | 2004-11-29 | サポートプレートの貼り付け装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1801457A CN1801457A (zh) | 2006-07-12 |
CN100454481C true CN100454481C (zh) | 2009-01-21 |
Family
ID=36634580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101285926A Active CN100454481C (zh) | 2004-11-29 | 2005-11-29 | 支承板的粘贴装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4679890B2 (zh) |
KR (1) | KR101193308B1 (zh) |
CN (1) | CN100454481C (zh) |
TW (1) | TWI431679B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102468191A (zh) * | 2010-11-05 | 2012-05-23 | 住友重机械工业株式会社 | 密封装置的基板交接机构及密封装置的基板交接方法 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006000687B4 (de) | 2006-01-03 | 2010-09-09 | Thallner, Erich, Dipl.-Ing. | Kombination aus einem Träger und einem Wafer, Vorrichtung zum Trennen der Kombination und Verfahren zur Handhabung eines Trägers und eines Wafers |
KR100861109B1 (ko) | 2006-12-27 | 2008-09-30 | 세메스 주식회사 | 기판 처리 장치 및 이를 이용한 기판 처리 방법 |
DE102007025380A1 (de) * | 2007-05-30 | 2008-12-04 | Robert Bürkle GmbH | Mehretagen-Laminierpresse |
ATE477921T1 (de) * | 2007-11-30 | 2010-09-15 | Komax Holding Ag | Heizplatte mit hubelementen |
JP5209947B2 (ja) * | 2007-12-13 | 2013-06-12 | 東京応化工業株式会社 | 接着剤の処理方法 |
JP5145126B2 (ja) * | 2008-06-11 | 2013-02-13 | 株式会社アルバック | 接着装置及び接着方法 |
JP5515250B2 (ja) * | 2008-07-31 | 2014-06-11 | 富士通株式会社 | 集塵機構および基板切断装置 |
JP5159566B2 (ja) * | 2008-11-06 | 2013-03-06 | リンテック株式会社 | シート剥離装置および剥離方法 |
EP2660851B1 (de) | 2009-03-18 | 2020-10-14 | EV Group GmbH | Vorrichtung und Verfahren zum Ablösen eines Wafers von einem Träger |
EP2706562A3 (de) | 2009-09-01 | 2014-09-03 | EV Group GmbH | Vorrichtung und Verfahren zum Ablösen eines Halbleiterwafers von einem Trägersubstrat mittels Kippens eines Filmrahmens |
EP2523209B1 (de) | 2010-04-23 | 2017-03-08 | EV Group GmbH | Vorrichtung und Verfahren zum Ablösen eines Produktsubstrats von einem Trägersubstrat |
CN102034725B (zh) * | 2010-09-30 | 2013-01-30 | 东莞宏威数码机械有限公司 | 基片自动对位上载装置 |
JP5149977B2 (ja) * | 2011-04-15 | 2013-02-20 | リンテック株式会社 | 半導体ウエハの処理方法 |
JP2014160743A (ja) * | 2013-02-19 | 2014-09-04 | Tokyo Ohka Kogyo Co Ltd | 貼付装置及び貼付装置の洗浄方法 |
CN107331604B (zh) * | 2016-04-29 | 2020-06-16 | 上海微电子装备(集团)股份有限公司 | 一种键合设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001148412A (ja) * | 1999-11-19 | 2001-05-29 | Takatori Corp | 半導体ウエハへの保護テープ貼り付け方法及び装置 |
US20020083849A1 (en) * | 2000-12-28 | 2002-07-04 | Kazuyuki Ohta | Method of press-working inorganic substrate and press machine therefor |
JP2004153159A (ja) * | 2002-10-31 | 2004-05-27 | Enzan Seisakusho:Kk | 半導体ウェハの保護部材貼着方法及びその装置 |
WO2004097509A1 (ja) * | 2003-04-25 | 2004-11-11 | Fujitsu Limited | 貼合せ基板製造装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH081898B2 (ja) * | 1988-11-02 | 1996-01-10 | 三菱電機株式会社 | ウエハ貼付装置 |
JPH0582493A (ja) * | 1991-03-11 | 1993-04-02 | Hitachi Ltd | ウエハ接着装置およびその装置を用いたウエハの接着方法 |
KR100357881B1 (ko) | 1999-03-09 | 2002-10-25 | 앰코 테크놀로지 코리아 주식회사 | 반도체 장치의 제조장비 및 그 제어방법 |
JP3742000B2 (ja) * | 2000-11-30 | 2006-02-01 | 富士通株式会社 | プレス装置 |
JP2003273049A (ja) * | 2002-03-18 | 2003-09-26 | Toshiba Ceramics Co Ltd | ウエハの真空貼付装置 |
JP4549648B2 (ja) * | 2003-09-30 | 2010-09-22 | 信越半導体株式会社 | 半導体貼り合わせ装置 |
-
2004
- 2004-11-29 JP JP2004344677A patent/JP4679890B2/ja active Active
-
2005
- 2005-11-28 KR KR1020050114163A patent/KR101193308B1/ko active IP Right Grant
- 2005-11-29 TW TW094141913A patent/TWI431679B/zh active
- 2005-11-29 CN CNB2005101285926A patent/CN100454481C/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001148412A (ja) * | 1999-11-19 | 2001-05-29 | Takatori Corp | 半導体ウエハへの保護テープ貼り付け方法及び装置 |
US20020083849A1 (en) * | 2000-12-28 | 2002-07-04 | Kazuyuki Ohta | Method of press-working inorganic substrate and press machine therefor |
JP2004153159A (ja) * | 2002-10-31 | 2004-05-27 | Enzan Seisakusho:Kk | 半導体ウェハの保護部材貼着方法及びその装置 |
WO2004097509A1 (ja) * | 2003-04-25 | 2004-11-11 | Fujitsu Limited | 貼合せ基板製造装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102468191A (zh) * | 2010-11-05 | 2012-05-23 | 住友重机械工业株式会社 | 密封装置的基板交接机构及密封装置的基板交接方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101193308B1 (ko) | 2012-10-19 |
TWI431679B (zh) | 2014-03-21 |
JP4679890B2 (ja) | 2011-05-11 |
CN1801457A (zh) | 2006-07-12 |
KR20060059825A (ko) | 2006-06-02 |
JP2006156679A (ja) | 2006-06-15 |
TW200629395A (en) | 2006-08-16 |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230609 Address after: Kanagawa, Japan Patentee after: Process Equipment Business Division Preparation Co.,Ltd. Patentee after: E.T. System Engineering Co.,Ltd. Address before: Kawasaki, Japan Patentee before: TOKYO OHKA KOGYO CO.,LTD. Patentee before: E.T. System Engineering Co.,Ltd. Effective date of registration: 20230609 Address after: Ibaraki Patentee after: Ameco Technology Co.,Ltd. Patentee after: E.T. System Engineering Co.,Ltd. Address before: Kanagawa, Japan Patentee before: Process Equipment Business Division Preparation Co.,Ltd. Patentee before: E.T. System Engineering Co.,Ltd. |