DE102020110159A1 - Halbleitermodul - Google Patents

Halbleitermodul Download PDF

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Publication number
DE102020110159A1
DE102020110159A1 DE102020110159.7A DE102020110159A DE102020110159A1 DE 102020110159 A1 DE102020110159 A1 DE 102020110159A1 DE 102020110159 A DE102020110159 A DE 102020110159A DE 102020110159 A1 DE102020110159 A1 DE 102020110159A1
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Germany
Prior art keywords
insulating
insulating plate
insulating substrate
semiconductor
semiconductor device
Prior art date
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Pending
Application number
DE102020110159.7A
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German (de)
English (en)
Inventor
Yusuke ISHIYAMA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE102020110159A1 publication Critical patent/DE102020110159A1/de
Pending legal-status Critical Current

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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H01L2924/014—Solder alloys

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE102020110159.7A 2019-04-19 2020-04-14 Halbleitermodul Pending DE102020110159A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019080267A JP7156155B2 (ja) 2019-04-19 2019-04-19 半導体モジュール
JP2019-080267 2019-04-19

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Publication Number Publication Date
DE102020110159A1 true DE102020110159A1 (de) 2020-10-22

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US (1) US11322452B2 (ja)
JP (1) JP7156155B2 (ja)
DE (1) DE102020110159A1 (ja)

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Publication number Priority date Publication date Assignee Title
EP4290574A1 (en) * 2022-06-09 2023-12-13 Mitsubishi Electric R&D Centre Europe B.V. Power module with integrated power boards and pcb busbar

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Publication number Priority date Publication date Assignee Title
JP5365627B2 (ja) * 2008-04-09 2013-12-11 富士電機株式会社 半導体装置及び半導体装置の製造方法
US20120228757A1 (en) 2009-11-25 2012-09-13 Toyota Jidosha Kabushiki Kaisha Cooling structure of semiconductor device
JP2012004282A (ja) * 2010-06-16 2012-01-05 Mitsubishi Electric Corp 半導体装置
JP2013030710A (ja) * 2011-07-29 2013-02-07 Sanyo Electric Co Ltd 半導体モジュール
JP5791670B2 (ja) * 2013-08-02 2015-10-07 株式会社日立製作所 電力変換装置
DE112014001487B4 (de) * 2013-10-03 2021-03-04 Fuji Electric Co., Ltd. Halbleitermodul
JP2015170785A (ja) * 2014-03-10 2015-09-28 三菱電機株式会社 絶縁基板および電力用半導体装置
JP6207460B2 (ja) * 2014-05-19 2017-10-04 三菱電機株式会社 半導体装置
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