JP4640345B2 - 電力用半導体装置 - Google Patents

電力用半導体装置 Download PDF

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Publication number
JP4640345B2
JP4640345B2 JP2007014734A JP2007014734A JP4640345B2 JP 4640345 B2 JP4640345 B2 JP 4640345B2 JP 2007014734 A JP2007014734 A JP 2007014734A JP 2007014734 A JP2007014734 A JP 2007014734A JP 4640345 B2 JP4640345 B2 JP 4640345B2
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Japan
Prior art keywords
conductor
semiconductor element
hole
solder
electrode
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JP2007014734A
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English (en)
Japanese (ja)
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JP2008182074A (ja
JP2008182074A5 (enExample
Inventor
泰成 日野
泰 中島
功治 平岡
治雄 高尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2007014734A priority Critical patent/JP4640345B2/ja
Publication of JP2008182074A publication Critical patent/JP2008182074A/ja
Publication of JP2008182074A5 publication Critical patent/JP2008182074A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2007014734A 2007-01-25 2007-01-25 電力用半導体装置 Active JP4640345B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007014734A JP4640345B2 (ja) 2007-01-25 2007-01-25 電力用半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007014734A JP4640345B2 (ja) 2007-01-25 2007-01-25 電力用半導体装置

Publications (3)

Publication Number Publication Date
JP2008182074A JP2008182074A (ja) 2008-08-07
JP2008182074A5 JP2008182074A5 (enExample) 2008-12-25
JP4640345B2 true JP4640345B2 (ja) 2011-03-02

Family

ID=39725733

Family Applications (1)

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JP2007014734A Active JP4640345B2 (ja) 2007-01-25 2007-01-25 電力用半導体装置

Country Status (1)

Country Link
JP (1) JP4640345B2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103137506A (zh) * 2011-11-25 2013-06-05 三菱电机株式会社 接合方法以及半导体装置的制造方法
DE112016005807T5 (de) 2015-12-16 2018-09-27 Mitsubishi Electric Corporation Halbleitereinheit und Verfahren zur Herstellung derselben

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011086743A (ja) * 2009-10-15 2011-04-28 Mitsubishi Electric Corp 電力用半導体装置、及び該電力用半導体装置の製造方法
JP5702937B2 (ja) 2010-03-12 2015-04-15 株式会社日立製作所 半導体装置
JP5521771B2 (ja) * 2010-05-21 2014-06-18 株式会社デンソー 半導体モジュールおよびその製造方法
JP2012069640A (ja) * 2010-09-22 2012-04-05 Toshiba Corp 半導体装置及び電力用半導体装置
JP5813963B2 (ja) 2011-02-28 2015-11-17 ローム株式会社 半導体装置、および、半導体装置の実装構造
WO2013021726A1 (ja) 2011-08-10 2013-02-14 富士電機株式会社 半導体装置および半導体装置の製造方法
JP5545306B2 (ja) * 2012-02-15 2014-07-09 株式会社デンソー 電子装置
CN104603921B (zh) 2012-09-04 2018-07-24 三菱电机株式会社 半导体装置、半导体装置的制造方法
JP5910456B2 (ja) * 2012-10-22 2016-04-27 株式会社豊田自動織機 半導体装置
JP6038280B2 (ja) 2013-03-08 2016-12-07 三菱電機株式会社 半導体装置および半導体装置の製造方法
DE112015006571T5 (de) 2015-05-26 2018-03-01 Mitsubishi Electric Corporation Verfahren zum herstellen einer halbleiteranordnung
JP6162764B2 (ja) * 2015-09-17 2017-07-12 ローム株式会社 半導体装置、および、半導体装置の実装構造
JP6721329B2 (ja) * 2015-12-21 2020-07-15 三菱電機株式会社 パワー半導体装置およびその製造方法
US10804169B2 (en) 2016-11-08 2020-10-13 Mitsubishi Electric Corporation Semiconductor device
CN108109983B (zh) * 2017-12-14 2024-05-10 常州星海电子股份有限公司 一种汽车专用整流二极管结构
JP6936310B2 (ja) * 2018-02-27 2021-09-15 新電元工業株式会社 半導体装置及び半導体装置の製造方法
JP7042651B2 (ja) * 2018-02-28 2022-03-28 三菱電機株式会社 電力用半導体装置および電力変換装置
WO2020003495A1 (ja) * 2018-06-29 2020-01-02 三菱電機株式会社 半導体装置
JP7156155B2 (ja) * 2019-04-19 2022-10-19 三菱電機株式会社 半導体モジュール
WO2021070252A1 (ja) 2019-10-08 2021-04-15 三菱電機株式会社 半導体装置
CN114556534B (zh) * 2019-10-17 2025-05-06 三菱电机株式会社 半导体装置及半导体装置的制造方法
CN118039508B (zh) * 2024-04-12 2024-06-14 无锡利普思半导体有限公司 功率模块内部连接工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58119665A (ja) * 1982-01-11 1983-07-16 Hitachi Ltd 半導体装置及びその製法
JP2003218305A (ja) * 2002-01-18 2003-07-31 Sanken Electric Co Ltd 半導体装置
JP2003318349A (ja) * 2002-04-22 2003-11-07 Nec Corp 半導体装置
JP4078993B2 (ja) * 2003-01-27 2008-04-23 三菱電機株式会社 半導体装置
JP4281050B2 (ja) * 2003-03-31 2009-06-17 株式会社デンソー 半導体装置
JP2006060106A (ja) * 2004-08-23 2006-03-02 Origin Electric Co Ltd リード部材及び表面実装型半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103137506A (zh) * 2011-11-25 2013-06-05 三菱电机株式会社 接合方法以及半导体装置的制造方法
US9087778B2 (en) 2011-11-25 2015-07-21 Mitsubishi Electric Corporation Joining method and semiconductor device manufacturing method
CN103137506B (zh) * 2011-11-25 2016-02-10 三菱电机株式会社 接合方法以及半导体装置的制造方法
DE112016005807T5 (de) 2015-12-16 2018-09-27 Mitsubishi Electric Corporation Halbleitereinheit und Verfahren zur Herstellung derselben
DE112016005807B4 (de) 2015-12-16 2024-05-08 Mitsubishi Electric Corporation Halbleitereinheit und Verfahren zur Herstellung derselben

Also Published As

Publication number Publication date
JP2008182074A (ja) 2008-08-07

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