JP4649382B2 - 有機電界発光表示装置の製造方法 - Google Patents
有機電界発光表示装置の製造方法 Download PDFInfo
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- JP4649382B2 JP4649382B2 JP2006222068A JP2006222068A JP4649382B2 JP 4649382 B2 JP4649382 B2 JP 4649382B2 JP 2006222068 A JP2006222068 A JP 2006222068A JP 2006222068 A JP2006222068 A JP 2006222068A JP 4649382 B2 JP4649382 B2 JP 4649382B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 238000000034 method Methods 0.000 title claims description 25
- 239000000758 substrate Substances 0.000 claims description 77
- 239000012779 reinforcing material Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 230000005684 electric field Effects 0.000 claims description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000005192 partition Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 14
- 238000010304 firing Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
図1A乃至図1Fは、本発明に係る有機電界発光表示装置の製造方法を示す工程断面図である。図2A乃至図2Fは、本発明に係る有機電界発光表示装置の製造方法を示す工程順序斜視図である。
120 第1表示パネル、
130 第2表示パネル、
140 フリット
150 補強材
160 第2マザー基板
Claims (11)
- 複数の画素領域及び非画素領域を含む第1マザー基板の各画素領域に有機電界発光素子を形成する段階と、
ゲル状のフリットペーストを準備する段階と、
前記ゲル状のフリットペーストを用いて、第2マザー基板の前記各非画素領域と対応する領域にフリットを形成する段階と、
前記フリットにより前記各画素領域が封止されるように前記第2マザー基板を前記第1マザー基板に接着させる段階と、
接着された前記第1マザー基板及び前記第2マザー基板を切断して単位表示パネルに分離させる段階と、
前記単位表示パネルを、各単位表示パネルを分離させる複数のスロット及び仕切りが形成されている整列手段を用いて整列させる段階と、
前記単位表示パネルの非画素領域を補強材に浸漬させて毛細管現象により前記フリットの外側面の前記第1基板及び前記第2基板との間に前記補強材が埋め込まれる段階と、
を含むことを特徴とする、有機電界発光表示装置の製造方法。 - 前記非画素領域は、前記フリットが形成されている外側面の前記第1基板及び前記第2基板の間にあることを特徴とする、請求項1に記載の有機電界発光表示装置の製造方法。
- 前記第1基板及び前記第2基板の間に補強材を埋め込んだ後、前記補強材を硬化させる段階をさらに含むことを特徴とする、請求項1に記載の有機電界発光表示装置の製造方法。
- 前記補強材は、紫外線、自然硬化または熱工程により硬化されることを特徴とする、請求項3に記載の有機電界発光表示装置の製造方法。
- 前記補強材は、200cp以下の粘性を有する材料からなることを特徴とする、請求項1に記載の有機電界発光表示装置の製造方法。
- 前記材料は、80℃未満の温度で硬化されることを特徴とする、請求項5に記載の有機電界発光表示装置の製造方法。
- 前記材料は、アクリレイトからなることを特徴とする、請求項6に記載の有機電界発光表示装置の製造方法。
- 前記材料は、紫外線硬化されることを特徴とする、請求項5に記載の有機電界発光表示装置の製造方法。
- 前記材料は、エポキシ樹脂、アクリレイト及びウレタンアクリレイトから構成される群から選択される何れかであることを特徴とする、請求項8に記載の有機電界発光表示装置の製造方法。
- 前記第2基板を前記第1基板に接着させた後、レーザまたは赤外線を照射して前記フリットを前記第1基板に溶着させる段階をさらに含むことを特徴とする、請求項1に記載の有機電界発光表示装置の製造方法。
- 前記複数の単位表示パネルが一列に整列される段階は、前記単位表示パネルの第1基板と隣り合う単位表示パネルの第2基板とが隣接するように整列されることを特徴とする、請求項1に記載の有機電界発光表示装置の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060016857A KR100703519B1 (ko) | 2006-02-21 | 2006-02-21 | 유기 전계 발광표시장치의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007227344A JP2007227344A (ja) | 2007-09-06 |
JP4649382B2 true JP4649382B2 (ja) | 2011-03-09 |
Family
ID=37909311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006222068A Expired - Fee Related JP4649382B2 (ja) | 2006-02-21 | 2006-08-16 | 有機電界発光表示装置の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7498186B2 (ja) |
EP (1) | EP1821352A1 (ja) |
JP (1) | JP4649382B2 (ja) |
KR (1) | KR100703519B1 (ja) |
CN (2) | CN103022384A (ja) |
TW (1) | TWI328273B (ja) |
Families Citing this family (31)
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US8038495B2 (en) | 2006-01-20 | 2011-10-18 | Samsung Mobile Display Co., Ltd. | Organic light-emitting display device and manufacturing method of the same |
KR100673765B1 (ko) | 2006-01-20 | 2007-01-24 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그 제조방법 |
KR100635514B1 (ko) | 2006-01-23 | 2006-10-18 | 삼성에스디아이 주식회사 | 유기전계발광표시장치 및 그 제조방법 |
JP4624309B2 (ja) * | 2006-01-24 | 2011-02-02 | 三星モバイルディスプレイ株式會社 | 有機電界発光表示装置及びその製造方法 |
JP4456092B2 (ja) | 2006-01-24 | 2010-04-28 | 三星モバイルディスプレイ株式會社 | 有機電界発光表示装置及びその製造方法 |
US8164257B2 (en) * | 2006-01-25 | 2012-04-24 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and method of fabricating the same |
KR100688796B1 (ko) * | 2006-01-25 | 2007-03-02 | 삼성에스디아이 주식회사 | 유기전계발광 표시 장치 및 그의 제작 방법 |
KR100671641B1 (ko) * | 2006-01-25 | 2007-01-19 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시장치 및 그 제조 방법 |
KR100685853B1 (ko) | 2006-01-25 | 2007-02-22 | 삼성에스디아이 주식회사 | 유기전계발광표시장치 및 그 제조방법 |
KR100688795B1 (ko) | 2006-01-25 | 2007-03-02 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그 제조방법 |
JP4633674B2 (ja) | 2006-01-26 | 2011-02-16 | 三星モバイルディスプレイ株式會社 | 有機電界発光表示装置及びその製造方法 |
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KR100965255B1 (ko) | 2008-11-11 | 2010-06-22 | 삼성모바일디스플레이주식회사 | 유기발광 표시장치 |
JP5471035B2 (ja) * | 2009-05-26 | 2014-04-16 | ソニー株式会社 | 表示装置、表示装置の製造方法、および電子機器 |
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KR101924526B1 (ko) * | 2012-08-22 | 2018-12-04 | 삼성디스플레이 주식회사 | 유기 발광 표시장치 및 그 제조방법 |
KR101431752B1 (ko) | 2012-12-11 | 2014-08-22 | 엘지디스플레이 주식회사 | 디스플레이 장치 및 디스플레이 패널의 측면 실링 장치 |
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CN106784382B (zh) * | 2016-12-30 | 2019-04-05 | 上海天马有机发光显示技术有限公司 | 一种显示器件的封装结构及封装方法 |
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-
2006
- 2006-02-21 KR KR1020060016857A patent/KR100703519B1/ko not_active IP Right Cessation
- 2006-08-16 JP JP2006222068A patent/JP4649382B2/ja not_active Expired - Fee Related
- 2006-09-29 US US11/529,910 patent/US7498186B2/en not_active Expired - Fee Related
- 2006-12-20 TW TW095147863A patent/TWI328273B/zh not_active IP Right Cessation
-
2007
- 2007-01-29 EP EP20070101294 patent/EP1821352A1/en not_active Ceased
- 2007-02-12 CN CN2012105301523A patent/CN103022384A/zh active Pending
- 2007-02-12 CN CNA2007100840432A patent/CN101093807A/zh active Pending
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JP2002318545A (ja) * | 2001-04-20 | 2002-10-31 | Sony Corp | 表示パネルの製造方法及び製造装置 |
JP2004226880A (ja) * | 2003-01-27 | 2004-08-12 | Sharp Corp | 表示パネルおよびその製造方法 |
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Publication number | Publication date |
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CN101093807A (zh) | 2007-12-26 |
JP2007227344A (ja) | 2007-09-06 |
TWI328273B (en) | 2010-08-01 |
TW200733319A (en) | 2007-09-01 |
EP1821352A1 (en) | 2007-08-22 |
US20070194690A1 (en) | 2007-08-23 |
KR100703519B1 (ko) | 2007-04-03 |
CN103022384A (zh) | 2013-04-03 |
US7498186B2 (en) | 2009-03-03 |
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