JP7156155B2 - 半導体モジュール - Google Patents

半導体モジュール Download PDF

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JP7156155B2
JP7156155B2 JP2019080267A JP2019080267A JP7156155B2 JP 7156155 B2 JP7156155 B2 JP 7156155B2 JP 2019080267 A JP2019080267 A JP 2019080267A JP 2019080267 A JP2019080267 A JP 2019080267A JP 7156155 B2 JP7156155 B2 JP 7156155B2
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insulating
insulating plate
semiconductor
insulating substrate
semiconductor element
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JP2020178076A (ja
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祐介 石山
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2019080267A priority Critical patent/JP7156155B2/ja
Priority to US16/662,227 priority patent/US11322452B2/en
Priority to CN202010289944.0A priority patent/CN111834307A/zh
Priority to DE102020110159.7A priority patent/DE102020110159A1/de
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Description

本発明は、例えば大電流の制御に用いられる半導体モジュールに関する。
半導体素子を設けた第１及び第２の絶縁基板を上下に向かい合わせて樹脂封止した半導体モジュールにおいて、モジュール内部で半導体素子に第３の絶縁基板を接続した構成が提案されている（例えば、特許文献１参照）。
特開２０１３－３０７１０号公報
従来、モジュール内部の絶縁を行う第３の絶縁基板は、モジュール内外の絶縁を行う第１及び第２の絶縁基板と同じ絶縁耐圧に設計されていた。従って、モジュール内部の第３の絶縁基板の絶縁耐圧が必要以上に高い値になっていたため、熱伝導率が低くなって放熱性が低下し、材料費が高くなってコストが増すという問題があった。
本発明は、上述のような課題を解決するためになされたもので、その目的は放熱性を向上し、コストを低減することができる半導体モジュールを得るものである。
本発明に係る半導体モジュールは、第１の絶縁板と、前記第１の絶縁板の上方に配置された第２の絶縁板と、前記第１の絶縁板の上面に設けられた第１の半導体素子と、前記第２の絶縁板の下面に設けられた第２の半導体素子と、前記第１の絶縁板と前記第２の絶縁板の間に配置された第３の絶縁板と、前記第３の絶縁板の表面に設けられ前記第１及び第２の半導体素子に接続された導体とを有する絶縁基板と、前記第１及び第２の半導体素子と前記絶縁基板を封止する封止樹脂とを備え、前記第３の絶縁板の絶縁耐圧は前記第１及び第２の絶縁板の絶縁耐圧より低いことを特徴とする。
本発明では、モジュール内部の絶縁を行う絶縁基板の第３の絶縁板の絶縁耐圧を、モジュール内外の絶縁を行う第１及び第２の絶縁板の絶縁耐圧よりも低くする。これにより、絶縁基板の熱伝導率が高くなって放熱性が向上し、材料費を節約してコストを低減することができる。
実施の形態１に係る半導体モジュールを示す断面図である。 実施の形態１に係るモジュール内部の絶縁基板を示す上面図である。 実施の形態２に係る半導体モジュールを示す断面図である。 実施の形態２に係る半導体モジュールの変形例を示す断面図である。 実施の形態３に係る半導体モジュールを示す断面図である。 実施の形態４に係る半導体モジュールを示す断面図である。 実施の形態５に係る半導体素子と絶縁基板の接合部を拡大した断面図である。
実施の形態に係る半導体モジュールについて図面を参照して説明する。同じ又は対応する構成要素には同じ符号を付し、説明の繰り返しを省略する場合がある。
実施の形態１．
図１は、実施の形態１に係る半導体モジュールを示す断面図である。絶縁基板１は、絶縁板１ａと、絶縁板１ａの下面に設けられた導体１ｂと、絶縁板１ａの上面に設けられた導体１ｃとを有する。絶縁基板１の上方に絶縁基板２が配置されている。絶縁基板２は、絶縁板２ａと、絶縁板２ａの下面に設けられた導体２ｂと、絶縁板２ａの上面に設けられた導体２ｃとを有する。なお、本願明細書では、図１の断面図における上側の面を「上面」、下側の面を「下面」と記載する。
半導体素子３が絶縁基板１の上面に設けられている。半導体素子３の下面電極はろう材４により絶縁基板１の導体１ｃに接続されている。半導体素子５が絶縁基板２の下面に設けられている。半導体素子５の下面電極はろう材６により絶縁基板２の導体２ｂに接続されている。
絶縁基板７が絶縁基板１と絶縁基板２の間に配置されている。絶縁基板７は、絶縁板７ａと、絶縁板７ａの上下面に設けられた導体７ｂ，７ｃ，７ｄとを有する。絶縁板７ａを貫通するスルーホール８が設けられている。図２は、実施の形態１に係るモジュール内部の絶縁基板を示す上面図である。導体７ｂ，７ｃ，７ｄは絶縁板７ａの上下面において平面方向にも配線されている。
導体７ｂはスルーホール８を介して絶縁板７ａの上下面に設けられ、ろう材９を介して半導体素子３の上面電極と絶縁基板２の導体２ｂに接続されている。導体７ｃはろう材１０を介して半導体素子５の上面電極に接続されている。導体７ｄはろう材１１を介して絶縁基板１の導体１ｃに接続されている。
なお、ろう材４，６，９－１１は例えばはんだであるが、Ａｇペースト又はその他の導電性接続材でもよい。絶縁基板１，２，７は例えばプリント基板又は銅パターン付きセラミック基板などであり、多層基板であってもよい。
封止樹脂１２が半導体素子３，５と絶縁基板７を封止する。半導体素子３，５が設けられた面とは反対側にある絶縁基板１の下面と絶縁基板２の上面が封止樹脂１２から外部に露出している。半導体素子３，５の発熱によりモジュール内部の絶縁基板７の温度も上昇する。絶縁基板７はろう材９，１１と上下の絶縁基板１，２を介して冷却される。
絶縁板７ａの絶縁耐圧は絶縁板１ａ，２ａの絶縁耐圧より低い。ここで、絶縁耐圧は、絶縁板の厚みと絶縁板の絶縁耐力の積によって決まる。従って、絶縁板１ａ，２ａと絶縁板７ａの材質が同じ場合には絶縁板７ａの厚みが絶縁板１ａ，２ａより薄い。または、絶縁板１ａ，２ａと絶縁板７ａの絶縁材質が異なり、絶縁板７ａの絶縁耐力が絶縁板１ａ，２ａの絶縁耐力より低い。
以上説明したように、本実施の形態では、モジュール内部の絶縁を行う絶縁基板７の絶縁板７ａの絶縁耐圧を、モジュール内外の絶縁を行う絶縁基板１，２の絶縁板１ａ，２ａの絶縁耐圧よりも低くする。これにより、絶縁板７ａの放熱性が向上し、材料費を節約してコストを低減することができる。
また、上下に半導体素子３，５を設けることで、電力を大きくし、フットプリントを小さくすることができる。また、絶縁基板１の下面と絶縁基板２の上面を封止樹脂１２から露出するため、両面冷却により放熱性能を向上することができる。
また、一般的な半導体モジュールではワイヤにより半導体素子３，５から絶縁基板のパターン等を介して外部電極に電流を取り出す。これに対して、本実施の形態では、はんだ等のろう材により半導体素子３，５を絶縁基板７に接続するため、高面積の電流取り出しが可能である。従って、半導体素子３，５を小型化できるため、半導体モジュールも小型化できる。
実施の形態２．
図３は、実施の形態２に係る半導体モジュールを示す断面図である。本実施の形態では、実施の形態１の絶縁基板２を銅又はアルミニウム等の金属ブロック１３に変更している。金属ブロック１３は半導体素子５の上面電極に接続されている。封止樹脂１２の一部１２ａが金属ブロック１３の上面を覆っている。
図４は、実施の形態２に係る半導体モジュールの変形例を示す断面図である。図３の構成に加えて、実施の形態１の絶縁基板１を銅又はアルミニウム等の金属ブロック１４に変更している。金属ブロック１４は第１の半導体素子３の下面電極に接続されている。封止樹脂１２の一部１２ｂが金属ブロック１４の下面を覆っている。
本実施の形態では、絶縁基板１，２を使用せず、封止樹脂１２によりモジュール内外の絶縁を行うことでコストを低減できる。また、モジュール内部の絶縁を行う絶縁基板７の絶縁板７ａの絶縁耐圧を、モジュール内外の絶縁を行う封止樹脂１２の一部１２ａ，１２ｂの絶縁耐圧よりも低くする。これにより実施の形態１と同様の効果を得ることができる。なお、金属ブロック１３，１４の各々は１つだけに限らず複数個であってもよい。
実施の形態３．
図５は、実施の形態３に係る半導体モジュールを示す断面図である。本実施の形態では、半導体素子１５が絶縁基板７に設けられている。半導体素子１５の上面電極は絶縁基板７の導体７ｂにはんだ等のろう材１６により接続され、ろう材１７により絶縁基板１の導体１ｃに接続されている。このようにモジュール内部の絶縁基板７にも半導体素子１５を設けることにより半導体モジュールの高電流密度化が可能となる。その他の構成及び効果は実施の形態１と同様である。なお、実施の形態２のように絶縁基板１，２を金属ブロック１３，１４に変更してもよい。
実施の形態４．
図６は、実施の形態４に係る半導体モジュールを示す断面図である。絶縁基板１と絶縁基板７との間の隙間を確保する銅等の金属のスペーサー１８が設けられている。絶縁基板２と絶縁基板７との間の隙間を確保する銅等の金属のスペーサー１９が設けられている。スペーサー１８は絶縁基板１，７の導体１ｃ，７ｂとろう材により接続されている。スペーサー１９は絶縁基板２，７の導体２ｂ，７ｂとろう材により接続されている。
スペーサー１８，１９により隙間を確保することで、半導体素子３，５に付与される応力を低減することができる。また、封止樹脂１２の流動性を確保することもできる。なお、実施の形態２のように絶縁基板１，２を金属ブロック１３，１４に変更してもよい。
実施の形態５．
図７は、実施の形態５に係る半導体素子と絶縁基板の接合部を拡大した断面図である。実施の形態１～４の半導体モジュールにおいて、絶縁基板７の導体７ｂにろう材９との接合領域を制御するためのレジスト等の絶縁膜２０を設ける。そして、絶縁膜２０の開口面積を半導体素子３の上面電極の面積より小さくする。このように接合領域を制御することでろう材９が溶けた際に台形のような形になり、ろう材９と半導体素子３の接続面積がろう材９と絶縁基板７の導体７ｂの接続面積より大きくなる。半導体素子５と絶縁基板７の接合部も同様である。このようにろう材９の形状を制御することで、半導体素子３，５に付与される応力を低減することができる。
なお、半導体素子３，５，１５は、珪素によって形成されたものに限らず、珪素に比べてバンドギャップが大きいワイドバンドギャップ半導体によって形成されたものでもよい。ワイドバンドギャップ半導体は、例えば、炭化珪素、窒化ガリウム系材料、又はダイヤモンドである。このようなワイドバンドギャップ半導体によって形成された半導体素子は、耐電圧性や許容電流密度が高いため、小型化できる。この小型化された半導体素子を用いることで、この半導体素子を組み込んだ半導体モジュールも小型化・高集積化できる。また、半導体素子の耐熱性が高いため、ヒートシンクの放熱フィンを小型化でき、水冷部を空冷化できるので、半導体モジュールを更に小型化できる。また、半導体素子の電力損失が低く高効率であるため、半導体モジュールを高効率化できる。
１，２，７ 絶縁基板、１ａ，２ａ，７ａ 絶縁板、３，５，１５ 半導体素子、７ｂ，７ｃ 導体、９，１０ ろう材、１２ 封止樹脂、１３，１４ 金属ブロック

Claims (8)

  1. 第１の絶縁板と、
    前記第１の絶縁板の上方に配置された第２の絶縁板と、
    前記第１の絶縁板の上面に設けられた第１の半導体素子と、
    前記第２の絶縁板の下面に設けられた第２の半導体素子と、
    前記第１の絶縁板と前記第２の絶縁板の間に配置された第３の絶縁板と、前記第３の絶縁板の表面に設けられ前記第１及び第２の半導体素子に接続された導体とを有する絶縁基板と、
    前記第１及び第２の半導体素子と前記絶縁基板を封止する封止樹脂とを備え、
    前記第３の絶縁板の絶縁耐圧は前記第１及び第２の絶縁板の絶縁耐圧より低いことを特徴とする半導体モジュール。
  2. 前記第１の絶縁板を有し、下面が前記封止樹脂から露出した第１の絶縁基板と、
    前記第２の絶縁板を有し、上面が前記封止樹脂から露出した第２の絶縁基板とを更に備えることを特徴とする請求項１に記載の半導体モジュール。
  3. 前記第２の半導体素子の上面に接続された第１の金属ブロックを更に備え、
    前記第２の絶縁板は、前記第１の金属ブロックの上面を覆う前記封止樹脂の一部であることを特徴とする請求項１に記載の半導体モジュール。
  4. 前記第１の半導体素子の下面に接続された第２の金属ブロックを更に備え、
    前記第１の絶縁板は、前記第２の金属ブロックの下面を覆う前記封止樹脂の一部であることを特徴とする請求項１又は３に記載の半導体モジュール。
  5. 前記絶縁基板に設けられた第３の半導体素子を更に備えることを特徴とする請求項１～４の何れか１項に記載の半導体モジュール。
  6. 前記第１又は第２の絶縁板と絶縁基板との間の隙間を確保するスペーサーを更に備えることを特徴とする請求項１～５の何れか１項に記載の半導体モジュール。
  7. 前記第１又は第２の半導体素子を前記絶縁基板の前記導体に接続するろう材を更に備え、
    前記ろう材と前記第１又は第２の半導体素子の接続面積は、前記ろう材と前記絶縁基板の前記導体の接続面積より大きいことを特徴とする請求項１～６の何れか１項に記載の半導体モジュール。
  8. 前記第１及び第２の半導体素子はワイドバンドギャップ半導体によって形成されていることを特徴とする請求項１～７の何れか１項に記載の半導体モジュール。
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